Epoxy 4089 is a single part, epoxy adhesive used for bonding SMT components to a PWB prior to double sided reflow or wave solder assembly. Epoxy 4089 has been formulated for use in all types of high speed dispensing equipment including air pressure,
Henkel’s line of Loctite Hysol® and Loctite Eccobond™ encapsulants are primarily used to ensure environmental protection and boost the mechanical strength of wire bonded devices. They are developed to provide protection to wire bonds, leads and alumi
Electronics Forum | Mon Jul 27 17:38:55 EDT 1998 | Steve Gregory
Hi Stoney, Justin is giving you some good advice, unfortunately these kinda' problems sometimes call for the ol' D.O.E...otherwise, you could be chasing your tail for a while until you figure out exactly what's causing your problems. Has the ep
Electronics Forum | Tue Jul 28 09:22:16 EDT 1998 | Justin Medernach
| Hi Stoney, | Justin is giving you some good advice, unfortunately these kinda' problems sometimes call for the ol' D.O.E...otherwise, you could be chasing your tail for a while until you figure out exactly what's causing your problems. | Has
Industry News | 2010-06-21 14:39:59.0
Christopher Associates Inc. will be exhibiting at Intersolar North America 2010 in San Francisco’s Moscone Center West Hall from July 13-15, Level 3, booth 9247. The company will display a comprehensive portfolio of new technologies.
Industry News | 2017-05-01 05:11:48.0
The Balver Zinn Group announces that it will exhibit in Hall 4, Booth #231 at SMT Hybrid Packaging scheduled to take place May 16-18 in Nuremberg, Germany. The Balver Zinn Group will highlight the company’s latest products, technologies and services.
SMT Express, Volume 2, Issue No. 9 - from SMTnet.com Volume 2, Issue No. 9 Thursday, September 14, 2000 Featured Article Return to Front Page Book Review Reviewed by Dave Fish (davef ), Pandion Electronics, Inc Title: Wire Bonding
