Electronics Forum | Mon Jan 10 19:47:30 EST 2022 | goldendragon
Hello Team, Do you have blower fan (JF1F071N) for Heller 1500 and Heller 1809 model? I'd like to get some. Appreciates!!!
Electronics Forum | Mon Jan 17 15:17:42 EST 2022 | goldendragon
Thank you.
Used SMT Equipment | Soldering - Reflow
Edge Rail and Mesh Belt Air 9 Heated zones 480V Condition: Complete and Operational- All blowers replaced in 2016! Location and Shipping: USA / FOB Origin Availability: Immediate for purchase
Used SMT Equipment | Soldering - Reflow
Heller 1810MK5 Reflow Oven Available (Same Footprint as 1809 Series Ovens (183" Length) Ultra low Power Consumption Vintage: July, 2019 (10) Zone Top/Bottom Heat (2) Cooling Zones Mesh Conveyor Edge Rail With Chain Oilers Gen5 Waterless Cooling and S
Industry News | 2019-12-09 14:44:26.0
The SMT Reflow Soldering Equipment (Global) award was awarded to Heller Industries by Frost & Sullivan.
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Parts & Supplies | Pick and Place/Feeders
HELLER Blower .R2E140-AQ03-12-TOP 1.Quality and package:Each part is checked and tested strictly by our professional QC, make sure each product is in good quality and working condition. Meanwhile each package would be well packed and protected by t
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Parts & Supplies | Pick and Place/Feeders
HELLER - SPARE PARTS HC1 TEMPRERATURE CONTROLLER .HC1 Rotary Encoder Heller ..E40H12-200-6-L-B Motor for Heller oven ..86YSY80-2 HEATER OF HELLER ..HEATER OF HELLER Reflow Heller Heater ..HL-255 Heller Motor JF1F071N Encoder
Technical Library | 2023-01-17 17:50:59.0
Heller's new Condenser Tube Flux Recovery System is designed to provide more efficient flux collection than earlier Heller flux collection systems; while providing minimal down time for inspection and cleaning. The entire system easily fits within the rear of the top shell of an 1800-EXL oven. The system utilizes a different set of top shell caps specially designed to provide the best serviceability of both the flux collection system and maintenance of the heater zone blower motors.
General curing, die attach curing, underfill curing, film & tape bonding, wafer laminating.
