Industry Directory | Manufacturer
We supply various kinds of spare parts for a pick and placer such as a nozzle.
Industry Directory | Distributor / Manufacturer
Our company is providing all kinds of pick and placer nozzles originally produced in South Korea in the global market.
New Equipment | Industrial Automation
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New Equipment | Industrial Automation
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Electronics Forum | Mon Mar 09 11:43:59 EDT 2009 | pcbrown
Here is a formula that may help. C/P C= Component's weight in grams P= Total pad area in Sq. in. Must be less than or equal to 30 Parts larger than a 68 pin PLCC should use an adhesive. Hope this helps.
Electronics Forum | Sat Jan 22 03:02:00 EST 2011 | cpcompany
Dear Sir I understand that you are having difficulty in finding the nozzles for CP30. As you know CP30 was the very first model of Samsung Techwin. At that time, I worked for Samsung Techwin as a service engineer in Korea. Now I am checking if I can
Used SMT Equipment | General Purpose Equipment
Very Nice Blue M Oven For Sale See attached pictures and information below Equipment Description Blue M Oven Model Number: CC-09-C-P-E Serial Number: T02G-339526-TG Pro Master Temperature Controller Temperature Range: 350C 6 - 8 degrees/m
Used SMT Equipment | Pick and Place/Feeders
Highlights of the SIPLACE XS: SIPLACE SpeedStar for high-speed and placement of components as small as 0201 (metric) with maximum precision SIPLACE MultiStar – the only head that automatically changes modes on demand (C&P, P&P, Mixed Mode) SIPLACE Tw
Industry News | 2009-01-21 14:23:25.0
OSAKA, JAPAN � January 2009 � Nihon Superior Co. Ltd., an advanced soldering and brazing supplier to the worldwide market, introduces SN100C P800 power semiconductor lead-free solder paste.
Industry News | 2012-10-17 11:24:10.0
Nihon Superior Co., Ltd. announces that it was awarded a 2012 Global Technology Award in the category of Materials – Solder Paste for its SN100C P810 D4 No-Clean Lead-Free Solder Paste.
Parts & Supplies | Pick and Place/Feeders
Assembly Kit For C+P20 / C+P 20 A
Parts & Supplies | Pick and Place/Feeders
Cover, bottom cpl. C+P20p
Technical Library | 2013-03-21 21:24:49.0
This paper explores the behaviour of a copper test vehicle with multiple reflowed solder joints, which has direct relevance to ball grid arrays (BGA) and high density interconnect structures. The paper explores the relative stress conditions on the distributed joints and the sensitivity to ball joint shape... First published in the 2012 IPC APEX EXPO technical conference proceedings
03004726-01 PUSH SWITCH 03004731-01 SILENCER G3/8 03004743-01 SILENCER G1/8 03004759S01 BUFFER UNIT RETURN COMPL. 03004784-01 SILENCER G1/4 03004858-01 ADAPTER PCB-CAMERA SMART 03004860-01 NOZZLE UPPER PART 03004871S02 STR
03014616S01 HOSE/EXHAUST AIR C+P20 03014654S01 HOSE / ADAPTER EXHAUST AIR C+P 20 03015194-01 NOZZLE TYPE 1035 compl 03015222-01 NOZZLE TYPE 1235 COMPLETE 03015384-01 NOZZLE TYPE 1135 compl./ 2 part Nozzle 03015388S05 PCB / 1-WIRE PPW C+P 030154
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Other courses related to electronics manufacturing and assembly
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Defect Detection for Advanced Wafer and Package Devices
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Line audits 5’s line audits RoHS line audits Screen printing machine operating S.M.T M/c Operator “Siemens” HS-60, S-27, F5HM. S.M.T Fuji, cp6, ip3, xp143 & 243 M/c Technician. Awareness of reflow profiling and verification Servicing of mobile sets a
SMTnet Express March 21, 2013, Subscribers: 26266, Members: Companies: 13317, Users: 34462 Low Cycle Fatigue Behaviour of Multi-joint Sample in Mechanical Testing by: C.P. Hunt, O. Thomas, D. Di Maio, E. Kamara, H. Lu; National Physical Laboratory