Flux application using the DispenseJet® pump is a superior alternative to screen printing and ultrasonic spray. Jet dispensing eliminates the overspray and material waste associated with ultrasonic and spray application methods. Flux application usi
Electronics Forum | Sat Aug 19 21:06:09 EDT 2006 | mika
Hi all, At our Fuji CP-6 machines we place a lot of 0402:s, 0603:s and 0805:s chip capacitors. Our problem is that the height of the components can sometime be very extreme from different vendors. I am sure you all have experience of this phenomenon
Electronics Forum | Fri Jun 14 09:15:02 EDT 2002 | edahi
DaveF, Yeah you got that right...because the initial stages of the project, the products would only attach 1 passive (capacitor) hell when things got too cheesy they wanted to attach 20 caps or so....this is not like board assembly, this only 1 Flip
Industry News | 2018-12-08 03:29:29.0
SMT Dictionary – Surface Mount Technology Acronym and Abbreviation
Industry News | 2018-12-13 03:35:05.0
Pick And Place Machine
Parts & Supplies | Pick and Place/Feeders
Device name: JUKI FX-1, JUKI FX-1 slider, used JUKI FX-1 slider Equipment Profile JUKI FX-1 high-speed patch machine Product Model: JUKI FX-1 not only inherits the traditional concept of modular mount machine, but also realizes a high-speed mount
Parts & Supplies | SMT Equipment
N610073252AA Main Body:NPM 1043889510AA ADJUST BOLT N610084824AA Label(Main Body):NPM N610073372AA Main Body (H):NPM N610073583AA CPU BOX & Wiring:NPM N610058919AM POWER UNIT:NPM N610087627AA Operation parts (H):NPM N610052923AA X-Axis:NP
Flux spray coating on a PCB with uniformal thickness down to 5 microns, with clear edge definition and minimal overspray. Can coat large or shoot dots with the same jet.
Career Center | Sta. Rosa, Philippines | Maintenance,Production,Technical Support
Complete knowledge in smt,aoi and reflow. 11 years working experienced in production and 5 years experienced in the field service job.
Career Center | Sta. Rosa, Manila Philippines | Technical Support
I am in the field of smt equipment for 15 years already and at present i am working as a Service Engineer for High Speed mounter machines . Our Company is solly Sales & Service providers of all pcb assembly and semiconductor equipment. I do inter
Are Separate Solder Flip-Chip Bonders Still Required? Are Separate Solder Flip-Chip Bonders Still Required? Increasing miniaturization is now encouraging manufacturers of handheld devices to stack bare dies or packages. As the process
1st Place Machinery Inc. | http://www.firstplacemachinery.com/firstplace_asymtek1020.html
pumps Supports a full range of applications, including flip chip and CSP underfill, dam and fill, die attach, and thermal compounds Unique CAN bus architecture for efficient operations now, and
| http://etasmt.com/cc?ID=te_news_industry,26561&url=_print
The overall objective in DCA (Direct Chip Attach) is to apply ample force to coin the bumps to approximately the same height while at the same time ensuring that maximum bump height is obtained thus keeping the die surface away from the flux
