Electronics Forum | Thu Mar 10 10:06:08 EST 2005 | steve
OK all you Gurus here's one for ya. Customer is tinning wires with standard eutectic solder in a solder pot. There is a blue tint to the solder in the pot. After tinning with OA flux, which I will change to NC shortly, he has clear teflon insulation
Electronics Forum | Thu Mar 10 13:05:41 EST 2005 | patrickbruneel
This phenomenon is caused by a high amount of halogens (Cl, Br etc.) used in the flux activators or in the flux surfactants. We've seen effects creating all colors of the rainbow. Changing to No-Clean (halide-free) will eliminate this color effect.
Used SMT Equipment | Soldering Equipment/Fluxes
Precision Batch Semiconductor Dispenser by Nordson Asymtek, as new. Nordson Asymtek DS-S-820 product information. Motion System Type: Brushless DC servo motors, closedloop with precision encoder feedback Encoder resolution: 10 microns X-Y
Industry News | 2012-12-19 10:02:05.0
We are proud to announce the addition of Henkel electronic manufacturing materials such solder wire, solder paste, and adhesives.
Industry News | 2009-07-28 12:23:26.0
In a breakthrough for emerging package-on-package (POP) device processes, Henkel has developed Multicore® TFN700B™, a new no-clean, halide-free tacky flux material formulated specifically for today’s challenging POP applications.
Parts & Supplies | Pick and Place/Feeders
SMT basic process components include: silk screen (or dispensing), placement (curing), reflow soldering, cleaning, testing, repair 1, silk screen: its role is to paste or patch solder paste printed on the PCB pad, the components f
Parts & Supplies | Repair/Rework
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Technical Library | 2020-12-29 20:55:46.0
Voiding in solder joints has been studied extensively, and the effects of many variables compared and contrasted with respect to voiding performance. Solder paste flux, solder powder size, stencil design, circuit board design, via-in-pad design, surface finish, component size, reflow profile, vacuum reflow, nitrogen reflow and other parameters have been varied and voiding quantified for each. The results show some differences in voiding performance with respect to most of these variables but these variables are not independent of each other. Voiding in solder joints is a complex issue that often requires multiple approaches to reduce voiding below required limits. This paper focuses on solutions to voiding for commonly used bottom terminated components (BTCs).
With the Spectrum II's new Precision Z-axis, smaller dots and thinner solder paste lines can be achieved. This capability is standard on all Spectrum II systems and replaces the Precision Z option on the older Axiom products. In order to achieve su
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