Industry Directory | Manufacturer
A US manufacturer of quality hand tools for those engaged in the repair, rework, R & D, testing, and assembly of electronic components and printed circuit boards from Through Hole to 2Mil Pitch Surface Mount.
Industry Directory | Distributor / Equipment Dealer / Broker / Auctions
Electronic Component Distribution has a wide-ranging inventory of electronic items. We are Board Level Components and Electronic Part Types supplier in the USA.
Volumetric Dispense Pump - PCD Technology revolutionizes how you dispense and how you perceive dispensing. PCD - Progressive Cavity Displacement PCD is a continuously volumetric dispense pump based on the Progressive Cavity principle. PCD technolog
Eliminate Body Stress with Versatile CF-8 GPD's CF-8 eliminates component body stress. Versatility is the key word for the CF-8. Simple tooling changes make short or long run production jobs quick and easy. Capabilities Meets exacting military s
Electronics Forum | Wed Nov 07 18:37:27 EST 2001 | steven
sometime hand solder can cause also. no necessary have to be paste n reflow.:) now i'm facing bridging on 0402 components pads. any suggestions on spacing distance as we're going to re-design the pcb.
Electronics Forum | Tue Jun 02 17:32:53 EDT 2015 | jldowsey
Les, Some of the answers to design or stencil aperture/placement machine depend upon what is the current spacing between your components which you didn't specify. Chip components such as 0402's and 0201's typically have very small reductions in pas
Used SMT Equipment | AOI / Automated Optical Inspection
YesTech YTV-F1 Automated PCB Inspection System >Multi-function all purpose In-Line system • (2) Top-down Cameras; Incl. (1) High Magnification • (4) side viewing cameras • LED top light, bi-color multiangle LED lighting •
Used SMT Equipment | AOI / Automated Optical Inspection
YesTech YTV-F1 Automated PCB Inspection System >Multi-function all purpose In-Line system • (2) Top-down Cameras; Incl. (1) High Magnification • (4) side viewing cameras • LED top light, bi-color multiangle LED lighting •
Industry News | 2017-07-10 17:31:47.0
GPD Global is in the process of setting up a demonstration center on the East coast of the United States. Rapid Coatings, located in Woburn Massachusetts, will be the East coast demo coating center. A GPD Global conformal coating system (SimpleCoat) configured with spray, precision dispense, and volumetric progressive cavity displacement technology will be used for Rapid Coatings production and customer demonstration.
Industry News | 2016-07-16 13:32:29.0
Advanced dispense technology is available for integration into your dispensing system. Continuously Volumetric, drip-and-drool free dispense technology can now be retrofitted into your dispense robot. GPD Global's Volumetric PCD pumps ensure the success of applications like underfill, LED encapsulation, solder mask, silicones, conductive ink, conformal coatings, and more. Improve your throughput and yields by retrofitting a Volumetric PCD Pump into your dispense system to simplify the dispense process.
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Parts & Supplies | Pick and Place/Feeders
0402 Ceramic Blade Nozzle (3030) – p/n 51305433 You might ask, “What’s the difference between this nozzle and the older conical 0402 ceramic nozzle?” Simply put, we think this latest design is a far superior option. Here&
Parts & Supplies | Component Packaging
YAMAHA YV200 KM1-M7155-00X 90933-02J604 BEARING 604Z NSK 604Z NSK KM1-M7155-00X 90933-02J604 BRG BEARING NTN Part nr.: 5322 520 10802 This bearing is positioned on the top of the spline shaft between the return spring and the c clip
Technical Library | 2023-01-17 17:58:36.0
Heterogeneous integration has become an important performance enabler as high-performance computing (HPC) demands continue to rise. The focus to enable heterogeneous integration scaling is to push interconnect density limit with increased bandwidth and improved power efficiency. Many different advanced packaging architectures have been deployed to increase I/O wire / area density for higher data bandwidth requirements, and to enable more effective die disaggregation. Embedded Multi-die Interconnect Bridge (EMIB) technology is an advanced, cost-effective approach to in-package high density interconnect of heterogeneous chips, providing high density I/O, and controlled electrical interconnect paths between multiple dice in a package. In emerging architectures, it is required to scale down the EMIB die bump pitch in order to further increase the die-to-die (D2D) communication bandwidth. Aa a result, bump pitch scaling poses significant challenges in the plated solder bump reflow process, e.g., bump height / coplanarity control, solder wicking control, and bump void control. It's crucial to ensure a high-quality solder bump reflow process to meet the final product reliability requirements. In this paper, a combined formic acid based fluxless and vacuum assisted reflow process is developed for fine pitch plated solder bumping application. A high-volume production (HVM) ready tool has been developed for this process.
