Industry Directory: causes (32)

Failsafe Network, Inc.

Industry Directory | Consultant / Service Provider

Root Cause training, consulting, publishing, conferencing: Helping you learn from things that go wrong, without hurting people in the process. We'll CHANGE the way you think about FAILURE and its CAUSES! According to our customers, we offer the most PRACTICAL, DECISVE, LIFE-CHANGING approach on the market.

Engelmaier Associates, L.C.

Industry Directory | Consultant / Service Provider

Engelmaier Associates, L.C. provides Design-for-Reliability, failure root cause analysis, workshops, litigation support for PCBs and electronic assemblies.

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New SMT Equipment: causes (206)

Electrostatic Discharge Training

Electrostatic Discharge Training

New Equipment | Education/Training

ESD Training This course is designed to increase awareness of the causes and effects of Electrostatic Discharge (ESD) and Electrical Overstress (EOS) on electronic assemblies and components. Students learn the use of ESD protection equipment and the

EPTAC Corporation

Juki intelligent feeder calibration jig

Juki intelligent feeder calibration jig

New Equipment | Inspection

Juki intelligent feeder calibration jig This product adopts CCD with high times magnifier, through a MONITOR observation into components situation, Lever needle up and down work conditions, the LEVER fray, decrease FEEDER false and the cause of thro

ZK Electronic Technology Co., Limited

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Electronics Forum: causes (4958)

Black stain... what causes it?

Electronics Forum | Fri Jan 25 19:01:35 EST 2013 | hegemon

My first guess is that the plating in the barrel (via) has failed and allowed laminate/epoxy egress into the barrel and out to the surface of the board. Just a guess based on the picture.... 'hege

Black stain... what causes it?

Electronics Forum | Thu Feb 14 17:40:34 EST 2013 | jorge_quijano

PCB Supplier made an EDX anaysis, the found a chemical trapped in the holes, and some burnt burrs, according to what they say this stains are over the solder mask & silk, so they do not affect functionality.

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Used SMT Equipment: causes (42)

Yamaha YSM10 / KMG-000

Yamaha YSM10 / KMG-000

Used SMT Equipment | Pick and Place/Feeders

Yamaha Mounter YSM10 basic specifications:   1. Target board size: L510 x W460 mm ~ L50 x W50 mm. Use optional accessories, can correspond to L610mm substrate   2, placement capacity: HM placement head (10 nozzles) specifications HM5 placement he

Qinyi Electronics Co.,Ltd

Fuji Chip Mounter NXTR-A

Fuji Chip Mounter NXTR-A

Used SMT Equipment | Chipshooters / Chip Mounters

The NXTR A model includes an automatic feeder exchange system that frees operators from changeover and supply work, with additional features that strengthen the ability to maintain high-quality and productivity. Fuji is paving the way to the future o

Qinyi Electronics Co.,Ltd

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Industry News: causes (1089)

Whizz Systems, Inc. Installs Crest Ultrasonics' Powersonic™

Industry News | 2021-06-26 09:04:13.0

Whizz Systems, Inc. today announced the addition of a Powersonic™ Benchtop Ultrasonic Cleaner from Crest Ultrasonics.

Whizz Systems

Package Provides Integrated Hall-effect Solution

Industry News | 2003-05-30 08:09:11.0

A new compact package integrates a Hall-effect sensor IC with a back-biasing magnet to achieve high airgap performance and meet restrictive space requirement.

SMTnet

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Parts & Supplies: causes (503)

Yamaha YV100X 73A 74A 76A nozzle

Yamaha YV100X 73A 74A 76A nozzle

Parts & Supplies | Chipshooters / Chip Mounters

        7WL ASSY (ø1.2 / 0.6) Issues related to improper nozzle/feeder maintenance or use of poor quality nozzles are often the same. Here are some of the most common problems: 1. Poor pickup location on part. It will cause a loss of vacuum and re

ZK Electronic Technology Co., Limited

Yamaha Yamaha YV100X 71a nozzle used in smt machine

Yamaha Yamaha YV100X 71a nozzle used in smt machine

Parts & Supplies | SMT Equipment

7WL ASSY (ø1.2 / 0.6) Issues related to improper nozzle/feeder maintenance or use of poor quality nozzles are often the same. Here are some of the most common problems: 1. Poor pickup location on part. It will cause a loss of vacuum and result in

KingFei SMT Tech

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Technical Library: causes (113)

SMT Printing Collapse Causes and Countermeasures --KINGSUN

Technical Library | 2023-12-15 03:06:24.0

The first process in the SMT industry is solder paste printing. After the solder paste printing is completed, electronic components are attached to PCB pads through a SMT machine, and then reflow soldered. A preliminary PCB board is roughly processed. SMT is a combination of multiple devices, and such a line is called an SMT production line. Our common PCBA is processed through this process. In SMT technology, each process is very important, and poor quality can be caused by different process defects. Today, we are discussing the causes and countermeasures of SMT printing collapse.

