RCX Series Resistors Versatile Wrap-Around Chip With resistance values from 1ohm to 1Teraohm, RCX Series resistors are ideal for a wide variety of applications. Wraparound terminations are perfect for epoxy or solder attachmen
Electronics Forum | Fri Sep 15 04:09:15 EDT 2017 | philc
Yageo announced their decision to stop marking SMD resistors back in 2013, and since then we have started to see 0603's that aren't marked, but larger sizes - so far - are still showing a value. 0402's have never been marked, and I doubt they ever w
Electronics Forum | Thu Sep 11 23:50:51 EDT 2003 | Dean
Epoxy is hydroscopic. A cavity will form when the cure furnace reaches the boiling point of water. The steam expansion creates the pocket. It can be large enough to be filled with molten solder from the wave machine and cause a hard short under th
Industry News | 2018-12-08 03:29:29.0
SMT Dictionary – Surface Mount Technology Acronym and Abbreviation
Industry News | 2018-10-18 09:37:27.0
How To Set Profile In SMT Reflow Oven
Technical Library | 2021-08-25 16:28:36.0
In this study, a Sn–Bi composite solder paste with thermosetting epoxy (TSEP Sn–Bi) was prepared by mixing Sn–Bi solder powder, flux, and epoxy system. The melting characteristics of the Sn–Bi solder alloy and the curing reaction of the epoxy system were measured by differential scanning calorimeter (DSC). A reflow profile was optimized based on the Sn–Bi reflow profile, and the Organic Solderability Preservative (OSP) Cu pad mounted 0603 chip resistor was chosen to reflow soldering and to prepare samples of the corresponding joint. The high temperature and humidity reliability of the solder joints at 85 #14;C/85% RH (Relative Humidity) for 1000 h and the thermal cycle reliability of the solder joints from
Drop Impact Reliability of Edge-bonded Lead-free Chipscale Packages Drop Impact Reliability of Edge-bonded Lead-free Chipscale Packages This paper presents the drop test reliability results for edge-bonded 0.5mm pitch lead-free chip scale
| https://www.smtfactory.com/Working-principle-of-I-C-T-Lyra-Series-Reflow-Oven-id48502887.html
. If the peak temperature of Lyra Reflow Oven is too low, it is easy to produce cold junctions and insufficient wetting; if Lyra Reflow Oven is too high, the epoxy resin substrate and the plastic part will be coking and delamination prone to occur, and excessive eutectic metal compounds will form and cause brittleness
40731 | https://www.smta.org/smtai/SMTAI-2019-Technical-Program.pdf?v=200609010628
Surface Mount Technology Association (SMTA)
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