The inspection of welded tanks is a time-costly procedure. Modern real-time DR-systems result in a huge efficiency gain in comparison to the conventional film (RT) approach. VisiConsult developed a cutting edge custom system with weld tracking, defec
New Equipment | Test Equipment
High Accuracy, In-Circuit Test and Functional Test with IEEE, PXI, Boundary Scan and Flash Programming capability for all NPI and Electronic Manufacturing environments, Visiontest, optional fixture capability The Latest Technology in Flying Probe T
Electronics Forum | Wed Dec 25 02:17:01 EST 2013 | alexeis
Hi, Flying Probe uses only for symptom detection. Do you have software tools for repair station that can helps to your engineering to detect cause? If you need a software tools, feel free to contact me by email: alexeis@proventustech.com. Best Reg
Electronics Forum | Fri Jul 23 09:31:52 EDT 2004 | cyber_wolf
Make sure that your mesh conveyor drive chain is not jumping a sprocket tooth. This will cause the conveyor to "pop" and you will have skewed parts. I seriously doubt that it is your profile causing skew. It is more than likely something mechanical.
Industry News | 2018-10-18 09:34:29.0
Application of lead-free solder
Industry News | 2018-10-18 11:09:41.0
Advantages of Design for Manufacturability Rules
Parts & Supplies | Assembly Accessories
Long term spot supply: Samsung's original new SM/CP Feeder: 8 * 2mm 8 * 4mm 12mm 16mm 24mm 32mm 44mm 56mm Samsung original new SME Feeder: 8mm -56mm Samsung original new TN suction: TN040 TN065 TN140 TN220 TN400 TN400N TN750 TN1100 Samsung or
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Parts & Supplies | Pick and Place/Feeders
Samsung nozzle of TN series & CN series Samsung Nozzle Samsung nozzle of TN series & CN sereis Usage:Samsung pick and place machine Product description: Samsung nozzle of TN series & CN sereis Issues related to improper nozzle/f
Technical Library | 2023-07-22 02:26:05.0
Patch offset; Uneven patches throughout the substrate (each substrate is offset in a different way); Only part of the substrate is offset; Only certain components are offset; The patch Angle is offset; Component absorption error; Laser identification (component identification) error; Nozzle loading and unloading error; Mark (BOC mark, IC mark) identification error; Image recognition error (KE-2060 only); Analysis of the main reasons for throwing material. More information about KINGSUN please Contact US at jenny@ksunsmt.com or visit www.ksunsmt.com
Technical Library | 2023-04-17 17:05:47.0
In an ideal world, manufacturing devices would work all of the time, however, every company receives customer returns for a variety of reasons. If these returned parts contributed to a fail, most companies will perform failure analysis (FA) on the returned parts to determine the root cause of the failure. Failure can occur for a multitude of reasons, for example: wear out, fatigue, design issues, manufacturing flaw or defect. This information is then used to improve the overall quality of the product and prevent reoccurrence. If no defect is found, it is possible that in fact the product has no defect. On the other hand, the defect could be elusive and the FA techniques insufficient to detect said deficiency. No-clean flux residues can cause intermittent or elusive, hard to find defects. In an attempt to understand the effects of no-clean flux residues from the secondary soldering and cleaning processes, a matrix of varying process and cleaning operation was investigated. Of special interest, traveling flux residues and entrapped residues were examined, as well as localized and batch cleaning processes. Various techniques were employed to test the remaining residues in order to assess their propensity to cause a latent failure. These techniques include Surface Insulation Resistance1 (SIR) testing at 40⁰C/90% RH, 5 VDC bias along with C32 testing and Ion Exchange Chromatography (IC). These techniques facilitate the assessment of the capillary effect the tight spacing these component structures have when flux residues are present. It is expected that dendritic shorting and measurable current leakage will occur, indicating a failing SIR test. However, since the residue resides under the discrete components, there will be no visual evidence of dendritic growth or metal migration.
Lyra Reflow Oven is a soft soldering that realizes the mechanical and electrical connection between the solder ends of surface mount components or the pins and the printed board pads by remelting the solder paste pre-distributed on the printed board
Welcome to this Defect of the Month video on monitoring flux application for wave and selective, this series of videos were produced for and featured as part of the NPL/IPC video library and examples are taken from the NPL Defect Database. Over the l
Events Calendar | Wed Dec 06 00:00:00 EST 2017 - Wed Dec 13 00:00:00 EST 2017 | Rolling Meadows, Illinois USA
X-Ray of PCBs Webtorial
Career Center | Orange County, California USA | Quality Control
Job Description: Summary: Reporting to the COO/CTO the VP of Quality role will involve creating and/or augmenting the Quality system and programs to be a pro-active vs. a reactive structure. This will involve creating an overall quality vision, se
Career Center | Tallahassee, Florida USA | Engineering,Technical Support
Provides Test Engineering support to the Test and Sales departments; develops test programs/hardware/documentation for new and existing products. Responsible for providing setup, technical support, debug, training, and technical supervision to all s
Career Center | Grand Prairie, Texas USA | Production,Quality Control,Technical Support
SMT Programmering Specialist. Pick and place, screen printer, AOI and quality inspection, process control, CAD and program development.
Lewis & Clark | https://www.lewis-clark.com/product-category/flying-probe/
– Parasitic Transistor Measurement OPENFIX (AC Signal Measurement on Part Case Visual Inspection Module: Hardware/Software Module for Flying Probes Configuration Able to Perform Automatic Visual Inspections of the UUT in Order to Check Presence/Absence, Rotation, and Polarity of each UUT Component
Surface Mount Technology Association (SMTA) | https://www.smta.org/knowledge/proceedings_abstract.cfm?PROC_ID=5246
The Role of Nickel in Solder Alloys - Part 2. The Effect of Ni on the Integrity of the Interfacial Intermetallic in Sn-Based/Cu Substrate Solder Joints 中文
