Industry Directory | Manufacturer
Toppan is a manufacturer of bare PWBs. Technology includes 2-32 layers, standard technology and advanced technology. Delivery in 3-20 days. Excellent six sigma based quality system.
Industry Directory | Manufacturer
Ambitech specializes in the fabrication of high tech, complex printed circuit boards up to 44 layers.
New Equipment | Assembly Services
We are Professional in PCB Manufacturing, PCB Fabrication, PCB Making! Hitech Circuits Co., Limited – Experienced PCB manufacturer from China. Our PCB manufacturing services will allow you to be the most competitive player in your market. Please che
Materials: FR-4 Layer count: 8 layers with blind/buried VIAs Min. VIAs: 10 mil Min. line: 5 mil Application: Printing controller Finishing: HAL
Electronics Forum | Fri May 23 14:39:00 EDT 2003 | bradlanger
Cameron, I am burying the thermocouple in high temp solder on the solder pad of the area I want to profile.
Electronics Forum | Wed Aug 18 15:56:20 EDT 1999 | david dougherty
Hadco offers a technology of building in a "buried" capacitance layer (& other embedded passives) in organic PWBs (FR4 for example). see http://www.hadco.com/prod03.htm and a design manual is posted here: http://www.hadco.com/pdfs/bcguide.pdf I am c
Industry News | 2003-02-25 08:18:29.0
Teradyne can now provide deep micro-via technology for customers of high-performance printed circuits.
Industry News | 2003-02-17 10:48:14.0
Pricewaterhouse Coopers, Inc. was Appointed Trustee in Bankruptcy
Parts & Supplies | Assembly Accessories
Khy-m3t0l-01 cylinder liner 3 1 Khy-m3t13-00 cylinder liner 1 1 Khy-m3t14-02 cylinder liner 2 1 Klc-m11fa-00 bolt, round head 2 Klf-m3t34-00 board guide 3 Klw-m3t0c-00 block, shock absorber 2 Klw-m3t0d-00 shock absorber 2 klw-m654f-91 s
Parts & Supplies | Circuit Board Assembly Products
1). PCB Thickness up to 5mm 2). FR-4 material, 1 oz copper finished 3). Green solder mask /white silk screen. 4). Blind/buried vias required. 5). Hot air level Pb free 6). Application: motor, medical equipment, industrial products.
Technical Library | 2013-03-07 18:25:36.0
The market for high-layer-count printed circuit boards (PCB) containing blind and buried vias was once relatively small, and focused on specialized applications in the military and high end computing. The demand for these types of PCBs today is being driven by an increasing number of commercial applications in the telecommunications and semiconductor test market segments. These applications typically require high-aspect-ratio plated-through-holes (PTHs) and blind and buried vias in order to meet the applications interconnect density requirements. Blind and buried vias and high aspect ratio PTHs continue to present manufacturing challenges and frequently are the limiting features to achieving high fabrication yield... First published in the 2012 IPC APEX EXPO technical conference proceedings
Technical Library | 2015-05-14 15:45:45.0
The Printed Circuit Board industry has seen a steady reduction in pitch from 1.0mm to 0.4mm; a segment of the industry is even using or considering a 0.25mm pitch. This has increased the use of stacked microvias in these designs. The process of stacking microvias has been practiced for several years in handheld devices; however, the devices generally do not operate in harsh conditions. Type 1 and Type 2 microvias have been tested over the years and have been found to be very reliable. We do not have enough test data for 3 and 4 stack microvias when placed on and off buried via. The main objective of this study was to understand the reliability of 3 and 4 stack microvias placed on and off a buried via.
http://www.pcb-separator.com/ https://www.pcb-separator.com/html/PRODUCTS/PCB%20separator/2019/1113/832.html Hand push pcb cutter/PCB cutting machine manufacturer/PCB V-cut machine manufacturer/PCB depaneling equipment, automatic pcb cutting machine,
http://www.pcb-separator.com/ https://www.pcb-separator.com/html/PRODUCTS/PCB%20separator/2019/1113/832.html Hand push pcb cutter/PCB cutting machine manufacturer/PCB V-cut machine manufacturer/PCB depaneling equipment, automatic pcb cutting machine,
Training Courses | | | IPC-6012 Specialist (CIS)
The Certified IPC-6012 Specialist (CIS) training covers design, fabrication and inspection of rigid printed boards.
Training Courses | | | IPC-6012 Trainer (CIT)
The Certified IPC-6012 Trainer (CIT) courses recognize individuals as qualified trainers in the area of design, fabrication and inspection of rigid printed boards and prepare them to deliver Certified IPC-6012 Specialist (CIS) training.
Events Calendar | Thu Mar 26 00:00:00 EDT 2020 - Thu Mar 26 00:00:00 EDT 2020 | ,
Water-based fluxes - opportunities and application notes
Career Center | Dana Point, California USA | Sales/Marketing
We are currently seeking sales reps nationwide for this rapidly growing supplier of printed circuit boards (since 1986)with facilities in southern CA and eight PCB facilities in China and Taiwan, all ISO 9002 certified and UL94V-0 approved, some are
Career Center | Erode, Tamilnadu India | Engineering
Professional Summary 3+ years of experience in the PCB CAM engineering Exposure to FRONTLINE GENESIS 2000 Having exposure in UCAM Exposure to Create, Array & Panelize it for manufacturability Experienced in Creating impedance cou
SMTnet Express March 7, 2013, Subscribers: 26214, Members: Companies: 13311, Users: 34412 PTH Core-to-Core Interconnect Using Sintered Conductive Pastes The market for high-layer-count printed circuit boards (PCB) containing blind and buried vias
Imagineering, Inc. | https://www.pcbnet.com/capabilities/assembly/technology-roadmap/
• Inner Layer - 10 oz • Inner Layer - 16 oz Buried/Blind Via 10+N+10 (HDI) Plasma Desmear Yes Outline Tolerance +/-.004 Surface Finish • HASL • ENIG • Immersion Silver • OSP (ENTEK) • Carbon • Immersion Tin • Electrolyic Gold • ENEPIG • ENIPIG Impeadance Control
Blackfox Training Institute, LLC | https://www.blackfox.com/wp-content/uploads/2017/04/BlackFox_Sharon.pdf
qualification and performance of rigid printed boards, including single-sided, double-sided, with or without plat- ed-through holes, multilayer with or without blind/buried vias and metal core boards
