Industry Directory: common msl components (20)

Admired Services Electronic Components

Industry Directory | Distributor

Admired Services Electronic Components is a trusted distributor of obsolete and current electronic components. Products include military parts, semiconductors, passive components and ICs.

Taiwan Dry Tech Corp.

Industry Directory | Consultant / Service Provider / Manufacturer / Other

Taiwan Dry Tech Corp. manufacturer of Eureka Dry Tech Fast Super Dryers for moisture/humidity proof protective storage of PCB, MSD, IC packages, meets IPC/JEDEC J-STD-033 & IPC-1601.

New SMT Equipment: common msl components (347)

Precision Lead Former for Taped RADIAL Components (CF-9)

Precision Lead Former for Taped RADIAL Components (CF-9)

New Equipment | Lead Forming

The CF-9 Radial Lead Former forms and cuts 2- and 3-leaded taped radial components such as TO-92s, capacitors, transistors, LEDs, etc. - precisely and repeatedly, in standard and special forms. This machine is capable of forming and cutting up to 25

GPD Global

Time Pressure Liquid Dispensing Pump with Foot Switch or Dry Contact

Time Pressure Liquid Dispensing Pump with Foot Switch or Dry Contact

New Equipment | Dispensing

Time Pressure Liquid Dispensing Pump with Foot switch / Dry contact A great addition to Fully Automatic Dispensing System Time pressure is a versatile method of dispensing that functions across a wide range of viscosities. This dispensing method wo

GPD Global

Electronics Forum: common msl components (467)

Most common BGA types

Electronics Forum | Tue Oct 01 18:32:55 EDT 2002 | davef

We don't like ministencils. Consider using the patterns listed in the Practical Components and Topline catalogs. Few BGA we see have a 3X3 courtyard.

smt common pad 0402 and 1206 package

Electronics Forum | Fri May 06 08:47:05 EDT 2016 | davef

You're correct. This design will have a record amount of 0402 rework for tombstoning and misalignments. Suggest that the pads on each end of all components be the same size in order to balance wetting forces during reflow.

Used SMT Equipment: common msl components (20)

Samsung SM481 high speed chip mounter

Samsung SM481 high speed chip mounter

Used SMT Equipment | Flexible Mounters

Product Name: Samsung SM481 high speed chip mounter Product number: SM481 Detailed product introduction Samsung SM481 high speed chip mounter parameters SM481 is based on the platform of high-speed SMT SM471 the fastest equipment at strengthening

DONGGUAN KINGSUN AUTOMATION TECHNOLOGY CO.,LTD

Samsung original SM481 high speed chip mounter

Samsung original SM481 high speed chip mounter

Used SMT Equipment | SMT Equipment

Product Name: Samsung SM481 high speed chip mounter Product number: SM481 Detailed product introduction Samsung SM481 high speed chip mounter parameters SM481 is based on the platform of high-speed SMT SM471 the fastest equipment at strengthening

DONGGUAN KINGSUN AUTOMATION TECHNOLOGY CO.,LTD

Industry News: common msl components (551)

Jetting Pump Configurations Now Available for Integrating into Third Party Dispense Systems.

Industry News | 2016-05-10 14:16:16.0

GPD Global offers individual pumps for integration into your existing platform – the Jetting NCM5000 Pump is one of them. The Jetting NCM5000 Pump simplifies jetting to its basic elements: hammer, pin, and nozzle. Only the pin and nozzle are wetted parts. This means easy set-up, cleaning, and upkeep.

GPD Global

Logistics Firms Grabbing More EMS Business

Industry News | 2003-02-11 08:42:41.0

To Handle Outbound Logistics Projects for OEMs and to Gain Greater Insight into Their Customers' Requirements for Global Direct-order Fulfillment

SMTnet

Parts & Supplies: common msl components (16)

Juki High Speed Technology SMT JUKI Chip Mounter Machine FX-3 With Multi Laser Head

Juki High Speed Technology SMT JUKI Chip Mounter Machine FX-3 With Multi Laser Head

Parts & Supplies | Assembly Accessories

SMT JUKI High-speed Modular Mounter FX-3 with better price now JUKI HIGHT SPEED SHOOTER KE2050 KE2060 KE2070 KE2080 KE1070 KE1080 FX-1R FX-2 FX-3 Sell & Buy smt machine and spare parts. Pls don't hesitate to contact me if you have any requi

KingFei SMT Tech

Samsung J90550209B SM421 Common Nozzle SMT Nozzle Holder SM421 / SM321 Z Aixs Holder

Samsung J90550209B SM421 Common Nozzle SMT Nozzle Holder SM421 / SM321 Z Aixs Holder

Parts & Supplies | Component Packaging

J90550209B SM421 Common Nozzle SMT Nozzle Holder SM421 / SM321 Z Aixs Holder Detailed Product Description Part Name: SM421 Z Axis Holder Part Number: J90550209B Location: China Shenzhen Color: Black Machine Model: SM321 SM421 Brand: Sams

KingFei SMT Tech

Technical Library: common msl components (37)

SMT Printing Collapse Causes and Countermeasures --KINGSUN

Technical Library | 2023-12-15 03:06:24.0

The first process in the SMT industry is solder paste printing. After the solder paste printing is completed, electronic components are attached to PCB pads through a SMT machine, and then reflow soldered. A preliminary PCB board is roughly processed. SMT is a combination of multiple devices, and such a line is called an SMT production line. Our common PCBA is processed through this process. In SMT technology, each process is very important, and poor quality can be caused by different process defects. Today, we are discussing the causes and countermeasures of SMT printing collapse.

