Industry Directory | Manufacturer
COT specializes in high quality SMT nozzles and consumables for pick and place machines. We provide special engineering design service of custom nozzles for those unique and odd components.
Industry Directory | Manufacturer / Other
We are based in Singapore and in the US and we are a worldwide distributor of Paper Lead frame & Boardframe for mold cleaning and dummy molding.
High Precision Dispensers - MAX Series (Non-Heated) Max Series is capable of a wide variety of dispense applications including MicroVolume, Solder Paste and Conductive Adhesive, Underfill, Surface Mount Adhesive, Dam and Fill, Encapsulations, LED En
Precision Dispensing System for Heated Dispense Applications The GPD Global MAX II is a compact; high-accuracy system designed for today’s advanced heated dispensing applications. The frame is molded from “liquid rock” which gives the system a stabl
Electronics Forum | Wed Jul 21 17:49:52 EDT 2004 | jsk
problem: Too many solvents and boards are not clean Flux remains on the board after vapor degreaser and "Powdery" white residue after vapor degreasing Flux type is kester 186 Process: hand solder High Temp alloy, spot clean after hand solder e
Electronics Forum | Fri Jul 23 14:41:41 EDT 2004 | Steve Stach
Dear JSK, It sounds like the root causes of your problem are two fold. First, excessive heat will polymerize the abietic acid found in rosin forming neo-abietic diamers and polymers which are much less soluble than the parent monomer. There are
Industry News | 2003-04-30 08:51:08.0
Electrolube played the role of environmental champion in Australia recently.
Industry News | 2008-10-20 20:33:29.0
ROSEMONT, IL � Industry-leading associations IPC and SMTA jointly announce that Steve Stach, President of Austin American Technology, will moderate a collaborative panel discussion on process integration. The panelists will comprise OEM and EMS process engineers who have experience and expertise in implementing cleaning processes. The panelists include Dave Adams of Rockwell Collins, Jerry Purnell of Philips Medical, Jeff Kennedy of Celestica, Jim Raby of STI Electronics, Dale Lee of Plexus, and Linda Woody of Lockheed Martin. The symposium, jointly sponsored by IPC and SMTA, will be held at Crowne Plaza Chicago O'Hare in Rosemont, IL on October 28-29, 2008.
Detailed Product Description Original: Japan Model: KG9-M3455-11X Condition: Original New Application: YV100II Machine Part Name: Feeder Sensor Brand: Yamaha KG9-M3455-11X,Sensor R-S Assy for Feeder on Assembleon Emerald and YV88 machines
Technical Library | 1999-05-09 12:36:40.0
The production of electronics began with hand soldering, followed by manual cleaning, which reached its peak during the NASA program. Each step in the process tended to be considered on a stand alone basis, without thought being given to the preceding and following steps. Since each step had its own set of specifications, this led to a "patchwork" approach to overall quality.
Technical Library | 2015-09-23 22:08:32.0
A molded interconnect device (MID) is an injection molded thermoplastic substrate which incorporates a conductive circuit pattern and integrates both mechanical and electrical functions. (...) Flip chip bonding of bare die on MID can be employed to fully utilize MID’s advantage in device miniaturization. Compared to the traditional soldering process, thermo-compression bonding with gold stud bumps provides a clear advantage in its fine pitch capability. However, challenges also exist. Few studies have been made on thermocompression bonding on MID substrate, accordingly little information is available on process optimization, material compatibility and bonding reliability. Unlike solder reflow, there is no solder involved and no “self-alignment,” therefore the thermo-compression bonding process is significantly more dependent on the capability of the machine for chip assembly alignment.
High Precision Dispensers - MAX Series (Non-Heated) Max Series is capable of a wide variety of dispense applications including MicroVolume, Solder Paste and Conductive Adhesive, Underfill, Surface Mount Adhesive, Dam and Fill, Encapsulations, LED En
Precision Dispensing System for Heated Dispense Applications The GPD Global MAX II is a compact; high-accuracy system designed for today’s advanced heated dispensing applications. The frame is molded from “liquid rock” which gives the system a stabl
Events Calendar | Mon Apr 23 00:00:00 EDT 2018 - Thu Apr 26 00:00:00 EDT 2018 | Shanghai, China
SMTA China East Conference 2018
Career Center | San Pedro Sula, Cortes Honduras | Engineering,Maintenance,Management,Technical Support
Preventive maintenance on SMT machines. Corrective maintenance on SMT Machines Schedule of preventive maintenance programs. Minimum Inventory control for spare parts Automation process on SMT Lines Work Instructions for maintenance procedur
Career Center | Melbourne, Florida USA | Management,Production,Quality Control
Technical Skills/Abilities: � Management � Quality Assurance � Strong Troubleshooting Skills � Strategic Planning � Employee Training � Quality Assurance � Problem Resolution � Mechanical/Technical Aptitude
SMTnet Express, September 24, 2015, Subscribers: 23,507, Members: Companies: 14,658, Users: 39,014 Gold Stud Bump Flip Chip Bonding on Molded Interconnect Devices Dick Pang, Weifeng Liu, Anwar Mohammed, Elissa Mckay, Teresita Villavert and Murad
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/applications/molding?con=t&page=30
: Precision Molding Equipment IMAPS Device Packaging 2018 Nordson ASYMTEK Nordson ASYMTEK presenting on underfill dispensing for chip-on-wafer and high-throughput jetting in micro-device packaging at
GPD Global | https://www.gpd-global.com/co_website/features-needlecleaner.php
. Our automated nozzle cleaner can remove this drop of fluid ensuring a consistent dispense process. Nozzle cleaning is done prior to the automated nozzle calibration routine, and can be programmed for the beginning of a program or at any time during a program
COT specializes in high quality SMT nozzles and consumables for pick and place machines. We provide special engineering design service of custom nozzles for those unique and odd components.
2481 Hilton Drive
Gainesville, GA USA
Phone: (770) 538-0411
