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TDC3000 SYSTERM CARDS 51304516-200,51305348-100,51304584-100,51401583-100, 51304362-150,51309152-100,51304485-100,51304441-100, 51402615-400,51401583-100,51196654-100,51402089-100, 51304685-150,51304511-100,51304511-200,51304754-150, 51304337-15
1785-L11B 1785-L20B 1785-L20C15 1785-L20E 1785-L26B 1785-L30B 1785-L40B 1785-L40C15 1785-L40E 1785-L40L 1785-L46B 1785-L46C15 1785-L60B 1785-L60L 1785-L80B 1785-L80C15 1785-L80E 1785-L86B 1785-M100 1785-ME16 1785-ME32 1785-ME64
Electronics Forum | Fri Sep 10 15:15:09 EDT 2021 | majdi4
Hello to all , Could you help with this defect .. Tombstoning 0201 , always at the same place in board , only this component near to the coax connector..with a defect rate of 2 % ..All the process is perfect . i cheked : stencil design , SPI resul
Electronics Forum | Thu Jan 14 22:52:28 EST 1999 | Wayne
I am experiencing a problem with a surface mount coax connector that over time pulls loose from the PWB. The connector has 4 small gold plated leads and we are soldering it to a flash gold board. A cable plugs into the connector and puts some const
Used SMT Equipment | In-Circuit Testers
Stanford Research CG635The CG635 generates extremely stable square wave clocks between 1 Hz and 2.05 GHz. The instrument's high frequency resolution, low jitter, fast transition times, and flexible output levels make it ideal for use in the developme
Used SMT Equipment | In-Circuit Testers
Stanford Research CG635 The CG635 generates extremely stable square wave clocks between 1 Hz and 2.05 GHz. The instrument's high frequency resolution, low jitter, fast transition times, and flexible output levels make it ideal for use in the deve
Industry News | 2022-12-14 12:21:04.0
MIRTEC will premier its complete line of 3D AOI and SPI Inspection Systems in Booth #1841 at the 2023 IPC APEX EXPO. The premier technical conference and exhibition for the electronics manufacturing industry will take place Jan. 24-26, 2023, at the San Diego Convention Center in California.
Industry News | 2023-04-11 09:52:04.0
MIRTEC will premier its complete line of 3D AOI and SPI Inspection Systems at SMTconnect, scheduled to take place May 9-11, 2023 in Nuremberg, Germany. The company will showcase a total of five (5) Inspection Systems specifically designed to address the full spectrum of inspection requirements associated with the electronics manufacturing industry in Hall 4A, Stand 128.
Technical Library | 2020-05-07 03:46:27.0
The selective soldering process has evolved to become a standard production process within the electronics assembly industry, and now accommodates a wide variety of through-hole component formats in numerous applications. Most through-hole components can be easily soldered with the selective soldering process without difficulty, however some types of challenging components require additional attention to ensure optimum quality control is maintained. Several high thermal mass components can place demands on the selective soldering process, while the use of specialized solder fixtures and/or pallets often places an additional thermal demand on the preheating process. Fine-pitch through-hole components and connectors place a different set of demands on the selective soldering process and typically require special attention to lead projection and traverse speed to minimize bridging between adjacent pins. Dual in-line memory module (DIMM) connectors, compact peripheral component interface (cPCI) connectors, coax connectors and other high thermal mass components as well as fine-pitch microconnectors,can present challenges when soldered into backplanes or multilayer printed circuit board assemblies. Adding to this challenge, compact peripheral component interface connectors can present additional solderability issues due to their beryllium copper termination pins.
Technical Library | 2022-08-08 15:06:06.0
Selective soldering has evolved to become a standard production process within the electronics assembly industry, and now accommodates a wide variety of through-hole component formats in numerous applications. Most through-hole components can be easily soldered with the selective soldering process without difficulty however some types of challenging components require additional attention to ensure that optimum quality is maintained. Several high thermal mass components can place demands on the selective soldering process, while the use of specialized solder fixtures, or solder pallets, often places additional thermal demand on the preheating process. Fine-pitch through-hole components and connectors place a different set of demands on the selective soldering process and typically require special attention to lead projection and traverse speed to minimize bridging between adjacent pins. Dual in-line memory module (DIMM) connectors, compact peripheral component interface (cPCI) connectors, coax connectors and other high thermal mass components as well as fine-pitch microconnectors, can present challenges when soldered into backplanes or multilayer printed circuit board assemblies. Adding to this challenge, compact peripheral component interface connectors can present additional solderability issues because of their beryllium copper base metal pins. Key Terms: Selective soldering, drop-jet fluxing, sustained preheating, flux migration, adjacent clearance, lead-to-hole aspect ratio, lead projection, thermal reliefs, gold embrittlement, solderability testing.
This video is no longer up-to-date - please visit the URL below for the latest Mix-Tek video: https://youtu.be/YCAO5HpVhkg Datamate Mix-Tek - High-Rel Mixed Layout Connectors combine signal (3A), power (20A) & coax (6Ghz) contacts to reduce PCB foot
Training Courses | | | IPC/WHMA-A-620 Specialist (CIS) Recert.
The Certified IPC/WHMA-A-620 Specialist (CIS) recertification courses are intended for those individuals who were previously certified as IPC/WHMA-A-620 Specialist.
Connector Models - Are They Any Good? Connector Models - Are They Any Good? by: Jim Nadolny, Leon Wu; Samtec, Inc. Channel simulations are only as accurate as the models used to develop them. While we have seen much effort placed on printed
SMTnet Express, June 6, 2019, Subscribers: 31,985, Companies: 10,763, Users: 26,199 Rework of New High Speed Press Fit Connectors Credits: HDP User Group More and more people and things are using electronic devices to communicate. Subsequently
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