Industry Directory | Manufacturer
We are a manufacturer of Reed Switches, SMD Reed Sensors and other customized Magnetic sensing solutions, incorporated in 1971.
New Equipment | Cleaning Equipment
A Complete Stencil Cleaning Process - From One Source! Clean solder paste, adhesives and flux residue in one machine Two ultrasonic wash tanks eliminate cross contamination issues Safely clean solder paste at ambient temperature and othe
New Equipment | Cleaning Equipment
The most advanced ultrasonic stencil cleaning system! Clean solder paste, adhesives and flux residue in one machine Easy loading / unloading only 39" H Uses less chemistry Generates less wastewater Increased ultrasonic cleaning e
Electronics Forum | Mon Mar 05 13:08:16 EST 2001 | billschreiber
Hi Roger, Our customers use their Smart Sonic Stencil Cleaners for cleaning SMT and wave pallets. There are two primary protocols used. 1) If you have a large quantity of pallets and they are becoming contaminated rapidly, a dedicated stencil clean
Electronics Forum | Tue May 20 12:20:58 EDT 2003 | billschreiber
Hello Mike, We have just sent out the press releases. 440-R SMT Detergent, the only chemistry to complete the EPA's Environmental Technology Verification (ETV) Program, as part of the Smart Sonic Stencil Cleaning Process, is now available for use i
Used SMT Equipment | Other Equipment
Domnick Hunter MIDIGAS6-C Nitrogen Gas Generator Flow rate: 113 SCFH of 99.99% purity N2 delivered at 87 psig Includes: buffer vessel, oxygen analyzer & flow verification device Inlet air required: 13 scfm at 115 psig into the generator
Industry News | 2022-10-12 11:23:36.0
In the SMT industry, there are many types of cleaning machines. According to the cleaning things, there are stencil cleaner, PCBA cleaner, Wave Oven Pallet/Fixture cleaner, Mis-Print PCB cleaner, Squeegee cleaner, Nozzle cleaner, PCB surface cleaner and so on.
Industry News | 2022-05-18 12:39:01.0
XDry Corp. today announced the appointment of TechSystems as its newest manufacturers' representative. Under the agreement, Chris Putney, President of TechSystems, will represent the XDry line of humidity-controlled storage cabinets throughout Northern California and Western Nevada.
Technical Library | 2013-07-11 15:22:40.0
This research paper will focus on the effect of various parameters that are used to reball a BGA and their effect on the overall shear strength. Factors that will be looked at include the type of BGA (SAC305 or 63Sn/37Pb), the alloy used to reball (SAC405 or 63Sn/37Pb), the type of flux used (Water Soluble or No Clean), and the environment in which reballing takes place (Nitrogen or Ambient).
Technical Library | 2017-08-17 12:23:27.0
A novel epoxy flux EF-A was developed with good compatibility with no-clean solder pastes, and imparts high reliability for BGA assembly at a low cost. This compatibility with solder pastes is achieved by a well-engineered miscibility between epoxy and no-clean solder paste flux systems, and is further assured with the introduction of a venting channel. The compatibility enables a single bonding step for BGAs or CSPs, which exhibit high thermal warpage, to form a high-reliability assembly. Requirements in drop test, thermal cycling test (TCT), and SIR are all met by this epoxy flux, EF-A. The high viscosity stability at ambient temperature is another critical element in building a robust and userfriendly epoxy flux system. EF-A can be deposited with dipping, dispensing, and jetting. Its 75°C Tg facilitates good reworkability and minimizes the adverse impact of unfilled underfill material on TCT of BGA assemblies.
The most advanced ultrasonic stencil cleaning system! Clean solder paste, adhesives and flux residue in one machine Easy loading / unloading only 39" H Uses less chemistry Generates less wastewater Increased ultrasonic cleaning e
The first ergonomicly designed front-loading ultrasonic stencil cleaner The ErgoSonic Model Stencil & Pallet Cleaner is fully automatic and programmable. The operator loads the stencil into an empty chamber and selects the desired cleaning profile.
| http://etasmt.com/cc?ID=te_news_bulletin,23568&url=_print
. Process and design-related causes: • Improper pad design • Weak solder paste (for ambient con-ditions) • Expired solder paste • Misaligned print (overlapping solder mask
| https://www.smtfactory.com/PCBA-Cleaning-Machine-PCB-Defluxing-For-Best-Coating-and-Bonding-Effect-id43566387.html
cleaning is a full and important production step. But even with the so-called no-clean manufacturing, it may be that these components must be cleaned to avoid malfunctions
.png)
winsouce.jpg)
