Industry Directory | Consultant / Service Provider / Events Organizer / Marketing Agency / Media / Publisher / Online Resource / Other
SEO 1A provides internet marketing services for manufacturers, sales reps, distributors, & service providers. These services span a wide range of options, catering to companies of all sizes. Experts at optimizing SMTnet promo!
Industry Directory | Consultant / Service Provider
MicroType Engineering strives to offer expertise, technical know-how, and advanced methodology to make your product design become a reality. We specialize in consumer electronics design and rapid prototyping.
When Applications Require Large Board Processing &/or Versatility The DS Series of dispensers is a robust, large format platform designed to handle all types of applications with ease. Ideal for dispense applications utilizing adhesive, solder paste
New Equipment | Education/Training
IPC - Association Connecting Electronics Industries® offers globally recognized industry-traceable training and certification programs on key Electronics Industry Standards. Blackfox, founded in 1996, is the premier Worldwide Approved IPC Training Ce
Electronics Forum | Thu Nov 07 10:59:11 EST 2002 | pjc
IPC-7525 "Stencil Design Guidelines" is a good reference document to have. Here are notes from a Tessera, (a major mBGA mfg.), study- "Application Note Solder Stencil Requirement for mBGA" The stencil aperture is to be square, equal in size to the l
Electronics Forum | Thu Nov 07 09:23:05 EST 2002 | russ
What would the considerations be in utilizing a type 4 paste as opposed to type 3? We have an assembly that has a large amount of uBGAs (12 mil diam pad)along with 50 mil pitch BGAs assorted fine pitch etc... We are experiencing difficulty in paste
Used SMT Equipment | X-Ray Inspection
Type: microme|x 180 SN:ANA01C0006-133908 Vintage: 2008 230 V 50/60 Hz 2000 VA 8.7 A 10 A
Used SMT Equipment | Screen Printers
MPM-COOKSON, Serigraphic printing machine, type SPEEDLINE ULTRAPRINT 3000 - UP 3000/A, s.n. UO826/RF, with contrast support pins, online automatic frame cleaning (paper and solvent), double center camera 2D ( fiducial control 2D paste inspection), in
Industry News | 2017-05-03 23:42:40.0
GPD Global offers a breakthrough in uniform fluid dispensing and repeatability by ensuring a consistent fluid supply to the pump regardless of reservoir size or fluid level.
Industry News | 2013-10-08 18:35:41.0
GPD Global will debut its patent-pending FPC (Fluid Pressure Control) Dispensing System at SMTA International. FPC offers a breakthrough in uniform fluid dispensing by ensuring a consistent supply of fluid to the pump regardless of reservoir size or fluid level.
Parts & Supplies | SMT Equipment
YAMAHA TYPE 82A NOZZLE ASSY Email: jenny@ksunsmt.com Skype:jenny@ksunsmt.com MP: 0086-15629932323 What's app: 15629932323
Parts & Supplies | SMT Equipment
YAMAHA TYPE 82A NOZZLE ASSY /SMT YV100XG YAMAHA NOZZLE YV100X/ 82A / 0603X/ 82#/ YT16/0603
Technical Library | 2023-01-17 17:12:33.0
Reflowed indium metal has for decades been the standard for solder thermal interface materials (solder TIMs or sTIMs) in most high-performance computing (HPC) TIM1 applications. The IEEE Heterogeneous Integration Thermal roadmap states that new thermal interface materials solutions must provide a path to the successful application of increased total-package die areas up to 100cm2. While GPU architectures are relatively isothermal during usage, CPU hotspots in complex heterogeneously-integrated modules will need to be able to handle heat flux hotspots up to 1000W/cm2 within the next two years. Indium and its alloys are used as reflowed solder thermal interface materials in both CPU and GPU "die to lid/heat spreader" (TIM1) applications. Their high bulk thermal conductivity and proven long-term reliability suit them well for extreme thermomechanical stresses. Voiding is the most important failure mode and has been studied by x-ray. The effects of surface pretreatment, pressure during reflow, solder flux type/fluxless processing, and preform design parameters, such as alloy type, are also examined. The paper includes data on both vacuum and pressure (autoclave) reflow of sTIMs, which is becoming necessary to meet upcoming requirements for ultralow voiding in some instances.
Technical Library | 1999-08-27 09:29:49.0
Contract packaging houses have to contend with a large mix of die types and products. Flexibility and quick turnaround of package types is a must in this industry. Traditional methods of die encapsulation, (i.e., use of transfer-molding techniques), are only cost effective when producing a large number of components. Liquid encapsulants now provide similar levels of reliability1, and are cost effective...
Time Pressure Liquid Dispensing Pump with Foot switch / Dry contact A great addition to Fully Automatic Dispensing System Time pressure is a versatile method of dispensing that functions across a wide range of viscosities. This dispensing method wo
Cost-effective Solutions for Conformal Coating New cost-effective, automated Conformal Coating System (SimpleCoat TR) with tilt and rotate capability and excellent repeatability for just under $48,000. SimpleCoat basic model without tilt and rotate
Training Courses | | | PCB Rework and Hand Soldering Courses
The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.
Training Courses | ONLINE | ON DEMAND | PCB Assembly Courses
The PCB assembly courses provide knowledge of different processes and equipment used in TH and SMT assembly of printed circuit boards.
Events Calendar | Thu Jun 14 00:00:00 EDT 2018 - Fri Jun 15 00:00:00 EDT 2018 | ,
SMT Process Fundamentals for Tin-Lead and Lead Free Assembly - SMTA Webtorial
Events Calendar | Tue Jul 10 00:00:00 EDT 2018 - Thu Jul 12 00:00:00 EDT 2018 | San Francisco, California USA
Semicon West
Career Center | bbsr, orissa India | Technical Support
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Career Center | Irvine, California USA | Quality Control
In Process Testing / QA Inspector In-circuit testing of SMD type assemblies Functionally test SMD type assemblies Visually inspect SMD type assemblies Load and unload (burn-in, etc.) Must be physically fit, able to lift up to 10 pounds Must have goo
Career Center | Damascus, Syria | Engineering,Maintenance,Production,Technical Support
Experience : 1- PCB Test Engineer For Telecom Products And TV - LCD Manufacturing as follow : - In-Circuit and Automatic Test Equipment Test - in-circtuit Emulator - Function Test - Automatic Optical Inspection Test - Toubleshooting Axial
Career Center | Cavite, Philippines | Engineering,Technical Support
I had 15 years Handling SMT Equipment.
SMTnet Express, October 1, 2015, Subscribers: 23,533, Members: Companies: 14,674, Users: 39,065 Printing of Solder Paste - A Quality Assurance Methodology Lars Bruno, Tord Johnson; Ericsson AB and MTEK Consulting AB Solder paste printing
SMTnet Express February 28, 2013, Subscribers: 26214, Members: Companies: 13305, Users: 34373 Effect of Cooling Rate on the Intermetallic Layer in Solder Joints While it has long been known that the Cu6Sn5 intermetallic that plays a critical role
Lewis & Clark | https://www.lewis-clark.com/product-tag/pansonic-cm402l-pick-place/
Pansonic CM402L Pick & Place Archives - Lewis and Clark, Inc. Skip to content My Cart: $ 0.00 0 View Cart Checkout No products in the cart. Subtotal
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/polymer-processing-systems/products/pelletizers/type-a-pelletizer
BKG Pelletizer Type A | Nordson POLYMER PROCESSING SYSTEMS Polymer Processing Systems BKG - EDI Corporate | Global Directory