Electronics Forum | Sat Oct 17 10:24:12 EDT 1998 | smd
| | | | | | | It seems like most people want to X-Ray their BGAs. We're going to start doing a lot more of them and need to consider X-ray, too. | | | | | | | Q: Do most people/companies X-ray everyBGA or do they just do SPC? | | | | | | | Q: Can yo
Electronics Forum | Fri Mar 30 11:04:24 EST 2001 | genny
We are already using ICT on the PCB, which should catch most missing components, also components installed backwards, or the wrong value(to a point - we do RF so we have lots of very small value caps and inductors which can't be measured), and in som
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SMT Express, Volume 2, Issue No. 3 - from SMTnet.com Volume 2, Issue No. 3 Thursday, March 16, 2000 Featured Article Return to Front Page Curtailing Voids in Fine Pitch Ball Grid Array Solder Joints by Gary Morrison and Kevin Lyne
INSERT INTO tracking_express (userid, username, page_id, ts) VALUES ('#Quser_profile.id#', '#Quser_profile.username#', 48, (#ts#)) SMT Express, Volume 3, Issue No. 3 - from SMTnet.com Volume 3, Issue No. 3 Thursday, March 15, 2001 Featured
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/last-will-of-bga-void.pdf
. An opposing school of thought was that voids act as crack arrestors, which improve solder joint life. The root cause of voids in BGA solder joints is well understood by the electronics industry with a number of papers published on the topic [1, 2, 3]. R
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/RSS_3d-step-to-vrml_topic976.xml
file preview and output and in Pulsonix I mainly use the built in 3D viewer for a quick check because the STEP file takes longer.I'm not sure how you can visually validate the footprint to ensure solder joint accuracy here since the user is probably going to be outputting the 3D model and the footprint from FPX at the same time
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