Industry Directory | Manufacturer
Nitrogen Cast Lead Free solder Manufacturer, complete range of No Clean and No Residue fluxes Misprint Cleaning Systems completely compressed air driven low cost with no need for electrics 18x12
Industry Directory | Manufacturer
professional manufacturer of pcb
New Equipment | Fabrication Services
Multilayer PCB's ACI manufactures a wide variety of Multilayer PCB's for various applications spanning numerous industries and technologies. We can build your high layer count PCB's using a wide variety of high speed low loss materials from epoxies
New Equipment | Assembly Services
TW-HDI PCB 0245 Price: Get Latest Price Minimum Order Quantity: 10 Unit/Units other Port: HK Packaging Details: blister and package Delivery Time: 1 week Payment Terms: L/C,D/P,T/T,Western Union Supply Ability: 5000000 Unit/Units per Year o
Electronics Forum | Fri Jun 08 17:22:51 EDT 2007 | naynayno
We have been producing an IMS assembly with SMT dpak's for some time. However, we recently encountered a new problem by chance - the parts can be flicked off with a finger nail. I state by chance because the solder joints are wetted and shiny with
Electronics Forum | Mon Dec 30 12:36:20 EST 2019 | emeto
Thanks Rob, this is excelent
Used SMT Equipment | Pick and Place/Feeders
Mydata MY19 Package - Will Sell Via Auction. Please see www.xlineassets.com for details. Mydata MY19 Pick and Place System With Magazines, Feeders, and TEX Tray Loader. Serial # 19162, Auto Conveyor System, Hydra and Midas Head, Two Pole Test O
Used SMT Equipment | Pick and Place/Feeders
Mydata MY19 With Agilis Feeders/Magazines Specs: Mydata MY19 Package - Will Sell Via Auction. Please see www.xlineassets.com for details. Mydata MY19 Pick and Place System With Magazines, Feeders, and TEX Tray Loader. Serial # 19162, Auto Conve
Industry News | 2013-09-26 18:03:10.0
IPC — Association Connecting Electronics Industries® invites researchers, technical experts and industry leaders to submit abstracts for poster presentations at IPC APEX EXPO®, the industry’s premier conference and exhibition for printed board design and manufacturing, electronics assembly and test, March 25–27, 2014 at the Mandalay Bay Convention Center, Las Vegas, Nevada.
Industry News | 2017-09-19 17:02:13.0
IPC — Association Connecting Electronics Industries® invites researchers, technical experts and industry leaders to submit abstracts for poster presentations at IPC APEX EXPO®, the industry’s premier conference and exhibition for printed board design and manufacturing, electronics assembly and test. Poster presentations are scheduled for Wednesday, February 28, 2018, and will be displayed throughout the event, offering additional visibility.
Parts & Supplies | Pick and Place/Feeders
Available in stock. Quick shipping; Any interesting, feel free to contact via mail: yzfs1968@aliyun.com, Mobile: +86-13501595476 Parts for the Assembleon AX TTF feeder, below parts are also available. 9498 396 02376 TTF peel of
Parts & Supplies | Adhesive Dispensers
Genuine MYDATA parts Brand New; Used( good condition). Available in stock. Quick shipping; Any interesting, feel free to contact via mail: yzfs1968@aliyun.com, Mobile: +86-13501595476 The parts for Mycronic jetting machines(MY500,MY600,
Technical Library | 2020-09-02 22:02:13.0
With the adoption of Wafer Level Packages (WLP) in the latest generation mobile handsets, the Printed Circuit Board (PCB) industry has also seen the initial steps of High Density Interconnect (HDI) products migrating away from the current subtractive processes towards a more technically adept technique, based on an advanced modified Semi Additive Process (amSAP). This pattern plate process enables line and space features in the region of 20um to be produced, in combination with fully filled, laser formed microvias. However, in order to achieve these process demands, a step change in the performance of the chemical processes used for metallization of the microvia is essential. In the electroless Copper process, the critical activator step often risks cross contamination by the preceding chemistries. Such events can lead to uncontrolled buildup of Palladium rich residues on the panel surface, which can subsequently inhibit etching and lead to short circuits between the final traces. In addition, with more demands being placed on the microvia, the need for a high uniformity Copper layer has become paramount, unfortunately, as microvia shape is often far from ideal, the deposition or "throw" characteristics of the Copper bath itself are also of critical importance. This "high throwing power" is influential elsewhere in the amSAP technique, as it leads to a thinner surface Copper layer, which aids the etching process and enables the ultra-fine features being demanded by today's high end PCB applications. This paper discusses the performance of an electroless Copper plating process that has been developed to satisfy the needs of challenging amSAP applications. Through the use of a radical predip chemistry, the formation, build up and deposition of uncontrolled Pd residues arising from activator contamination has been virtually eradicated. With the adoption of a high throwing power Copper bath, sub 30um features are enabled and microvia coverage is shown to be greatly improved, even in complex via shapes which would otherwise suffer from uneven coverage and risk premature failure in service. Through a mixture of development and production data, this paper aims to highlight the benefits and robust performance of the new electroless Copper process for amSAP applications
The first technology to use centrifugal energy to clean electronic circuit assemblies, precision parts, and semiconductor packages. The system offers unparalleled penetration, solubilization, and contaminant removal The MicroCel Centrifugal Cleanin
Demonstration of BGA rework via stencil printing. BEST's StikNPeel stencil is an adhesive backed stencil which allows users to stick the stencil in to place and simply peel it off the PCB with a temporary adhesive system. This leaves consistent print
Events Calendar | Mon Apr 23 00:00:00 EDT 2018 - Thu Apr 26 00:00:00 EDT 2018 | Shanghai, China
SMTA China East Conference 2018
Events Calendar | Tue Apr 13 00:00:00 EDT 2021 - Tue Apr 13 00:00:00 EDT 2021 | ,
Boston Chapter Webinar: Cleaning Chemistry For PWB and Rework - Part 2, session 1
Career Center | Alta Loma, California | Engineering,Quality Control,Research and Development
Rigid and Flexible Printed Circuits Plating and Metal Finishing Operations Six Sigma Work Instruction Documentation Process Development Equipment Selection and Specification New Facility Startup Air, Water and Hazardous Waste Environmental Reporting
Career Center | Toronto, Ontario Canada | Production,Quality Control,Technical Support
HIGHLIGHTS OF QUALIFICATIONS • Over 5 years of experience working as a Technical Support person, Onsite Technician in maintenance and operation of business environment to support business such as inventory of equipments and supplies as well as softw
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/polymer-processing-systems/information/prevent-black-specks-in-your-lens-products
Prevent black specks in your lens products Polymer Processing Systems BKG - EDI Corporate | Global Directory | Languages Division Only All of Nordson Home Products Applications Blow Molding Blown Film Cast Film Compounding Extrusion Coating and Laminating Fiber and Filaments Fluid Coating Foaming Hot Melt
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/ipc7093a-btc-qfn-solder-mask-defined-thermal-pad_topic2154_post11220.html
. The Black lines are Legend outlines. The Black dots are the via holes. Dimensional Details: QFN Pattern with 0.10 mm (4 mil) Paste Mask: Space the vias evenly
