Electronics Forum | Fri May 23 14:39:00 EDT 2003 | bradlanger
Cameron, I am burying the thermocouple in high temp solder on the solder pad of the area I want to profile.
Electronics Forum | Wed Mar 28 19:34:27 EST 2001 | mparker
I betcha John Cameron Swazzie would have the answer!!! Are you talkin Greenwich mean time or nuclear clock? Which calendar are you following? Julian? Mayan?
Industry News | 2019-06-26 20:03:21.0
IPC presented Committee Leadership, Special Recognition and Distinguished Committee Service Awards on Monday, June 17 at IPC’s SummerCom Standards Development Committee Meetings in Raleigh, N.C. The awards were presented to individuals who made significant contributions to IPC and the industry by lending their time and expertise in the development of electronics manufacturing standards.
Industry News | 2017-02-28 20:28:51.0
IPC – Association Connecting Electronics Industries® presented Committee Leadership, Distinguished Committee Service and Special Recognition Awards at IPC APEX EXPO® at the San Diego Convention Center. The awards were presented to individuals who made significant contributions to IPC and the industry by lending their time and expertise through IPC committee service.
Technical Library | 2018-11-07 20:48:01.0
Glass offers a number of advantages as a dielectric material, such as a low coefficient of thermal expansion (CTE), high dimensional stability, high thermal conductivity and suitable dielectric constant. These properties make glass an ideal candidate for, among other things, package substrate and high-frequency PCB applications. We report here a novel process for the production of printed circuit boards and integrated circuit packaging using glass as both a dielectric medium and a platform for wiring simultaneously.
Training Courses | | | Other Courses
Other courses related to electronics manufacturing and assembly
SMTnet Express, November 8, 2018, Subscribers: 31,451, Companies: 25,347, Users: 25,378 Laser-Based Methodology for the Application of Glass as a Dielectric and Cu Pattern Carrier for Printed Circuit Boards Joel Schrauben, Cameron Tribe
