New Equipment | Wave Soldering
Suitable for welding of THT, SMD device, streamline design, beautiful, convenient maintenance and maintenance. preheating zone and filtration system adopts direct pull type module design, convenient maintenance and maintenance. preheating zone,
Electronics Forum | Thu Jul 31 15:41:23 EDT 2003 | davef
Q: Could any of you guys tell me what exactly is this greenish thing ? A: No, but is not copper oxide. Copper oxide is brown, the color of a penny [here in the US] or an untreated copper laminated trace on a board. Many copper salts are greenish in
Electronics Forum | Mon Aug 29 08:44:57 EDT 2016 | jrrt_williams
As an OEM repiar tech I would run into "Black Pad" on occasion, though mostly on surface mount pads. The only way I could remove the oxidation was to apply water soluble flux and add solder, then wick away the excess. This left me with a suitable s
Industry News | 2018-10-18 09:25:57.0
about wave soldering machine tin pot
Industry News | 2011-07-27 22:21:43.0
Krayden, Inc., a leading distributor of engineered materials, debuts the Dow Corning 170 low-cost, silicone-based elastomer.
Parts & Supplies | Assembly Accessories
SPACER MTNK000242AA ASL-328E GROMMET MTNK000283AA C-30-NG-79-G-EP-UL GROMMET MTNK000474AA C-30-NG-79-J-EP-UL BOLT N510000323AA Hexagon socket button head screw M3X6 Steel Black oxide finish 12.9 SPACER MTNK000653AA CL-404E BOLT N510017517AA
Parts & Supplies | Assembly Accessories
M8X10-10.9 A2J (Trivalent) JOINT N510066458AA KQ2L06-02AS ORIFICE-RING N210157884AB BRACKET N210201229AC SWITCH N510037368AA S D4N-1122 JOINT KXF06F4AA00 53015030-WM Feeder Cart Guide(Front Side):NPM-W N610120771AA BRACKET N210153442AA
Technical Library | 2013-12-27 10:39:21.0
The head-in-pillow defect has become a relatively common failure mode in the industry since the implementation of Pb-free technologies, generating much concern. A head-in-pillow defect is the incomplete wetting of the entire solder joint of a Ball-Grid Array (BGA), Chip-Scale Package (CSP), or even a Package-On-Package (PoP) and is characterized as a process anomaly, where the solder paste and BGA ball both reflow but do not coalesce. When looking at a cross-section, it actually looks like a head has pressed into a soft pillow. There are two main sources of head-in-pillow defects: poor wetting and PWB or package warpage. Poor wetting can result from a variety of sources, such as solder ball oxidation, an inappropriate thermal reflow profile or poor fluxing action. This paper addresses the three sources or contributing issues (supply, process & material) of the head-in-pillow defects. It will thoroughly review these three issues and how they relate to result in head-in pillow defects. In addition, a head-in-pillow elimination plan will be presented with real life examples will be to illustrate these head-in-pillow solutions.
Career Center | Corpus Christi, Texas USA | Engineering,Production
Improve and expand capabilities related to thin film sputtering/CVD deposition as required by Operations and the Business Unit. This position reports directly to the Engineering Manager. Responsibilities: Continuous improvement of sputtered th
Blackfox Training Institute, LLC | https://www.blackfox.com/blackfox-how-to-make-a-printed-circuit-board-at-home/
) plastic coated wire glossy paper pencil permanent black marker blade cutter sandpaper paper towels cotton ball pliers or spatula rubber gloves plastic box water To make your PCB: 1
ORION Industries | http://orionindustries.com/pdfs/formex.pdf
FORMEX GK/FORMEX FLAME RETARDANT POLYPROPYLENE DATA SHEET TEST METHOD FORMEX-10 FORMEX GK-10 FORMEX GK-17 FORMEX GK-30 FORMEX GK-40 COLOR NATURAL NATURAL/BLACK NATURAL/BLACK NATURAL/BLACK NATURAL/BLACK THICKNESS-INCH .010 + .003/ –.0015 .010 + .003/ –.0015 .017 + .003/ –.001 .030 ± .002 .040
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