Industry Directory | Manufacturer
EMSYDEL Electronics is a India based EMS services company capablae of working with complex Boards using SMT, THT lead free services. Run by technocrats , EMSYDEl differentiates itself through a planned and Tailored client benefits association.
This family of three air-actuated heads provides accurate force setting from 0.5lbs to 100 lbs. Extruded head mounts and built-in thermode co-planarity adjustment mean easy systems integration.
Amfax a3Di is not an AOI (Automated Optical Inspection) system. It is a revolutionary laser based metrology measurement system that enables you to find faults on your populated PCB assemblies like never before. The extremely accurate measurement capa
Electronics Forum | Wed May 16 02:59:53 EDT 2007 | pavel_murtishev
Good morning, What kind of placement equipment do you use? Many of placement machines have co-planarity check sensors. Switch them on. BR, Pavel
Electronics Forum | Mon Apr 09 11:39:32 EDT 2018 | emeto
The easiest way to do without special tools is to use level. Check machine co-planarity on the conveyor rails in both directions(you can do that with rails down or rails up or both). Then check co-planarity on the stencil. If the level shows the sam
Used SMT Equipment | AOI / Automated Optical Inspection
Mirtec AOI MV-7XI FIVE CAMERA 2D/3D In-Line AOI System Exclusive OMNI-VISION® 2D/3D Inspection Technology Exclusive FIFTEEN MEGA PIXEL ISIS® Vision System 10 Micron / Precision TELECENTRIC COMPOUND LENS Advanced 3D DIGITAL MULTI-FREQUENCY
Used SMT Equipment | Pick and Place/Feeders
Mirtec AOI MV-7omni Description In-Line AOI Machine FIVE CAMERA 2D/3D In-Line AOI System Exclusive OMNI-VISION® 2D/3D Inspection Technology Exclusive FIFTEEN MEGA PIXEL ISIS® Vision System 10 Micron / Precision TELECENTRIC COMPOUND LENS Advanced 3D
Industry News | 2011-10-03 15:37:21.0
The SMTA announced a session on Challenges and Solutions for PCB Technology which will take place on Tuesday, October 18 during their annual conference, SMTA International
Industry News | 2011-08-17 12:59:10.0
The SMTA announced that SMTA International will provide updated research on Head-in-Pillow component soldering defects as well as a focused tutorial on the subject. SMTAI will take place October 16-20, 2011 in Ft. Worth, Texas.
Technical Library | 2014-03-06 19:04:07.0
Over the last few years, there has been an increase in the rate of Head-in-Pillow component soldering defects which interrupts the merger of the BGA/CSP component solder spheres with the molten solder paste during reflow. The issue has occurred across a broad segment of industries including consumer, telecom and military. There are many reasons for this issue such as warpage issues of the component or board, ball co-planarity issues for BGA/CSP components and non-wetting of the component based on contamination or excessive oxidation of the component coating. The issue has been found to occur not only on lead-free soldered assemblies where the increased soldering temperatures may give rise to increase component/board warpage but also on tin-lead soldered assemblies.
Technical Library | 2023-01-10 20:15:42.0
Over the past years there has been consistent growth in the use of electroless nickel / immersion gold (ENIG) as a final finish. The finish is now frequently being used for PBGA, CSP, QFP and COB and more recently gathered considerable interest as a low cost under-bump metallization for flip chip bumping application. One of the largest users for this finish has been the telecommunication industry, were millions of square meters of PCBs with ENIG have been successfully used. The nickel layer offers advantages such as multiple soldering cycles and hand reworks without copper dissolution being a factor. The nickel also acts as a reinforcement to improve through-hole and blind micro via thermal integrity. In addition the nickel layer offers advantages such as co-planarity, Al-wire bondability and the use as contact surface for keypads or contact switching. Especially those pads, which are not covered by solder need a protective coating in corrosive environment – such as high humidity or pollutant gas.
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/top-10-smt-new-product-stories-of-2014_topic1520_post6150.html
. The solder's wetting ability results in bright, smooth, and shiny solder joints. Consistent transfer efficiencies reduce head-in-pillow defects even when component/substrate co-planarity is not optimal. At
Heller Industries Inc. | https://hellerindustries.com/semiconductor-advance-packaging/
. Heller offers ovens which combine formic reflow acid with a vacuum process, or vacuum formic acid reflow (VFAR). VFAR has been shown to be beneficial with fine pitch bumping applications by providing improved bump co-planarity, decreased solder wicking, and reduced solder voiding
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