DONGGUAN KINGSUN AUTOMATION TECHNOLOGY CO.,LTD

Throughput vs. Wet-Out Area Study for Package on Package (PoP) Underfill Dispensing

Technical Library | 2012-12-17 22:05:22.0

Package on Package (PoP) has become a relatively common component being used in mobile electronics as it allows for saving space in the board layout due to the 3D package layout. To insure device reliability through drop tests and thermal cycling as well as for protecting proprietary programming of the device either one or both interconnect layers are typically underfilled. When underfill is applied to a PoP, or any component for that matter, there is a requirement that the board layout is such that there is room for an underfill reservoir so that the underfill material does not come in contact with surrounding components. The preferred method to dispensing the underfill material is through a jetting process that minimizes the wet out area of the fluid reservoir compared to traditional needle dispensing. To further minimize the wet out area multiple passes are used so that the material required to underfill the component is not dispensed at once requiring a greater wet out area. Dispensing the underfill material in multiple passes is an effective way to reduce the wet out area and decrease the distance that surrounding components can be placed, however, this comes with a process compromise of additional processing time in the underfill dispenser. The purpose of this paper is to provide insight to the inverse relationship that exists between the wet out area of the underfill reservoir and the production time for the underfill process.

ASYMTEK Products | Nordson Electronics Solutions

Videos: common msl components (61)

Precision Lead Former for Raidal Components (CF9)

Precision Lead Former for Raidal Components (CF9)

Videos

The CF-9 Radial Lead Former forms and cuts 2- and 3-leaded taped radial components such as TO-92s, capacitors, transistors, LEDs, etc. - precisely and repeatedly, in standard and special forms. This machine is capable of forming and cutting up to 25

GPD Global

Bulk capacitor component foot forming machine SC-104A designed for cutting plug-in components

Bulk capacitor component foot forming machine SC-104A designed for cutting plug-in components

Videos

Name:Semi-automatic capacitor cutting machine Model:SC-104A Voltage :220V AC 60Hz/50Hz 40W Size:L360*W300*H350MM Weight:35kg Efficiency:2500-3000PCS/H (It depends on the worker) Features: 1. suitable for bulk, tube radial parts cutting foot ope

Shenzhen Honreal Technology Co.,Ltd

Training Courses: common msl components (24)

Component Indentification Certification

Training Courses | | | PCB Assembly Courses

The PCB assembly courses provide knowledge of different processes and equipment used in TH and SMT assembly of printed circuit boards.

EPTAC Corporation

Component Identification Online Live Certification

Training Courses | ON DEMAND | | PCB Assembly Courses

The PCB assembly courses provide knowledge of different processes and equipment used in TH and SMT assembly of printed circuit boards.

EPTAC Corporation

Events Calendar: common msl components (10)

Monitoring & Bench marking Your Processes and Assembly Yields

Events Calendar | Mon Aug 10 00:00:00 EDT 2020 - Mon Aug 10 00:00:00 EDT 2020 | ,

Monitoring & Bench marking Your Processes and Assembly Yields

Surface Mount Technology Association (SMTA)

Webinar: BGA and Area Array Process Defects - Causes & Cures

Events Calendar | Tue Feb 12 00:00:00 EST 2019 - Tue Feb 12 00:00:00 EST 2019 | ,

Webinar: BGA and Area Array Process Defects - Causes & Cures

Surface Mount Technology Association (SMTA)

Career Center - Jobs: common msl components (14)

Debug Technician

Career Center | Fremont, California USA | Engineering

Troubleshoot and repair to component level a variety of digital and analog circuits Provide rework, assembly and testing instruction in support manufacturer(s) Rework various surface mount components in digital and analog circuits Perform

Unigen Corporation

Senior Quality Control Inspector

Career Center | Clinton, Connecticut USA | Quality Control

Connecticut based contract manufacturer of printed circuit board assemblies seeking an experienced Quality Control Inspector. This is a full time position at a company the offers health benefits, 401K working in a clean, pleasant and congenial atmosp

Argo EMS, a Division of The Eastern Company

Career Center - Resumes: common msl components (12)

Michael Cooper (BSEE)

Career Center | Fayetteville, Arkansas USA | Engineering,Production

I enjoyed working in Electronics Manufacturing while in college (BSEE) and would like to pursue an engineering job in a related field.

Benjamin J Veenema

Career Center | Palm Bay, Florida USA | Engineering,Production

1 year of SMT production experience in a low/med volume, high mix environment.  IPC-A-610 Certified Specialist.   Reflow profiling experience Heavy CAM programming experience with prototypes and new products

Express Newsletter: common msl components (770)

Counterfeit Electronic Components: Understanding the Risk

Counterfeit Electronic Components: Understanding the Risk SMTnet Express March 8, 2012, Subscribers: 24981, Members: Companies: 8818, Users: 32801 Counterfeit Electronic Components: Understanding the Risk by: John M. Radman, Renee J. Michalkiewicz

Partner Websites: common msl components (1706)

Common Application Challenges

ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/sealant-equipment/resources/common-application-challenges

” coating provides abrasion resistance for rods, cylinders, and valve components. In This Section Resources Gain confidence in your dispensing Meter Selection Guide Cutting Edge Sealing Technology Common Application Challenges Product Literature Video Gallery Back To Top Nordson SEALANT EQUIPMENT

ASYMTEK Products | Nordson Electronics Solutions

3 Common PCB Design Mistakes

| https://www.eptac.com/blog/3-common-pcb-design-mistakes

.) Landing Patterns While most PCB design software includes libraries of common electrical components, their correlating schematic symbols, and landing patterns , some boards will require the designer


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High Throughput Reflow Oven
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Reflow Soldering Oven & Pressure Curing Oven Manufacturer in India