Industry Directory | Consultant / Service Provider / Manufacturer
Test Medics provides In-Circuit & Functional Test Fixture Designs, In-circuit & Functional Testing Services, PCBA analysis & repair services, revision & firmware changes & component level programming.
Industry Directory | Consultant / Service Provider / Manufacturer
A Contract Manufacturing company specializing in Printed Circuit Board Assembly, Quick Turn Prototype Services, and Direct Fulfillment.
New Equipment | Education/Training
IPC J-STD 001 REV F Requirements for Soldered Electrical and Electronic Assemblies. The IPC J-STD-001F standard is the industry-consensus document with respect to the assembly of PCBs and electronic assemblies. Released August 2014. IPC J-STD-001
New Equipment | Education/Training
IPC A-610G Acceptability of Electronic Assemblies. The 610 is the industry standard for the acceptance criteria for assembled PCBs. It is also the instructional book used when teaching IPC-A610 CIS students. Revision G has lots of new photos and i
Electronics Forum | Sun Dec 15 14:32:46 EST 2002 | Carl Brytz
arzu, We have BOM parsing and normalization tools with revision management capabilties. We would like to discuss this with you as well determine what other functional requirements you may have. Depending your location one of our Applications Engine
Electronics Forum | Thu May 29 12:53:36 EDT 2003 | designchain
Managing items and BOMs, even for a small company, should not be done on spreadsheets - they're single user, prone to error, and hard to manage. There are relatively low-cost, very functional systems on the market that enable management and revision
Used SMT Equipment | Pick and Place/Feeders
Japan YAMAHA YV100-XTG placement machine: Patch speed: 0.135 seconds/CHIP SMD PCB size: L330XW250MM_L50XW50MM SMD components:0603(MM)-31MMX31MM components SOP SOJ PLCC SMD components can put 100 kinds (8MM) Mounter size: L1650XW1408X1
Used SMT Equipment | Pick and Place/Feeders
Japan YAMAHA YV100-XTG placement machine: Patch speed: 0.135 seconds/CHIP SMD PCB size: L330XW250MM_L50XW50MM SMD components:0603(MM)-31MMX31MM components SOP SOJ PLCC SMD components can put 100 kinds (8MM) Mounter size: L1650XW1408X1
Industry News | 2003-01-28 10:29:13.0
Conducted by Wall Street Audio, with Iehab Hawatmeh, President & CEO
Industry News | 2003-05-30 08:36:25.0
Anticipates Savings Of $25 Million Per Year
Parts & Supplies | Pick and Place/Feeders
YG200 UP DOWN component KGT-M7162-00X No. Part No. Part Name Q'ty Remarks Date Revised No. 1 KV8-M7101-00X HOUSING HEAD 1 2 KV8-M7103-50X PLUG 2 3 K65-M257M-00X O-RING 3 4 S12.5 3-1 90200-01J125 O-RING 3 4 S12.5 4 KM1-M7140-00X PACKING 4 MYR-6
Parts & Supplies | Pick and Place/Feeders
- Two new placement head types in an evolution of the “1-head solution” to achieve high productivity: Accommodates super-small 0201 (0.25 x 0.125 mm) size components and large components - Extended detection range of components held for
Technical Library | 2023-01-17 17:22:28.0
The impact of voiding on the solder joint integrity of ball grid arrays (BGAs)/chip scale packages (CSPs) can be a topic of lengthy and energetic discussion. Detailed industry investigations have shown that voids have little effect on solder joint integrity unless they fall into specific location/geometry configurations. These investigations have focused on thermal cycle testing at 0°C-100°C, which is typically used to evaluate commercial electronic products. This paper documents an investigation to determine the impact of voids in BGA and CSP components using thermal cycle testing (-55°C to +125°C) in accordance with the IPC- 9701 specification for tin/lead solder alloys. This temperature range is more typical of military and other high performance product use environments. A proposed BGA void requirement revision for the IPC-JSTD-001 specification will be extracted from the results analysis.
Technical Library | 2015-01-05 17:38:26.0
The impact of voiding on the solder joint integrity of ball grid arrays (BGAs)/chip scale packages (CSPs) can be a topic of lengthy and energetic discussion. Detailed industry investigations have shown that voids have little effect on solder joint integrity unless they fall into specific location/geometry configurations. These investigations have focused on thermal cycle testing at 0°C-100°C, which is typically used to evaluate commercial electronic products. This paper documents an investigation to determine the impact of voids in BGA and CSP components using thermal cycle testing (-55°C to +125°C) in accordance with the IPC-9701 specification for tin/lead solder alloys. This temperature range is more typical of military and other high performance product use environments. A proposed BGA void requirement revision for the IPC-JSTD-001 specification will be extracted from the results analysis.
Yamaha Σ-G5SⅡ Premium Modular PCB Chip Shooter ❙ Features of Yamaha PCB Chip Shooter High-efficiency SMT pick and place machine, Yamaha chip shooter, Yamaha module type mounting system with combine high productivity,, high
Teresa Rowe, IPC director of assembly standards, highlights several revisions to IPC J-STD-001F, Requirements for Soldered Electrical and Electronic Assemblies and IPC-A-610F, Acceptability of Electronic Assemblies. The documents have been updated to
Training Courses | | | IPC-A-610 Specialist (CIS) Recert.
The Certified IPC-A-610 Specialist (CIS) recertification courses are intended for those individuals who were previously certified as IPC-A-610 Specialists.
Training Courses | | | IPC J-STD-001 Trainer (CIT) Recert.
The Certified IPC J-STD-001 Trainer (CIT) recertification courses are intended for those individuals who were previously accredited to provide Certified IPC J-STD-001 (CIS) training.
Events Calendar | Thu Oct 03 00:00:00 EDT 2019 - Thu Oct 03 00:00:00 EDT 2019 | ,
IPC Tech Ed Webinar Series: Ball Grid Array (BGA) and Bottom Termination Component (BTC) Design and Assembly Challenges: Reflow Profiling to Achieve Low Defect Rates and Successful Assembly! – Part 2
Career Center | Tulsa, Oklahoma USA | Engineering,Purchasing
Electronics Manufacturer is looking for Component Engineer. Position will: Evaluate bills of material for new customer orders Locate nate sources for components Gain improved pricing from component vendors Develop component substitution reports
Career Center | , | 2018-02-12 15:39:39.0
MR PCB Rework Technician (Intel Contract Employee) Job Description The IMR PCB rework Technician will be responsible for developing thermal profiles for PCB components, identifying nozzles, revision control, updating/drafting rework instructions,
Career Center | Chennai, India | Sales/Marketing
Experience in sales of inter-connect, passive, active, and electro-mechanical components Product Engineering Role as handling BOM, ECO, ECN in the New product introduction of Philips LCD TV and Kulicke and Soffa wire bonding m/c Process and Quali
Career Center | , Minnesota USA | Engineering,Management,Production,Quality Control,Technical Support
Engineer with a diverse background in management, quality, computer and customer service. Experience includes optics, electrical, mechanical, physics, chemistry, process and systems engineering, implementing computers and computer applications for m
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/our-company/news-room/news-releases/xaloy-divest-close
◦ Automatic X-ray Products ◦ High-Speed Component Counting Products ◦ Detectors, Sources and Custom OEM Technologies INDUSTRIAL PRECISION SOLUTIONS
GPD Global | https://www.gpd-global.com/pdf/doc/Dispense-System-User-Guide-22100079K.pdf
& Error Messages content. • Revise all gantry graphics to show new style surface sensor and new path for cables & lines. • Revise all calibration station graphics to show new, current models
