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Electronics Forum | Mon Mar 05 15:29:50 EST 2007 | ck_the_flip
When no-clean flux and no-clean soldering first came out in the late 80's / early 90's, there were lots of White Papers written about conformal coating adhesion and no-clean flux. I'm pretty sure all CC's will adhere to today's chemistries. To be o
Electronics Forum | Tue Jul 04 02:31:55 EDT 2006 | Mustang
Calling for an input from the Experts our there. Our customer is questioning the cleanliness of the no-clean product that we produced for them. We were asked to clean the board (localised cleaning) after rework (IC need to be changed due to an up re
Industry News | 2017-07-14 13:24:26.0
Saelig Company announces the availability of two new TekBox TBCGx Comb Generators for EMC testing. The TBCG1 is a radiating comb generator with an internal dipole antenna and a base frequency of 100MHz. It radiates a comb spectrum that is characterized up to 6GHz. The comb generator is intended as a quick reference for testing radiated noise measurements in anechoic chambers, TEM/GTEM cells, shielded chambers, or to gauge the effectiveness of cable shielding and other shielding materials.
Industry News | 2022-04-28 14:58:03.0
Magnalytix, the forefront driver in providing real-time reliability solutions for electronics manufacturing, is thrilled to announce that Co-Inventor Dr. Mike Bixenman will present "Electrochemical Reliability of 2-D and 3-D Models as a Function of the Electrical Field Effects" on Tuesday, May 17, 2022, at the Park Plaza Victoria in Amsterdam from 3:30-4 p.m.
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Technical Library | 2020-11-24 23:01:04.0
The miniaturization trend is driving industry to adopting low standoff components or components in cavity. The cost reduction pressure is pushing telecommunication industry to combine assembly of components and electromagnetic shield in one single reflow process. As a result, the flux outgassing/drying is getting very difficult for devices due to poor venting channel. This resulted in insufficiently dried/burnt-off flux residue. For a properly formulated flux, the remaining flux activity posed no issue in a dried flux residue for no-clean process. However, when venting channel is blocked, not only solvents remain, but also activators could not be burnt off. The presence of solvents allows mobility of active ingredients and the associated corrosion, thus poses a major threat to the reliability. In this work, a new halogen-free no-clean SnAgCu solder paste, 33-76-1, has been developed. This solder paste exhibited SIR value above the IPC spec 100 MΩ without any dendrite formation, even with a wet flux residue on the comb pattern. The wet flux residue was caused by covering the comb pattern with 10 mm × 10 mm glass slide during reflow and SIR testing in order to mimic the poorly vented low standoff components. The paste 33-76-1 also showed very good SMT assembly performance, including voiding of QFN and HIP resistance. The wetting ability of paste 33-76-1 was very good under nitrogen. For air reflow, 33-76-1 still matched paste C which is widely accepted by industry for air reflow process. The above good performance on both non-corrosivity with wet flux residue and robust SMT process can only be accomplished through a breakthrough in flux technology.
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