CNC bronze working parts Tolerance: +/-0.1 ~ 0.005mm/as demand Finish: Anodizing, colored, black Oxide, heat treatment, Chromate, Coatings, Laser Engraving, passivating, plating and more. CNC turning parts can be CNC brass parts, steel stainless p
New Equipment | Cable & Wire Harness Equipment
Brass machining parts Customized machining parts with brass material, like brass machine screws, brass machined parts, copper machining parts like: CNC bike parts, CNC brass turned parts, CNC medical parts, CNC custom machining, CNC auto parts and
Electronics Forum | Thu Jul 31 15:41:23 EDT 2003 | davef
Q: Could any of you guys tell me what exactly is this greenish thing ? A: No, but is not copper oxide. Copper oxide is brown, the color of a penny [here in the US] or an untreated copper laminated trace on a board. Many copper salts are greenish in
Electronics Forum | Mon Aug 29 08:44:57 EDT 2016 | jrrt_williams
As an OEM repiar tech I would run into "Black Pad" on occasion, though mostly on surface mount pads. The only way I could remove the oxidation was to apply water soluble flux and add solder, then wick away the excess. This left me with a suitable s
Industry News | 2018-10-18 09:25:57.0
about wave soldering machine tin pot
Industry News | 2011-07-27 22:21:43.0
Krayden, Inc., a leading distributor of engineered materials, debuts the Dow Corning 170 low-cost, silicone-based elastomer.
Parts & Supplies | Assembly Accessories
SPACER MTNK000242AA ASL-328E GROMMET MTNK000283AA C-30-NG-79-G-EP-UL GROMMET MTNK000474AA C-30-NG-79-J-EP-UL BOLT N510000323AA Hexagon socket button head screw M3X6 Steel Black oxide finish 12.9 SPACER MTNK000653AA CL-404E BOLT N510017517AA
Parts & Supplies | Assembly Accessories
M8X10-10.9 A2J (Trivalent) JOINT N510066458AA KQ2L06-02AS ORIFICE-RING N210157884AB BRACKET N210201229AC SWITCH N510037368AA S D4N-1122 JOINT KXF06F4AA00 53015030-WM Feeder Cart Guide(Front Side):NPM-W N610120771AA BRACKET N210153442AA
Technical Library | 2013-12-27 10:39:21.0
The head-in-pillow defect has become a relatively common failure mode in the industry since the implementation of Pb-free technologies, generating much concern. A head-in-pillow defect is the incomplete wetting of the entire solder joint of a Ball-Grid Array (BGA), Chip-Scale Package (CSP), or even a Package-On-Package (PoP) and is characterized as a process anomaly, where the solder paste and BGA ball both reflow but do not coalesce. When looking at a cross-section, it actually looks like a head has pressed into a soft pillow. There are two main sources of head-in-pillow defects: poor wetting and PWB or package warpage. Poor wetting can result from a variety of sources, such as solder ball oxidation, an inappropriate thermal reflow profile or poor fluxing action. This paper addresses the three sources or contributing issues (supply, process & material) of the head-in-pillow defects. It will thoroughly review these three issues and how they relate to result in head-in pillow defects. In addition, a head-in-pillow elimination plan will be presented with real life examples will be to illustrate these head-in-pillow solutions.
Career Center | Corpus Christi, Texas USA | Engineering,Production
Improve and expand capabilities related to thin film sputtering/CVD deposition as required by Operations and the Business Unit. This position reports directly to the Engineering Manager. Responsibilities: Continuous improvement of sputtered th
