Zymet's underfill encapsulants for flip chips are designed to enhance the thermal cycle performance. They incorporate silica filler, used to reduce the encapsulant’s CTE, that are highly engineered in both morphology and particle size distribution to
World's First Solder Joint Encapsulant Perfect solution for customers looking to eliminate underfilling processes. The SMT 256 Individual Solder Joint Encapsulation Adhesive is the world’s first combined flux gel/individual solder joint encapsulati
Electronics Forum | Thu Mar 26 11:25:21 EST 1998 | Earl Moon
In December and January (1997 & 1998) a number of people requested information regarding component cracking. I overlooked this until recently thinking design and process requirements were violated. After reviewing the last 14 months consulting effort
Electronics Forum | Wed Oct 26 11:51:06 EDT 2005 | moonshine
Don't V score, unless you absolutely have concurrence with your QUALIFIED fab and assembly operations. Routing is best for all chip devices close to board edge. It's better and cleaner for everything when seeking quality and reliability. Visit htt
Used SMT Equipment | Pick and Place/Feeders
The unique mounting technology is embodied in: Advanced PCB collision detection No impact force = no component cracking Pressure control for placement of closed loop For small batch and multi-variety work orders, no need to disassemble FEEDER, the mo
Used SMT Equipment | Pick and Place/Feeders
The unique mounting technology is embodied in: Advanced PCB collision detection No impact force = no component cracking Pressure control for placement of closed loop For small batch and multi-variety work orders, no need to disassemble FEEDER, the mo
Industry News | 2015-06-11 16:02:18.0
MIRTEC, "The Global Leader in Inspection Technology," will exhibit its most recent solutions for System in Package (SiP) inspection and measurement at SEMICON WEST 2015; July 14-16, 2015, at the Moscone Center in San Francisco, CA. Visitors are invited to booth # 2343 for a detailed demonstration of this exciting new technology.
Industry News | 2017-04-24 19:04:48.0
This year, MIRTEC will launch several new inspection machines equipped new cutting-edge technologies. MIRTEC is proud to be promoting these new machines in booth #1J10 at NEPCON China 2017, one of the biggest technical exhibitions of SMT and EMA, from April 25-27 at the Shanghai World EXPO Exhibition & Convention Center. MIRTEC’s new machines have been developed under a concept, ‘Perfect Inspection Solution’. This is an inspection concept involving the combination of 3D, 2D, and side-camera inspection.
Technical Library | 2023-11-27 18:19:40.0
This page introduces major causes and countermeasures of solder crack in MLCCs (Multilayer Ceramic Chip Capacitors). Major causes of solder cracks Solder cracks on MLCCs developed from severe usage conditions after going on the market and during manufacturing processes such as soldering. Applications and boards that specially require solder crack countermeasures Solder cracks occur mainly because of thermal fatigue due to thermal shock or temperature cycles or the use of lead-free solder, which is hard and fragile.
Technical Library | 2022-09-25 20:18:33.0
Printed circuit board (PCB) bending and/or flexing is an unavoidable phenomenon that is known to exist and is easily encountered during electronic board assembly processes. PCB bending and/or flexing is the fundamental source of tensile stress induced on the electronic components on the board assembly. For more brittle components, like ceramic-based electronic components, micro-cracks can be induced, which can eventually lead to a fatal failure of the components. For this reason, many standards organizations throughout the world specify the methods under which electronic board assemblies must be tested to ensure their robustness, sometimes as a pre-condition to more rigorous environmental tests such as thermal cycling or thermal shock.
http://yincae.com/index.html YINCAE SMT 256 Dipping Process YINCAE SMT 266 Jetting Process
This video presents how to replace and inspect BGA on PCB with our BGA rework station R720 & X ray inspection machine X6600. More details, pls contact me: WhatsApp?+86 18779975930 Skype?joyrongzhuomao@outlook.com Email: sales25@zhuomao.com.cn Link
Training Courses | | | Other Courses
Other courses related to electronics manufacturing and assembly
Career Center | binan city, Laguna Philippines | Engineering,Maintenance,Technical Support
6.5 Years Experience in Semiconductor Industry Specializing in Dispensing process and Equipment. 5.0 Years of Experience in Field Service Engineering. Machine Commissioning / Customer support 24 / 7, Technical Support for Customer machine and process
Career Center | , District of Columbia | Engineering,Management,Production,Sales/Marketing
• Strong technical leadership and decision-making skills; strong verbal and written communication skills to provide clear, crisp direction for key issue resolution; and good team skills to facilitate cross-functional cross -site team effectiveness.
SMTnet Express, October 28, 2021, Subscribers: 26,544, Companies: 11,461, Users: 26,907 Cracks: The Hidden Defect Cracks in ceramic chip capacitors can be introduced at any process step during surface mount assembly. Thermal shock
SMTnet Express, June 19, 2014, Subscribers: 22851, Members: Companies: 13906, Users: 36363 Anisotropic grain growth and crack propagation in eutectic microstructure under cyclic temperature annealing in flip-chip SnPb composite solder joints Y
| https://www.eptac.com/webinar/damage-prevention-when-soldering-ceramic-chip-capacitors/
Damage Prevention When Soldering Ceramic Chip Capacitors | EPTAC Skip to content Scroll Toll Free: 800.643.7822 Toggle navigation Training All Classes
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/asymtek/your-process/fluid-types/underfill
. Molded underfill is another approach that involves using resin to fill gaps between the chip and substrate. Without underfill, the life expectancy of a product would be significantly reduced due to the cracking of interconnects
