Industry Directory | Manufacturer
XPCB is a PCB manufacturer with superior expertise in multilayer rigid-flex PCB and flex PCB, supporting special technology including VIPPO, stacked vias, buried vias, blind vias, unsymmetrical structure, and air gap structure.
Industry Directory | Manufacturer
blind rivets,stainless steel cable ties,blind nuts,blind riveting tools,fasteners
New Equipment | Education/Training
This specification covers qualification and performance of rigid PCBs including with or without plated-through holes, single-sided, double-sided, multilayer with or without blind/buried vias and metal core boards. It addresses final finish and surfac
New Equipment | Education/Training
IPC A-600H Acceptability of Electronic Assemblies. The IPC-A-600, "Acceptability of Printed Boards " is the most widely used published specification on printed wiring boards. This specification has set the standard for rigid printed boards in terms o
Electronics Forum | Thu Feb 15 12:32:14 EST 2007 | Eric D
one of my customer areworried about the flux risidue in the blind vias, or if the plug the vias and there is air trapped the plug will blow during our process. Appreciate for your response
Electronics Forum | Thu Feb 15 13:49:10 EST 2007 | russ
only plug one side, you can definitely blow out during reflow process with a sealed via/ it is impossible for flux to be trapped in a blind via. Russ
Used SMT Equipment | AOI / Automated Optical Inspection
Non-blind spot digital 8 projection moiré 3D inspection technology Inspection for diffuse reflection component, OCR, micro crack precisely by 8 phases coaxial color lighting Smallest componentinspection by ultra-high resolution camer
Used SMT Equipment | Pick and Place/Feeders
Dispenser KD-775 Characteristic: Rationalization of HLC Control Production &n
Industry News | 2003-02-27 08:22:44.0
Circatex is to open its first satellite office in mainland Europe in France.
Industry News | 2023-11-13 12:28:17.0
MIRTEC announces the development of groundbreaking inspection technologies that it will unveil at productronica 2023, scheduled to take place Nov. 14-17 at the Messe München in Munich, Germany. The new systems address critical challenges in 3D inspection performance of solder joints, inspection speed for tall component inspections, and measurement range limitations, offering manufacturers the perfect solution for enhanced quality and productivity.
Parts & Supplies | SMT Equipment
Original Smt spare parts JUKI 40053181 775 TEMPERATURE BLIND CONTROLLER HD00176000 JUKI Nozzle Specifications: Brand Name JUKI TEMPERATURE BLIND CONTROLLER Part Number 40053181 Model Number HD00176000 Ensure Tested buy juki Guarantee 1 mont
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Parts & Supplies | Pick and Place/Feeders
FUJI - NOZZLE Dummy Nozzle 2AGKXE0005 There are also other FUJI spare parts for you ! CSSY0100 PLATE CSSY0110 TUBE CSSY0342 BKT CSSY0330 . CSSY0290 BKT WSY4318 SLIDE,Y-AXIS WSY4321 BALLSCREW CSSY0222 BKT,MOTOR WSY4340 COVER,BEARING WSY435
Technical Library | 2013-03-07 18:25:36.0
The market for high-layer-count printed circuit boards (PCB) containing blind and buried vias was once relatively small, and focused on specialized applications in the military and high end computing. The demand for these types of PCBs today is being driven by an increasing number of commercial applications in the telecommunications and semiconductor test market segments. These applications typically require high-aspect-ratio plated-through-holes (PTHs) and blind and buried vias in order to meet the applications interconnect density requirements. Blind and buried vias and high aspect ratio PTHs continue to present manufacturing challenges and frequently are the limiting features to achieving high fabrication yield... First published in the 2012 IPC APEX EXPO technical conference proceedings
Technical Library | 2019-01-03 21:34:41.0
With the increase of labor costs, the popularity of automated production lines, • Antistatic ic tubes, connector shipping tubes, power module shipping tubes, LED shipping tubes, relay shipping tubes and other electronic components tubes are also becoming more widely used. Many small companies blindly pursue low-priced packaging materials, and there is no requirement for quality. When it is later discovered that the parts are stuck in the packaging process, they will regret it when they crush the parts during transportation. Shenzhen Sewate Technology Co., Ltd. tells you about six ways to identify quality packaging tubes.
This video describes the IPC A-600 training and certification program. The IPC A-600 specification is a set of acceptability specifications for printed circuit boards. These standards determine the acceptance and reject criteria for printed wiring bo
With the development of miniaturization of assembly components, the layout area and pattern design area of PCBs have also been continuously reduced, and PCB manufacturers are constantly updating the production process to conform to the development tr
Training Courses | | | IPC-6012 Specialist (CIS)
The Certified IPC-6012 Specialist (CIS) training covers design, fabrication and inspection of rigid printed boards.
Training Courses | | | IPC-6012 Trainer (CIT)
The Certified IPC-6012 Trainer (CIT) courses recognize individuals as qualified trainers in the area of design, fabrication and inspection of rigid printed boards and prepare them to deliver Certified IPC-6012 Specialist (CIS) training.
Career Center | , | Production
Position Description: Wave Solder Operator Reports to: Production Manager Department: Manufacturing Job Description: Wave Solder Operator Responsibilities: � Operate wave-soldering machine. � Insure that established process c
Career Center | Dana Point, California USA | Sales/Marketing
We are currently seeking sales reps nationwide for this rapidly growing supplier of printed circuit boards (since 1986)with facilities in southern CA and eight PCB facilities in China and Taiwan, all ISO 9002 certified and UL94V-0 approved, some are
Career Center | Erode, Tamilnadu India | Engineering
Professional Summary 3+ years of experience in the PCB CAM engineering Exposure to FRONTLINE GENESIS 2000 Having exposure in UCAM Exposure to Create, Array & Panelize it for manufacturability Experienced in Creating impedance cou
SMTnet Express March 7, 2013, Subscribers: 26214, Members: Companies: 13311, Users: 34412 PTH Core-to-Core Interconnect Using Sintered Conductive Pastes The market for high-layer-count printed circuit boards (PCB) containing blind and buried vias
Imagineering, Inc. | https://www.pcbnet.com/capabilities/assembly/technology-roadmap/
• Inner Layer - 10 oz • Inner Layer - 16 oz Buried/Blind Via 10+N+10 (HDI) Plasma Desmear Yes Outline Tolerance +/-.004 Surface Finish • HASL • ENIG • Immersion Silver • OSP (ENTEK) • Carbon • Immersion Tin • Electrolyic Gold • ENEPIG • ENIPIG Impeadance Control
