New SMT Equipment: component staking to which spec (2)

KICstart²™ Affordable, Easy to Use Thermal Profiler

KICstart²™ Affordable, Easy to Use Thermal Profiler

New Equipment | Reflow

The KICstart²™ thermal profiler utilizes core technologies developed by KIC, the world’s premier thermal profiling company, and is supported by KIC’s worldwide organization. Packaging these innovative technologies into a low-cost system, the KICstart

KIC Thermal

DP80C51 - Pipelined High Performance Microcontroller 10 times faster to 8051

New Equipment | Other

Overview • 10 times faster compared to standard 8051 • Interface for additional Special Function Registers • Pipelined RISC architecture The DP80C51 is an ultra high performance, speed optimized soft core, of a single-chip 8-bit embedded controll

Digital Core Design

Electronics Forum: component staking to which spec (6)

Poor wetting to palladium

Electronics Forum | Mon Jan 29 06:44:59 EST 2001 | Scott B

I have recently come across a device which has a palladium over nickel finish which when soldered shows evidence of poor wetting to the lead ( i.e. a wetting angle greater than 90�) about three quarters of the way up the side of lead. This is only vi

How to get away jointing problem

Electronics Forum | Mon Apr 04 09:35:16 EDT 2005 | russ

What are the max temp specs for each of the components? this sounds like the real problem with lead free conversion. Which parts are which? Currently we are getting ready to reball lead free BGAs back to lead for a customer that had to be lead free

Industry News: component staking to which spec (20)

New Electronics Coalition Eyes Industry-Wide Collaboration, Invites Stakeholders to Charter Meeting May 21 at IPC ESTC

Industry News | 2013-05-14 12:32:32.0

The Coalition for the Advancement of MicroElectronic Systems Technology (CAMEST),will hold its initial planning meeting and charter development May 21 during the IPC Electronic Systems Technologies Conference (IPC ESTC) at The New Tropicana in Las Vegas.

Association Connecting Electronics Industries (IPC)

FCI Receptacles Take to Standard SMT Processes

Industry News | 2003-04-15 08:23:22.0

Metral TINT back panel receptacles are compatible with standard pin-in-paste SMT processes, eliminating costly secondary assembly operations including heat staking, wave soldering or press fitting.

FCI

Express Newsletter: component staking to which spec (1039)

Component Shortages Causing Electronics Manufacturers to “Use All Means Necessary” to Ship Products

Component Shortages Causing Electronics Manufacturers to “Use All Means Necessary” to Ship Products Component Shortages Causing Electronics Manufacturers to “Use All Means Necessary” to Ship Products As the electronics manufacturing and assembly

Partner Websites: component staking to which spec (103)

Offset defined in padstack to match corporate grid - PCB Libraries Forum

PCB Libraries, Inc. | https://www.pcblibraries.com/forum/offset-defined-in-padstack-to-match-corporate-grid_topic2726_post11061.html

. Unless you have someone to validate component attachment integrity on board from what it's define on spec sheets or calculators I'm not recommending it

PCB Libraries, Inc.

The Role of PCB Assembly and Fabrication in the Aerospace Industry

Imagineering, Inc. | https://www.pcbnet.com/blog/the-role-of-pcb-assembly-and-fabrication-in-the-aerospace-industry/

. Thus, aerospace PCBs have more design considerations than standard PCBs operating in an office environment. For example, all components of these PCBs must be mil-spec grade concerning tolerance and ability to handle the maximum current for that component

Imagineering, Inc.


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