Precision Engineered Ceramics, Inc. produces precision machined ceramic spares for semiconductor wafer processing equipment. In addition, we offer fast delivery of complex geometry ceramic components made from high purity aluminum oxide (alumina).
Industry Directory | Manufacturer
Microjoin specializes in offering microwelding, heat seal, hot bar and welding assembly equipment used in bonding and microjoining of miniature mechanical and electrical sub-assemblies.
New Equipment | Rework & Repair Equipment
The tool ends are made of high quality Swedish Hardened Tool Steel, carefully heat treated and tempered to provide a tough, long lasting working edge that resists wear.
Description Durostone is a fiber-reinforced plastic for mechanical and electrical applications. With good performance against electric arc and tracking, it is an ideal material for solder paste printing, SMT process, reflow soldering and wave solderi
Electronics Forum | Tue Feb 27 22:40:28 EST 2007 | davef
IPC-A-600G, 2.9 Solder Resist [Solder Mask] [snip]"Solder resists are used to limit and control the application of solder to selected areas of the printed circuit board during assembly soldering operations and are sometimes used to reduce dendritic f
Electronics Forum | Tue Feb 27 20:17:19 EST 2007 | roderickray
I have been trying to tell people at work that minor scratches on solder resist on BGA will not effect functionality of BGA, instead they want to attempt repair of these scratches. Any suggestions.
Used SMT Equipment | Soldering Equipment/Fluxes
Model: FlexSolder W620 Vintage: 2012 (demo’ed only, never used!) Description: Inline soldering system. (With servo driven XYZ gantry, and tilt able gripper from 0° to 7° degrees for direct PCB handling) Details: • Spray fluxer •
Used SMT Equipment | Soldering - Wave
this type can be added with nitrogen protection system 1 Flux spraying system 1.1 Spray fluxer can sense the board size automatically, and the spraying area can be adjusted according to the width of PCB. 1.2 Spray fluxer can sense the conveyor
Industry News | 2016-02-27 22:11:00.0
GPD Global has advanced its auger pump technology with the introduction of the newly developed Precision Auger Pump. This pump was designed to offer a wide range of functionality in your process development by being compatible with a wide range of auger/cartridge assemblies.
Industry News | 2003-03-24 09:46:41.0
Will feature a number of new technologies of interest to fabricators in printed circuit materials, laminate materials, polymer thick films and, most notably, its newest product line of embedded passive materials, DuPont Interra�.
Parts & Supplies | Assembly Accessories
TEST PCB LP3 ..00359534-01 Tester PEL-2002A Push pull tester NK-500 Neon lamp tester SX-C Test Probes (Universal Probe) TL20 Probes Connector Test Point temp (Male) SMPW-K-M. DIP TESTER DS-10
Parts & Supplies | Assembly Accessories
TEST PCB LP3 ..00359534-01 Tester PEL-2002A Push pull tester NK-500 Neon lamp tester SX-C Test Probes (Universal Probe) TL20 Probes Connector Test Point temp (Male) SMPW-K-M. DIP TESTER DS-10
Technical Library | 2019-07-10 23:36:14.0
Pockets of gas, or voids, trapped in the solder interface between discrete power management devices and circuit assemblies are, unfortunately, excellent insulators, or barriers to thermal conductivity. This resistance to heat flow reduces the electrical efficiency of these devices, reducing battery life and expected functional life time of electronic assemblies. There is also a corresponding increase in current density (as the area for current conduction is reduced) that generates additional heat, further leading to performance degradation.
Technical Library | 2019-06-04 10:19:46.0
Interconnection technology relies very heavily on the ability of the conductors on a printed wiring assembly to maintain reliable signal integrity. Harsh environmental factors can precipitate a loss of conductivity due to oxidation and corrosion. Connections are typically soldered or inserted using pressure fitted connectors to obtain enough surface contact to meet the electrical conductivity requirements. In pressure contacts, surface integrity is especially critical where the abrasive effects of retraction and insertion can wear off the metallic finish from the contact area. This can expose the underlying copper or nickel and lead to increased resistance at the contact points. These types of conductors are frequently found in card edge connectors where the terminations are plated with a layer of nickel and gold (frequently referred to as gold fingers). A hard gold is typically used containing very small amounts of nickel and cobalt to increase the wear resistance.
New Advanced Precision Auger Pump - Single Pump Solution The Precision Auger pump is designed to work with mid-to-high viscosity liquid such as glues, conductive, and non-conductive adhesive and pastes. The pump is controlled with a servo motor equ
https://www.ascen.ltd/Products/Solder_paste_printer/513.html full auto PCB screen printer and SMT solder paste printing machine with Image and optical system,It is a very accurate fully automatic SMT stencil printer.automatic PCB screen printer main
Training Courses | | | IPC-600 Specialist (CIS)
The Certified IPC-600 Specialist (CIS) training targets quality assurance and acceptance of bare printed circuit boards.
Training Courses | | | PCB Rework and Hand Soldering Courses
The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.
Events Calendar | Mon Sep 14 00:00:00 EDT 2020 - Mon Sep 14 00:00:00 EDT 2020 | ,
Printed Circuit Board (PCB) Inspection & Quality Control
Events Calendar | Mon Apr 12 00:00:00 EDT 2021 - Mon Apr 12 00:00:00 EDT 2021 | ,
Europe Chapter Webinar: Tombstoning Components during Reflow Soldering - Causes & Cures
Career Center | , Maryland USA | Engineering
Late stage start-up company, well into commercialization, that develops and manufactures products to precisely control the instantaneous release of heat energy for reaction initiation and joining applications. Building from its strengths in material
Career Center | Auckland, New Zealand | Engineering
NAVMAN PCBA NPI Engineer Reporting To: PCBA NPI Technical Leader Primary Objective: Transition of PCBs from R&D design to a manufacturable state conforming to all facets of PCBA production Secondary: Develop DFM & best practice guidelines Res
Career Center | seoul, South Korea | Engineering
I have 4 year process engineering in Motorola and 7 years service experience in Assemblen . 2 years in Mirtec AOI as service manager .
Career Center | binan city, Laguna Philippines | Engineering,Maintenance,Technical Support
6.5 Years Experience in Semiconductor Industry Specializing in Dispensing process and Equipment. 5.0 Years of Experience in Field Service Engineering. Machine Commissioning / Customer support 24 / 7, Technical Support for Customer machine and process
SMTnet Express, June 15, 2017, Subscribers: 30,470, Companies: 10,610, Users: 23,373 Nondestructive Inspection of Underfill Layers Stacked up in Ceramics-Organics-Ceramics Packages with Scanning Acoustic Tomography (SAT) Flex International
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/sonoscan/support/application-notes/1066-voids-in-solder
) Direct Bond Copper Defects - Application Note 1066 Sample & Method This rectifier has three ceramic substrates solder bonded to a copper base
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Damage Prevention When Soldering Ceramic Chip Capacitors | EPTAC Skip to content Scroll Toll Free: 800.643.7822 Toggle navigation Training All Classes
