Industry Directory | Manufacturer
Shenzhen Huancheng Automation equipment Co.,ltd (referred to as the "HC"), a High-speed developing enterprise specializing in High Precision Automatic Solder Paste Printer research and development.
Industry Directory | Marketing Agency
Marketing strategies and programs that focus on measurable, bottom-line results for industrial companies, including increased revenue and reduced cost per acquisition.
• Automatic operation without Contact: Ring Setting, Diameter Inspection, Effective Drill Bit Length Inspection. • Unique Image Processing Technology: Inspection automatically & check the defective drill bit. • The carry box can comply with all diffe
Albendazole CAS no. 54965-21-8 is an organic compound having Mol . formula C12 H15 N3O2S , mol. Wt 265.33 gm. /mol. is a white to off white powder form. It is associated with the family of Benzimidazole and hence an important derivative of Benzimidaz
Electronics Forum | Tue Mar 14 13:00:38 EDT 2017 | stephendo
I had a nitrogen salesman in yesterday. He brought his technical support person with him. He said he could add a pre-filter just before the machine regulator. I asked him about it and he said that if you get a pin-prick hole in your piping you can
Electronics Forum | Mon Mar 25 15:32:34 EDT 2013 | jimmyboz
Are you concerned with physical vibration or electronic interference? If you can see your morning coffee have "rings", screen printers may suffer. Trains are a monsterous source of electrical "noise", just by thier engine (electric and diesel) not
Used SMT Equipment | General Purpose Equipment
ASM MS899-DL Wafer Mapping Die Sorter Machine is in like new condition! Serial Number: MS899DL-01817-0402 Model Number: MS899-DL Year 2008 August Cycle Time: 175 ms XY Placement: +/- 1.5 mil Die Rotation: +/- 3 degrees Collect type: Surfa
Used SMT Equipment | Pick and Place/Feeders
Automatic pick and place machine TP400V is the high cost-effective equipment in the market, it can pick and place variety of components by its vacuum nozzle. The machine can mount 0603、 SOIC、PLCC、QFP IC and many SMD chip components; optional vision
Industry News | 2018-10-18 11:19:07.0
How To Design Cost-Effective PCBs
Industry News | 2019-03-03 18:51:58.0
The SMTA Capital Chapter and UP Media Group/Circuits Assembly Magazine are pleased to co-sponsor this Chapter Tutorial Program on March 28 featuring presentations by Yaad Eliya and Jim Barry of PCB Technologies.
Parts & Supplies | SMT Equipment
yamaha Seals O ring if need more info about the products , pls don’t hesitate to contact with us at any time.More info pls visit our website:www.ksunsmt.com. Email: alice@ksunsmt.com Skype: alice@ksunsmt.com Whats app: +86 13170471806
Parts & Supplies | Pick and Place/Feeders
O RING FOR FEEDER BASE if need more info about the products , pls don’t hesitate to contact with us at any time.More info pls visit our website:www.ksunsmt.com. Email: alice@ksunsmt.com Skype: alice@ksunsmt.com Whats app: +86 13170471806
Technical Library | 2016-09-08 16:27:49.0
In this investigation a test matrix was completed utilizing 900 electrodes (small circuit board with parallel copper traces on FR-4 with LPI soldermask at 6, 10 and 50 mil spacing): 12 ionic contaminants were applied in five concentrations to three different spaced electrodes with five replicas each (three different bare copper trace spacing / five replications of each with five levels of ionic concentration). The investigation was to assess the electrical response under controlled heat and humidity conditions of the known applied contamination to electrodes, using the IPC SIR (surface insulation resistance) J-STD 001 limits and determine at what level of contamination and spacing the ionic / organic residue has a failing effect on SIR.
Technical Library | 2020-12-29 20:55:46.0
Voiding in solder joints has been studied extensively, and the effects of many variables compared and contrasted with respect to voiding performance. Solder paste flux, solder powder size, stencil design, circuit board design, via-in-pad design, surface finish, component size, reflow profile, vacuum reflow, nitrogen reflow and other parameters have been varied and voiding quantified for each. The results show some differences in voiding performance with respect to most of these variables but these variables are not independent of each other. Voiding in solder joints is a complex issue that often requires multiple approaches to reduce voiding below required limits. This paper focuses on solutions to voiding for commonly used bottom terminated components (BTCs).
To see more about the Jade MKII Single Point Selective Soldering System visit Pillarhouse USA at: https://www.pillarhouse.co.uk/products/selective-soldering-handload/jade-mkii-handload Entry-level, single point selective soldering system Designed t
https://www.ascen.ltd/Products/PCB_board_assembly_system/vision_measurin/507.html Vision Measuring Machine and image measuring instrument can be used for dimensional accuracy measurement of various molds, aircraft, automobile, mobile phone, computer,
Training Courses | | | IPC-600 Specialist (CIS)
The Certified IPC-600 Specialist (CIS) training targets quality assurance and acceptance of bare printed circuit boards.
, Nick Munson, Steve Ring, Evan Briscoe.; Foresite In