Industry Directory | Consultant / Service Provider
Samtec is recognized as the service leader in the connector industry. Most Samtec products fall into one of three categories: high speed (signal integrity), micro pitch, and rugged/power products.
Industry Directory | Manufacturer
A worldwide leader in Automated Optical andx-ray Inspection systems
Radial Lead Trimming Machine For Components with In-Line Leads Loosen 4 adjustment knobs - Slide head to desired cut length per scale reading Place component on slotted track Check track slot width and adjust upper guide height Set knob to desi
We specialize in Equipment Leases that meet the needs of your customers. Our leasing solutions include fair market value (true) leasing, fixed option, one-dollar purchase option (buy equipment at end of lease for $1), and buy-back leasing. High Fall
Electronics Forum | Mon Sep 20 10:17:19 EDT 1999 | Jeanjean
Hi all, As a student in elctronic sciences, I'd like to know why there is a difference in the voltage required for PC boards with surface mounted devices and the voltage needed by traditionnal components like leaded film capacitors? I wonder if it
Electronics Forum | Mon Sep 20 11:50:26 EDT 1999 | Wolfgang Busko
| Hi all, | | As a student in elctronic sciences, I'd like to know why there is a difference in the voltage required for PC boards with surface mounted devices and the voltage needed by traditionnal components like leaded film capacitors? | | I won
Used SMT Equipment | Waste Management
Hepco 1500-SP2 Radial Lead Trimming Machine:SN: 4346 General specs:HEPCO 1500-1 RADIAL LEAD TRIMMING MACHINE DESCRIPTION:Radial Lead Trimming Machine For Components with In-Line LeadsLoosen 4 adjustment knobs - Slide head to desired cut length per sc
Used SMT Equipment | THT Equipment
We Bought This Machine Brand New, it is in Flawless Condition!! Low Use. HEPCO 1500-1 Radial Lead Trimming Machine Radial Lead Trimming Machine For Components with In-Line Leads • Loosen 4 adjustment knobs -
Industry News | 2015-04-07 11:25:45.0
MIRTEC will highlight its award-winning 2D/3D In-Line AOI Series configured with MIRTEC’s exclusive OMNI-VISION® 3D Inspection Technology in its distributor pb tec solutions’ booth, # 7A-504, at the SMT/Hybrid/Packaging 2015 exhibition, scheduled to take place May 5-7, 2015 at the Messe in Nuremberg, Germany.
Industry News | 2015-10-22 16:28:47.0
MIRTEC, “The Global Leader in Inspection Technology,” will premier the technologically advanced MV-6 OMNI 3D Series in Hall A2, Stand 139 at the upcoming Productronica international trade fair, scheduled to take place November 10-13, at the Messe in Munich, Germany.
Parts & Supplies | Repair/Rework
PG-P6860 Main Features: 1、 The top heater can move freely along the X, Y axis in the IR preheating area. It is good for many BGA chips distribution at different positions in the PCB board which need repair. X-shaped infrared laser can do rapid lo
Parts & Supplies | Repair/Rework
PG-P6800 Main Features: 1、There are 3 independent heaters. The 1st and 2nd hot-air heaters can control multiple groups and segments temperature parameters. The 2nd heater can move up and down. The 3rd large area IR heater can preheat the PCB boar
Technical Library | 2023-01-17 17:22:28.0
The impact of voiding on the solder joint integrity of ball grid arrays (BGAs)/chip scale packages (CSPs) can be a topic of lengthy and energetic discussion. Detailed industry investigations have shown that voids have little effect on solder joint integrity unless they fall into specific location/geometry configurations. These investigations have focused on thermal cycle testing at 0°C-100°C, which is typically used to evaluate commercial electronic products. This paper documents an investigation to determine the impact of voids in BGA and CSP components using thermal cycle testing (-55°C to +125°C) in accordance with the IPC- 9701 specification for tin/lead solder alloys. This temperature range is more typical of military and other high performance product use environments. A proposed BGA void requirement revision for the IPC-JSTD-001 specification will be extracted from the results analysis.
Technical Library | 2015-01-05 17:38:26.0
The impact of voiding on the solder joint integrity of ball grid arrays (BGAs)/chip scale packages (CSPs) can be a topic of lengthy and energetic discussion. Detailed industry investigations have shown that voids have little effect on solder joint integrity unless they fall into specific location/geometry configurations. These investigations have focused on thermal cycle testing at 0°C-100°C, which is typically used to evaluate commercial electronic products. This paper documents an investigation to determine the impact of voids in BGA and CSP components using thermal cycle testing (-55°C to +125°C) in accordance with the IPC-9701 specification for tin/lead solder alloys. This temperature range is more typical of military and other high performance product use environments. A proposed BGA void requirement revision for the IPC-JSTD-001 specification will be extracted from the results analysis.
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http://www.pcb-separator.com/html/PRODUCTS/PCB%20separator/2015/0607/137.html ?????????/V-cut depaneling/PCB Depanelers/??pcb????/PCB cutting machine/pcb depaneling machine/depanelizing pcb
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Leadership and Communication Training Series
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Career Center | Sugar land, Texas USA | Engineering,Maintenance,Management,Production,Sales/Marketing,Technical Support
Production Management, SMT, Manufacturing Engineering, Programming, CircuitCam, Inventory Control, AOI, Fuji AIM/ NXT, Assembleon, Universal, Quad, Mydata, Heller, DEK, Mirtec, Aqueous Tech, MPM, Resys, Vapor Phase, Juki, Selective Soldering, HMP, El
Career Center | Sugar land, Texas USA | Engineering,Maintenance,Management,Production,Purchasing,Sales/Marketing,Technical Support
Production Management, SMT, Manufacturing Engineering, Programming, CircuitCam, Inventory Control, AOI, Fuji AIM/ NXT, Assembleon, Universal, Quad, Mydata, Heller, DEK, Mirtec, Aqueous Tech, MPM, Resys, Vapor Phase, Juki, Selective Soldering, HMP, El
Imbedded Component/Die Technology (IC/DT®) News Forums SMT Equipment Company Directory Calendar Career Center Advertising About FREE Company Listing! Imbedded Component/Die Technology (IC/DT®) STI has developed a patented
GPD Global | https://www.gpd-global.com/co_website/pdf/lead-former/CF8-User-Guide-801-1-07.pdf
Axial Component Lead Former CF-8 Axial Component Lead Former Operating Instructions Version 2.2 April 2, 2007 Copyright (C) 2007 GPD Global® All Rights Reserved GPD Global
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/de-DE/divisions/dage/about/blog/ready-for-mor-automation
Automatisierung durch X-ray Component Counter X-Ray Inspection and Test Products Corporate | Globale Standorte (Englisch) | Sprachen Nur Sparte Alles von Nordson Home Produkte Bondtest Systeme Mikro Werkstofftester Wafer Inspektion und Messung X-ray Inspektion X-ray