Industry Directory | Manufacturer / Distributor
Midwest Circuit Technology provides Carbide Router Bits and End Milling Cuters for use in PCB Depaneling equipment. We have over 35 years of supplying tools and machining experience in drilling, Routing, Test Fixture manufacture.
Industry Directory | Manufacturer
Precision Manual and Semiautomatic Screen and Stencil Printers for the electronics industry since 1979. Offline models for standard cast, tubular, and custom frames. Features include rugged durability, precise repeatability, and competitive pricing
New Equipment | Rework & Repair Equipment
BEST circuit frames come in both dry film and epoxy versions. We can produce circuit frames in 1 and 2 oz copper as well as with shiny tin or nickle gold coating. These circuit frames are microetched on the board side in order to insure better adhesi
New Equipment | Solder Paste Stencils
SMT Prototype Stencils are laser cut solder paste prototype stencils designed to work on their own for hand printing. These laser cut prototype stencils do not need to be permanently glued in a frame. These so-called framelessstencils are less expens
Electronics Forum | Sun Jan 22 09:44:17 EST 2006 | davef
Wire bonding is a die connect methodology that runs either gold or aluminum wires between pads on the integrated circuit to either a lead frame or pads on a printed circuit board. For more look here on Daan Terstegge's excellent link page http://www
Electronics Forum | Mon Oct 16 17:46:49 EDT 2006 | Dan
Recently I was given a bad Bios Link from Toshiba which fried my Bios and now my laptop boots to a black screen. I recently unsoldered and removed the existing Bios chip and have ordered anotherfor replacement. Unfortunately while removing, i damag
Used SMT Equipment | In-Circuit Testers
Immediate need for Agilent 3070 Series 3 or Series 5. Frame only with the appropriate inherent components to populate is fine too. Please send configuration details, photos, location & pricing! Thanks
Used SMT Equipment | Screen Printers
Substrate processing: Maximum substrate size (XxY): 609.6mmx508mm(24”x20”) For circuit boards larger than 20”, special fixtures are required Minimum substrate size (XxY): 50.8mmx50.8mm(2”x2”)
Industry News | 2003-05-30 08:09:11.0
A new compact package integrates a Hall-effect sensor IC with a back-biasing magnet to achieve high airgap performance and meet restrictive space requirement.
Industry News | 2003-01-29 13:23:31.0
A Common Drain Configuration that is 80% Smaller than Devices in the TSSOP-8 Package
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Parts & Supplies | Chipshooters / Chip Mounters
40000955 STOPPER FRAME FL E86247150A0 BOC LIGHT CIRCUIT BOARD ASM 40000957 STOPPER FRAME FL(L) E8624715AA0 BOC LIGHT PCB ASM 40000958 STOPPER FRAME FL(L) E86247290B0 LIGHT 3 BOARD UNIT ASM. 40000970 BU STOPER(
Parts & Supplies | Chipshooters / Chip Mounters
FUJI BOARD,PRINTED CIRCUIT ACP-126F FEPE2601 1001Y081010 GREASE 1001Y081020 GREASE 1001Y081030 GREASE 1001Y081040 GREASE 1001Y081050 GREASE 1001Y081060 GREASE 1001Y081080 GREASE 1001Y081100 GREASE 058SA OIL 1001Y081220 OIL 0594A OIL 1001
Technical Library | 2022-03-16 19:41:17.0
Creep corrosion occurs in electronics assemblies and it is reminiscent to electromigration but does not require electrical field to drive the reaction. Corrosive elements and moisture must be present for creep corrosion to occur. Sulfur is the most prominent element to cause creep corrosion in environments such as paper mills, rubber manufacturing, mining, cement manufacturing, waste water treatment etc., also including companies and locations nearby such industries. The main part of printed circuit board assembly (PCBA) to be affected is the PCB surface finish. Especially immersion silver is prone to creep corrosion, but it sometimes occurs in NiPd (lead frames), and to a lesser extent in ENIG and OSP surface finishes. As the use of immersion silver is increasing as PCB surface finish and electronics are more and more used in harsh environments, creep corrosion is a growing risk. In this paper we will present the driving forces and mechanisms as well as suitable tests and mitigation strategies against creep corrosion
Technical Library | 2023-08-04 15:38:36.0
The MicroLeadFrame® (MLF®)/Quad Flat No-Lead (QFN) packaging solution is extremely popular in the semiconductor industry. It is used in applications ranging from consumer electronics and communications to those requiring high reliability performance, such as the automotive industry. The wide acceptance of this packaging design is primarily due to its flexible form factors, size, scalability and thermal dissipation capabilities. The adaptation and acceptance of MLF/QFN packages in automotive high reliability applications has led to the development of materials and processes that have extended its capabilities to meet the performance and quality requirements. One of process developments that is enabling the success of the MLF/QFN within the automotive industry has been the innovation of side wettable flanks that provide the capability to inspect the package lead to printed circuit board (PCB) interfaces for reliable solder joints. Traditionally, through-board X-ray was the accepted method for detecting reliable solder joints for leadless packages. However, as PBC layer counts and routing complexities have increased, this method to detect well-formed solder fillets has proven ineffective and incapable of meeting the inspection requirements. To support increased reliability and more accurate inspection of the leadless package solder joints, processes to form side-wettable flanks have been developed. These processes enable the formation of solder fillets that are detectable using state-of-the-art automated optical inspection (AOI) equipment, providing increased throughput for the surface mount technology (SMT) processes and improved quality as well.
E86857000A0 TF AMP CIRCUIT BOARD ASM. E8685700AB0 TF 32 UNIT N ASM. E8760452F00 TUBE E8760452G00 TUBE E8760452H00 TUBE E8760452J00 VINYL TUBE E1326725000 FRAME SR E1327706000 CAM FOLLOWER RETURN SP E132772100A COVE
E86507550A0 AC SERVO CONTROL C.BOARD ASM. E8651700000 MOTHER BOARD (P1.52 ROD) E8651705000 CUP BOARD E86517050A0 BOARD E8651715000 ARCNET PCB E86517150A0 ARCNET PCB ASM.(MAIN FRAME) E8651715AA0 ARCNET PCB A ASM.(HLC)
Career Center | Brooklyn, New York USA | Engineering,Management
Mini-Circuits designs, manufactures and distributes integrated circuits, modules, and sub-systems for high performance radio frequency (RF) and microwave applications. With design, sales and manufacturing locations in over 30 countries, Mini-Ci
Career Center | maple heights, Ohio USA | Production,Technical Support
Certified SMT operator, experience in surface mount and through hole soldering, took courses in AC/DC Electronics, Electronic Devices I and II, Microprocessors, Programmable Logic Controllers, Electronics Communications Systems, Control Systems, Netw
Career Center | Vadodara, Gujarat India | Management,Research and Development,Sales/Marketing
# Proven track record of Leadership, Responsibility, Learning Abilities and Entrepreneurship. # Qualifications in Science, eCommerce, Software Technology and Entrepreneurship. # Over 18 years experience in Sales and Marketing, Business Developme
Development of Ultra-Multilayer Printed Circuit Board Development of Ultra-Multilayer Printed Circuit Board This article introduces the technical development that went in to realizing an 80-layer ultra-multilayer printed circuit board, which meets
Midwest Circuit Technology provides Carbide Router Bits and End Milling Cuters for use in PCB Depaneling equipment. We have over 35 years of supplying tools and machining experience in drilling, Routing, Test Fixture manufacture.
114 Barrington Town Square
Aurora, OH USA
Phone: 13309956900
