Industry Directory: column grid (3)

Winslow Automation (aka Six Sigma)

Industry Directory | Consultant / Service Provider

Winslow Automation has been advancing lead finish and soldering technology for the military and aeropace, telecommunications, medical, and consumer electronics industry since its inception in 1986.

EMSYDEL Electronics

Industry Directory | Manufacturer

EMSYDEL Electronics is a India based EMS services company capablae of working with complex Boards using SMT, THT lead free services. Run by technocrats , EMSYDEl differentiates itself through a planned and Tailored client benefits association.

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New SMT Equipment: column grid (3)

BGA Rework Services

BGA Rework Services

New Equipment | Rework & Repair Services

BGA Rework Services Offered  BGA Remove and Placement Level Three Pad Repair Wire Add Trace Repair BGA Re-Balling BGA Inspection We Rework PBGA (Plastic Ball Grid Array) TBGA (Tape Ball Grid Array) uBGA (Micro BGA) CCGA (Ceramic Colum

Precision PCB Services, Inc

BGA Reballing

BGA Reballing

New Equipment |  

Salvage indispensible Ball Grid Arrays. Artek Manufacturing will: *Clean and Bake out all contaminants and moisture *Clean out all exsisting Solder *Replace solder spheres according to manufacture's specs *Bake out BGA prior to packing in MSD package

Artek Manufacturing Inc

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Electronics Forum: column grid (20)

re-columning?

Electronics Forum | Fri Nov 03 11:27:49 EST 2006 | kennyg

Does anyone know of a source for salvaging column grid arrays with damaged columns (through bad handling or removed from a PCBA)? Not reballing, but recoluming.

Ceramic Column Grid Array on non woven aramid reinforced pcbs

Electronics Forum | Fri Jun 25 14:22:40 EDT 2004 | jjh

Will there be any problems with reflow when using CCGAs on nonwoven aramid reinforced pcbs? thanks!

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Used SMT Equipment: column grid (1)

Universal Instruments GSMxs SMT Pick & Place

Universal Instruments GSMxs SMT Pick & Place

Used SMT Equipment | Pick and Place/Feeders

Small foot print GSM with Linear Motors like a Genesis. Flip Chip Application Die Attach Application Building CBGA (ceramic ball grid array) and CCGA (ceramic column grid array) components. Building PBGA (plastic ball grid array) com

Capital Equipment Exchange

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Industry News: column grid (15)

IPC J-STD-001E Released: Industry Requirements for Soldered Electrical and Electronic Assemblies Updated

Industry News | 2010-04-10 02:07:54.0

IPC has released the E revision of IPC J-STD-001, Requirements for Soldered Electrical and Electronic Assemblies. Recognized worldwide as the sole industry-consensus standard for soldering processes and materials, IPC J-STD-001E encompasses advanced technologies and provides new and updated criteria for all three classes of construction as well as expanded support for lead-free manufacturing.

Association Connecting Electronics Industries (IPC)

Four Industry Leaders Receive IPC President’s Award

Industry News | 2020-02-18 14:13:29.0

Michael Ford, Dale Lee, Joe O’Neil and S. Manian Ramkumar honored for their on-going leadership in IPC and the electronics industry

Association Connecting Electronics Industries (IPC)

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Technical Library: column grid (3)

Assembly and Reliability of 1704 I/O FCBGA and FPBGAs

Technical Library | 2013-03-14 17:19:28.0

Commercial-off-the-shelf ball/column grid array packaging (COTS BGA/CGA) technologies in high reliability versions are now being considered for use in a number of National Aeronautics and Space Administration (NASA) electronic systems. Understanding the process and quality assurance (QA) indicators for reliability are important for low-risk insertion of these advanced electronic packages. This talk briefly discusses an overview of packaging trends for area array packages from wire bond to flip-chip ball grid array (FCBGA) as well as column grid array (CGA). It then presents test data including manufacturing and assembly board-level reliability for FCBGA packages with 1704 I/Os and 1-mm pitch, fine pitch BGA (FPBGA) with 432 I/Os and 0.4-mm pitch, and PBGA with 676 I/Os and 1.0-mm pitch packages. First published in the 2012 IPC APEX EXPO technical conference proceedings.

Jet Propulsion Laboratory

Defect Features Detected by Acoustic Emission for Flip-Chip CGA/FCBGA/PBGA/FPBGA Packages and Assemblies

Technical Library | 2017-06-22 17:11:53.0

C-mode scanning acoustic microscopy (C-SAM) is a non-destructive inspection technique showing the internal features of a specimen by ultrasound. The C-SAM is the preferred method for finding “air gaps” such as delamination, cracks, voids, and porosity. This paper presents evaluations performed on various advanced packages/assemblies especially flip-chip die version of ball grid array/column grid array (BGA/CGA) using C-SAM equipment. For comparison, representative x-ray images of the assemblies were also gathered to show key defect detection features of the two non-destructive techniques.

Jet Propulsion Laboratory

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Events Calendar: column grid (1)

BGA & Area Array Failures, Causes & Corrective Actions Online Webinar

Events Calendar | Mon Mar 16 00:00:00 EDT 2020 - Mon Mar 16 00:00:00 EDT 2020 | ,

BGA & Area Array Failures, Causes & Corrective Actions Online Webinar

Surface Mount Technology Association (SMTA)

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Career Center - Jobs: column grid (2)

Advanced Manufacturing Technology Engineer

Career Center | Space Coast, Florida USA | Engineering,Research and Development

Board Level Assembly BGA Expert! We are in need of an Electronic Packaging or Advanced Manufacturing Engineer to work with the Advanced Manufacturing Technology Group of a major Florida based Communications company. Support IR&D and Program activit

Priority Search

Senior Advanced Packaging Engineer

Career Center | Melbourne, Florida USA | Engineering

Advanced Manufacturing Technology Position Description Job Description: AMT Engineer � Level 4 Support IR&D and Program activities Division wide working on the development, qualification, and implementation of electronic packaging technologies, wi

Harris Corporation

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Express Newsletter: column grid (140)

SMTnet Express March 14 - 2013, Subscribers: 26245

-off-the-shelf ball/column grid array packaging (COT

Reliability Enhancement of Wafer Level Packages with Nano-Column-Like Hollow Solder Ball Structures

Reliability Enhancement of Wafer Level Packages with Nano-Column-Like Hollow Solder Ball Structures Reliability Enhancement of Wafer Level Packages with Nano-Column-Like Hollow Solder Ball Structures by: Ronak Varia, Xuejun Fan; Lamar University

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column grid searches for Companies, Equipment, Machines, Suppliers & Information

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