Technical Library | 2019-07-10 23:36:14.0
Pockets of gas, or voids, trapped in the solder interface between discrete power management devices and circuit assemblies are, unfortunately, excellent insulators, or barriers to thermal conductivity. This resistance to heat flow reduces the electrical efficiency of these devices, reducing battery life and expected functional life time of electronic assemblies. There is also a corresponding increase in current density (as the area for current conduction is reduced) that generates additional heat, further leading to performance degradation.
Eliminate Body Stress with Versatile CF-8 GPD's CF-8 eliminates component body stress. Versatility is the key word for the CF-8. Simple tooling changes make short or long run production jobs quick and easy. Capabilities Meets exacting military s
ITW EAE, the Electronic Assembly Equipment division of ITW is introducing an innovative new twin-nozzle developed by the Vitronics Soltec team for the ZEVA Selective Soldering System. The 3D-Twin-Nozzle™ has two nozzle diameters combined in one
Training Courses | | | Other Courses
Other courses related to electronics manufacturing and assembly
Training Courses | | | IPC-7711/7721 Trainer (CIT)
The Certified IPC-7711/7721 Trainer (CIT) courses recognize individuals as qualified trainers in the area of rework and repair of printed boards and electronic assemblies and prepares them to deliver Certified IPC-7711/7721 (CIS) training.
Events Calendar | Sun Sep 27 00:00:00 EDT 2020 - Thu Oct 01 00:00:00 EDT 2020 | Rosemont, Illinois USA
SMTA International 2020 Conference & Exhibition
Events Calendar | Mon Jun 08 00:00:00 EDT 2020 - Mon Jun 08 00:00:00 EDT 2020 | ,
Practical Set-Up, Qualification of Cleaning Process in PCB Assembly
Career Center | Oldsmar, Florida USA | Engineering,Maintenance,Production
Job Title: Assembler 2 – IPC 610 – 1st Shift Address: 3655 Tampa Rd, Oldsmar FL 34677 Duration: 1 year Pay Rate: $15-$18 Hours: 9/80 schedule Monday – Thursday 6:00AM – 3:30PM, Friday 6:00AM to 2:30PM Job Description: Use microscope to verify
Career Center | Oldsmar, Florida USA | Maintenance,Production
Job Description: • Uses microscope to verify correct part placement and orientation, manually align parts before soldering and perform post re-flow inspection and touch-up. • Able to identify and touch up poor wetted solder joints, solder voids / i
Career Center | Botevgrad, Sofia Bulgaria | Engineering,Production,Quality Control,Research and Development,Sales/Marketing
AOI - Omron RNS/RNS_ptH, VI3000, Marantz 22X IPC-610D Class 3, Pb/Pb free process, 5S, FMEA, MSA, PPAP, SPC, CPK, 6Sigma, lean manufacturing, Quality management, ISO/TS 16949 ,ISO 9001,ISO 14 001
Career Center | Botevgrad, Sofia Bulgaria | Engineering,Production,Quality Control
AOI - Omron RNS_ptH, RNS-LS, VT-WIN2 VI3000 Marantz 22X IPC 610D certified ISO 9001-2008, etc automotive standards ROHS
SMT Express, Volume 3, Issue No. 5 - from SMTnet.com Volume 3, Issue No. 5 Thursday, May 17, 2001 Featured Article Return to Front Page A Closer Look at Area Array Components by Gil Zweig , Glenbrook Technologies, Inc . Combining
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/height-difference-between-different-amls_topic11_post16.html
. For chip components like 0603 or 0805 resistor, there may be some differences between different manufactures, for example KOA, Vishay, Rohm or Sumsung, but very tiny difference and we usually ignore
| https://www.eptac.com/faqs/ask-helena-leo/ask/bridging-two-adjacent-pins-on-an-ic
Bridging Two Adjacent Pins on an IC - EPTAC - Train. Work Smarter. Succeed Looking for solder training standards, manuals, kits, and more
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