Electronics Forum: bond detachment (2)

Re: stencil epoxy debonding

Electronics Forum | Tue May 02 14:19:26 EDT 2000 | Bill Schreiber

There are two primary causes of epoxy adhesive bond failure, heat and over exposure to moisture. Ultrasonic cavitation is a only a mechanical "scrubbing" action on a microscopic level. However, if the adhesive bond is week or has small areas of det

Re: PCB fab supplier supplier/evaluation

Electronics Forum | Sun Aug 08 11:15:32 EDT 1999 | Earl Moon

| | Mike, | | | | Got your message and those of others concerning PCB fab supplier evaluation and qualification check lists, etc. I have a severe problem here in WI as I can hardly access the internet, and when I do it is cut off abruptly for no goo

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Industry News: bond detachment (4)

Inspecting In Three Dimensions

Industry News | 2013-09-10 15:43:26.0

HARTING AG is increasingly using 3-D molded interconnect device (MID) technology for its customers in the automotive and medical technology sectors who demand very high quality.

Viscom AG

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Express Newsletter: bond detachment (134)

SMT Express, Volume 2, Issue No. 9 - from SMTnet.com

SMT Express, Volume 2, Issue No. 9 - from SMTnet.com Volume 2, Issue No. 9 Thursday, September 14, 2000 Featured Article Return to Front Page Book Review Reviewed by Dave Fish (davef ), Pandion Electronics, Inc Title: Wire Bonding

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