manufacturer of transformers, inductors, chokes, coils, filters, and switching power supplies from China.
Eurocoin is Europe's leading supplier to the coin-operated machine industry. Our major product lines are coin and banknote validators, TFT-LCD panels, tokens & gaming chips, touchscreens and spares. We offer pan-European sales and technical support.
Wireless connectivity is fast becoming recognized as a flexible and reliable medium for data communications across a broad range of applications. In vending machines and on-location sales equipment, embedded transceivers can send alerts when replenis
EZ-BoardWare is a range of SMT PCB Hardware from Harwin that allows simplified EMC shielding, improves cable management and solves tricky PCB layout issues. Packaged in EIA-481-2 compliant tape & reel packaging the products integrate simply into exis
Electronics Forum | Fri Oct 17 06:44:32 EDT 2014 | hemant_pang23
We are doing hand soldering for the 'BATTERY LITHIUM COIN CELL 3V CR 2032 but now we want do the soldering through wave soldering process ,for avoiding the shortckt only one pin will get solder through wave process and other pin will be soldered manu
Electronics Forum | Tue Oct 27 03:22:43 EDT 2015 | pvogel
I'm looking for some SMD shims or something to solve this problem. We have a coin cell on a PCB and the side that contacts the PCB also has traces under the cell that don't connect to the cell. So I'm after some small dots of something suitable for
Industry News | 2019-04-30 17:39:40.0
The SMTA Capital Chapter and UP Media Group/Circuits Assembly Magazine are pleased to co-sponsor an amazing Chapter Tutorial Program. The tutorial will be held on June 11 and showcase the latest technologies, designs and reliability trends.
Industry News | 2019-03-03 18:51:58.0
The SMTA Capital Chapter and UP Media Group/Circuits Assembly Magazine are pleased to co-sponsor this Chapter Tutorial Program on March 28 featuring presentations by Yaad Eliya and Jim Barry of PCB Technologies.
Technical Library | 2024-08-29 18:30:46.0
The mechanical experience of consumption (i.e., feel, softness, and texture) of many foods is intrinsic to their enjoyable consumption, one example being the habit of twisting a sandwich cookie to reveal the cream. Scientifically, sandwich cookies present a paradigmatic model of parallel plate rheometry in which a fluid sample, the cream, is held between two parallel plates, the wafers. When the wafers are counterrotated, the cream deforms, flows, and ultimately fractures, leading to separation of the cookie into two pieces. We introduce Oreology (/Oriːˈɒl@dʒi/), from the Nabisco Oreo for "cookie" and the Greek rheo logia for "flow study," as the study of the flow and fracture of sandwich cookies. Using a laboratory rheometer, we measure failure mechanics of the eponymous Oreo's "creme" and probe the influence of rotation rate, amount of creme, and flavor on the stress–strain curve and postmortem creme distribution. The results typically show adhesive failure, in which nearly all (95%) creme remains on one wafer after failure, and we ascribe this to the production process, as we confirm that the creme-heavy side is uniformly oriented within most of the boxes of Oreos. However, cookies in boxes stored under potentially adverse conditions (higher temperature and humidity) show cohesive failure resulting in the creme dividing between wafer halves after failure. Failure mechanics further classify the creme texture as "mushy." Finally, we introduce and validate the design of an open-source, three-dimensionally printed Oreometer powered by rubber bands and coins for encouraging higher precision home studies to contribute new discoveries to this incipient field of study
Technical Library | 2009-02-26 03:25:09.0
STI has developed a patented1 packaging technology coined Imbedded Component/Die Technology (IC/DT®) to integrate multiple subsystems within an electronics assembly into a single, advanced, high-density assembly. Imbedded Component/Die Technology (IC/DT®) enables the manufacturing and assembly of smaller, lighter, and more technologically advanced high density CCAs through imbedding unpackaged components in a 3-D laminate substrate with integrated thermal management
EZ-BoardWare is a range of SMT PCB Hardware from Harwin that allows simplified EMC shielding, improves cable management and solves tricky PCB layout issues. Packaged in EIA-481-2 compliant tape & reel packaging the products integrate simply into exis
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/fr-fr/products/polymer-processing-systems-products/edi-deckling-systems
systèmes de pont externes comprennent des ponts à corps fixe ou flexible, des ponts coulissants en porte-à-faux de style coin et notre système FastDeckle™, doté
| http://etasmt.com/cc?ID=te_news_industry,26561&url=_print
The overall objective in DCA (Direct Chip Attach) is to apply ample force to coin the bumps to approximately the same height while at the same time ensuring that maximum bump height is obtained thus keeping the die surface away from the flux
