Electronics Forum | Thu Nov 30 00:41:23 EST 2017 | abhilash4788
Dear All, I have OSP finsh pcb on my production, the pcb thickness is 1.5mm and the product is one sideded pcba. After reflow process, Is there any specific time frame defined for smt completed OSP finish pcba before going for wave soldering proce
Electronics Forum | Wed Jul 04 12:35:19 EDT 2001 | davef
I thought I responded this this a while ago, guess NOT!!! Wow, Dano yagot Entek boards that are that old!!!! Coo. Sounds kwazy that you�d end-up with that volume of old boards, but it�s probably one of those deals where correcting the problem keep
BGA Package Component Reliability After Long-Term Storage BGA Package Component Reliability After Long-Term Storage In 2008, the white paper Component Reliability After Long Term Storage was published in support of shelf life extension
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