Industry Directory | Consultant / Service Provider
Winslow Automation has been advancing lead finish and soldering technology for the military and aeropace, telecommunications, medical, and consumer electronics industry since its inception in 1986.
Industry Directory | Consultant / Service Provider / Distributor
Encore is an integrated electronic company that believes in making things better by electronic-engineering capabilities & bringing automation to our daily lives.
New Equipment | Rework & Repair Equipment
A lot of machine for an affordable price! The Model WDS-650 BGA Rework System has an 8mp High Resolution Split Vision Optical System for Removal, Placement, and Soldering of BGAs, CGA's, CSPs, QFPs, LGA's and Other SMDs. A great mid level system wit
New Equipment | Rework & Repair Equipment
The Model WDS-900 is a top-of-the-line Nitrogen Capable BGA Rework System with a High-Resolution Split Vision Optical System for Removal, Placement, and Soldering of BGAs, CGA's, CSPs, QFPs, LGA's and Other SMDs. An excellent BGA Rework Machine or f
Electronics Forum | Sat Sep 20 11:24:27 EDT 2003 | Gabriele
Few questions: - wich type of C-CGA ? (CAST or CLASP column to ceramic attach) - column pitch ? - column count ? - capped (with lid) ? or capless (c4 die on top)? - PCB board zize and thickness ? - volume of solder paste ? - Clean or not Clean so
Electronics Forum | Tue Feb 27 12:43:43 EST 2001 | gsmguru
I've used an on-axis camera lighting for other components with a good deal of success. (But not for CGA's in particular) I would think it should work pretty well for a CGA application. I've done some pretty odd looking parts with this type of lightin
Used SMT Equipment | Repair/Rework
2008 Hakko FR1418-03 BGA Rework Station Date of Manufacture: 2008 120 VAC , 15A IR Preheater Top Heater 14" x 20" Max Board Size Able to handle: BGA, CGA, QFP, LCC, TSOP and more Windows OS Gantry Style System Condition: Complete & Oper
Industry News | 2003-03-11 08:16:17.0
Lightspeed has already shipped its first product, and has set up production in a new building with up to date facilities and equipment.
Industry News | 2003-06-25 12:49:17.0
Additional state of the art automated surface mount assembly equipment has been installed to provide expanded capacity for advanced technology printed circuit assemblies
Parts & Supplies | Chipshooters / Chip Mounters
FUJI BOARD,PRINTED CIRCUIT XK02660 N210019284AA BLOCK KXFB05CGA01 BOLT N210009258AA PLATE KXFB05CKA01 COLLAR KXFB00PCA00 PAD N210018282AA COVER N210018289AA COVER KXFB02NSA00 BRACKET N210018280AA COVER KXF0DKLAA00 FILTER KXF09H6AA00 LOCK
.jpg)
Parts & Supplies | Pick and Place/Feeders
KXFB02GBC00 FRAME KXFB05CGA01 BOLT KXFB05CHB00 PLATE KXFB02GJA00 BLOCK KXFB02GKA00 BLOCK KXFB02GTA00 COVER KXFB02GUA01 COVER KXFB02NQA02 COVER KXFB02NSA00 BRACKET KXFB02NVA00 DOG KXFB02P2A00 DOG KXF0CLGAA00
Technical Library | 2013-03-14 17:19:28.0
Commercial-off-the-shelf ball/column grid array packaging (COTS BGA/CGA) technologies in high reliability versions are now being considered for use in a number of National Aeronautics and Space Administration (NASA) electronic systems. Understanding the process and quality assurance (QA) indicators for reliability are important for low-risk insertion of these advanced electronic packages. This talk briefly discusses an overview of packaging trends for area array packages from wire bond to flip-chip ball grid array (FCBGA) as well as column grid array (CGA). It then presents test data including manufacturing and assembly board-level reliability for FCBGA packages with 1704 I/Os and 1-mm pitch, fine pitch BGA (FPBGA) with 432 I/Os and 0.4-mm pitch, and PBGA with 676 I/Os and 1.0-mm pitch packages. First published in the 2012 IPC APEX EXPO technical conference proceedings.
Technical Library | 2017-06-22 17:11:53.0
C-mode scanning acoustic microscopy (C-SAM) is a non-destructive inspection technique showing the internal features of a specimen by ultrasound. The C-SAM is the preferred method for finding “air gaps” such as delamination, cracks, voids, and porosity. This paper presents evaluations performed on various advanced packages/assemblies especially flip-chip die version of ball grid array/column grid array (BGA/CGA) using C-SAM equipment. For comparison, representative x-ray images of the assemblies were also gathered to show key defect detection features of the two non-destructive techniques.
BGA component installation demo with the Shuttle Star SV560 that has the Side View Camera option.
BGA component installation demo with the Shuttle Star SV560 that has the Side View Camera option.
Training Courses | | | IPC-7711/7721 Specialist (CIS)
The Certified IPC-7711/7721 Specialist (CIS) training focuses on rework of electronic assemblies and repair and modification of printed boards and electronic assemblies.
Training Courses | | | IPC-7711/7721 Trainer (CIT)
The Certified IPC-7711/7721 Trainer (CIT) courses recognize individuals as qualified trainers in the area of rework and repair of printed boards and electronic assemblies and prepares them to deliver Certified IPC-7711/7721 (CIS) training.
Career Center | Wesley Chapel, Florida USA | Engineering,Management,Quality Control
15 years of experience on Electronic Manufacturing. Certified SMT Process Engineer TQM Knowledge Statistics DOE Screen Printer Thermal Process Knowledge JIT International Project Engineering Experience
1st Place Machinery Inc. | http://www.firstplacemachinery.com/firstplace_smt_pcb_semiconductor_rework_conceptronics.html
0.001 inches Handles both grid array and leaded type components. (BGA, CGA, QFP, LCC, TSOP, FLIP-Chip and many others.....) Able to repair board with up to a
Precision PCB Services, Inc | https://precision-pcb-services-inc.com/pages/about-us
BGA,CGA,QFN, POP, LGA, and other SMD packages. Rework delicate, heat-sensitive, SMD's with confidence. Expertly rework and repair complex PCBAs