DONGGUAN KINGSUN AUTOMATION TECHNOLOGY CO.,LTD

KE-2050/KE-2060 Causes and Countermeasures of Patch Failure

Technical Library | 2023-07-22 02:26:05.0

Patch offset; Uneven patches throughout the substrate (each substrate is offset in a different way); Only part of the substrate is offset; Only certain components are offset; The patch Angle is offset; Component absorption error; Laser identification (component identification) error; Nozzle loading and unloading error; Mark (BOC mark, IC mark) identification error; Image recognition error (KE-2060 only); Analysis of the main reasons for throwing material. More information about KINGSUN please Contact US at jenny@ksunsmt.com or visit www.ksunsmt.com

DONGGUAN KINGSUN AUTOMATION TECHNOLOGY CO.,LTD

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Videos: causes (155)

Increase productivity, improve quality, reduce costs with vertical format curing solutions from Heller Industries.

Increase productivity, improve quality, reduce costs with vertical format curing solutions from Heller Industries.

Videos

Increase productivity, improve quality, reduce costs with vertical format curing solutions from Heller Industries. Learn more: http://www.hellerindustries.com/755-Vertical-Oven.php

Heller Industries Inc.

This elevator format oven utilizes vertical space to accomodate curing applications of up to 4 hours while only occupying 96" (2.5m) of floorspace. Perfect for underfill and encapsulant.

This elevator format oven utilizes vertical space to accomodate curing applications of up to 4 hours while only occupying 96" (2.5m) of floorspace. Perfect for underfill and encapsulant.

Videos

This elevator format oven utilizes vertical space to accomodate curing applications of up to 4 hours while only occupying 96" (2.5m) of floorspace. Perfect for underfill and encapsulant.

Heller Industries Inc.

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Training Courses: causes (18)

Electrostatic Discharge Training

Training Courses | | | PCB Assembly Courses

The PCB assembly courses provide knowledge of different processes and equipment used in TH and SMT assembly of printed circuit boards.

EPTAC Corporation

Electrostatic Discharge Online Live Training

Training Courses | ON DEMAND | | ESD Control Training Courses

Browse training and certification programs for electrostatic discharge (ESD) control in electronics assembly.

EPTAC Corporation

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Events Calendar: causes (20)

Webinar: BGA and Area Array Process Defects - Causes & Cures

Events Calendar | Tue Feb 12 00:00:00 EST 2019 - Tue Feb 12 00:00:00 EST 2019 | ,

Webinar: BGA and Area Array Process Defects - Causes & Cures

Surface Mount Technology Association (SMTA)

Europe Chapter Webinar: Tombstoning Components during Reflow Soldering - Causes & Cures

Events Calendar | Mon Apr 12 00:00:00 EDT 2021 - Mon Apr 12 00:00:00 EDT 2021 | ,

Europe Chapter Webinar: Tombstoning Components during Reflow Soldering - Causes & Cures

Surface Mount Technology Association (SMTA)

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Career Center - Jobs: causes (82)

Field Service Engineer

Career Center | Florham Park, New Jersey USA | Engineering

Field Service Engineer Job Description The basic function of this position: Installation, training, repair, and implementation of retrofits on the complete line of Heller reflow ovens. Candidate must be a US citizen. DUTIES AND RESPONSIBILITIES: S

Heller Industries Inc.

Supplier Quality Technician

Career Center | Charlotte, North Carolina USA | Engineering

Coordinates activities and provides support to QA, operations and the materials group to establish programs for monitoring and managing supplier quality. Reviews and dispositions discrepant materials, initiates corrective actions and coordinates fai

Solectron Technology, Inc.

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Career Center - Resumes: causes (42)

Process Engineering/Maintenance Technician

Career Center | Fredericksburg, Virginia USA | Engineering,Maintenance,Management,Production,Quality Control

• Certified CP643 Loader Calibration – FUJI American Chicago, IL 2001. • Certified - Cookson Performance Solutions BTU - PARAGON - P150 Oven – Maintenance & Electrical Troubleshooting Charlotte, NC 2001. • Certified UNIVERSAL (GSM) Platform: Operat

Electronic Process Engineer

Career Center | brampton, Ontario Canada | Engineering,Management,Production,Technical Support

- More than 14 years of experience in set-up, calibrate, program, troubleshoot SMT machines and SMT process, for the manufacturing of PCB Electronic Assemblies - 5 year experience in leading position for electronic manufacturing/Process Engineering.

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Express Newsletter: causes (209)

Partner Websites: causes (5888)

What are the working principles and usage skills of Full-auto SMT Stencil Printer? - I.C.T SMT Machi

| https://www.smtfactory.com/What-are-the-working-principles-and-usage-skills-of-Full-auto-SMT-Stencil-Printer-id3506468.html

? On the one hand, the viscous friction force of the solder paste causes the solder paste to shear at the junction of the Full-auto SMT Stencil Printer squeegee and the stencil

High Reliability Alloy Solder Paste For ENIG - PCBASupplies

| https://pcbasupplies.com/alloy-solder-paste-enig/

. Recommended for ENIG finish In ENIG finish, Sn-Ni IMC layer thickens and along with concentration of P causes the joint interface brittle.By adding Ni-compatible Cu, SB6NX forms a Ni barrier layer and effectively prevents the thickening of Sn-Ni IMC layer, realizing high joint reliability with ENIG finish

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