Industry Directory: component weight area 0.08 (1)

Chemistik

Industry Directory | Distributor / Manufacturer

Our offer includes modern systems (including Techcon Systems, WALTHER-PILOT, JANOME): Dosing accessories, Pressurized dosing systems, Non-pressurized dosing systems, Industrial robots, Automated dosing stations.

New SMT Equipment: component weight area 0.08 (197)

Semi automatic solder machine (1.2M)

Semi automatic solder machine (1.2M)

New Equipment | Printing

Technical parameter: Model 1200 Printing area 1250×320mm Fixed printing position PCB Outer Or Pin Positioning Table trimming Front/Back±

DONGGUAN KINGSUN AUTOMATION TECHNOLOGY CO.,LTD

JUKI JM-100 Hybrid Placement Machine

JUKI JM-100 Hybrid Placement Machine

New Equipment | Pick & Place

JUKI JM-100 Hybrid Placement Machine Board size 410×360mmComponent Size: 0603~50mmPlacement Speed:16,000CPHPCB Weight max.4kgProduct description: JUKI JM-100 Multi Task Platform Hybrid Placement Machine, Board size 410×360mm, Component Size: 0603~50

Qersa Technology Co.,ltd

Electronics Forum: component weight area 0.08 (69)

Component weight formula

Electronics Forum | Wed Mar 28 11:29:49 EST 2001 | gcs

I've used below: WEIGTH OF COMPONENT IN GRAMS ---------------------------- TOTAL PAD MATING AREA IN SQUARE INCHES GRAMS PER SQUARE INCH MUST BE EQUAL/GREATER THAN 30 FOR SECONDARY MOUNTING.

Dye Penetration test for area array package failure analysis

Electronics Forum | Wed Sep 12 18:11:03 EDT 2001 | davef

First, what on the area array package are you analyzing � * Package cracking? * Cracked solder balls? * Er, what? Second, most failure analysis discussions consider dye penetration to be a non-destructive test, but then again most failure analysis

Used SMT Equipment: component weight area 0.08 (20)

Yamaha YG200 Refurbished High Speed S

Yamaha YG200 Refurbished High Speed S

Used SMT Equipment | Chipshooters / Chip Mounters

YAMAHA YG200 Refurbished High Speed SMT Machine Model YG200 Applicable PCB L330×W250 mm to L50×W50 mm Through-put (Optimum)

DONGGUAN KINGSUN AUTOMATION TECHNOLOGY CO.,LTD

Yamaha YS24X

Yamaha YS24X

Used SMT Equipment | Pick and Place/Feeders

Make: YAMAHAModel: YS24XDetails:1.High Mounting Capability: The YS24X boasts a top mounting capability of 54,000 CPH (0.067 sec/CHIP) .2.Automatic Tray Supply Unit: Supports the sATSII automatic tray supply unit for automatic pallet changes, up to 30

Extension Electromechanical equipment HK Co.,Ltd

Industry News: component weight area 0.08 (54)

How to optimize the reflow profile?

Industry News | 2018-10-18 08:37:41.0

How to optimize the reflow profile?

Flason Electronic Co.,limited

Nordson ASYMTEK's Helios™ SD-960 Series Automated Dispensing System dispenses medium and bulk volume deposits of single- (1K) and two-component (2K) fluids and supports highly abrasive

Industry News | 2018-03-22 21:11:24.0

Nordson ASYMTEK introduces the new Helios™ SD-960 Series Automated Dispensing System for medium and bulk volume deposits of single- (1K) and two-component (2K) materials in electronics manufacturing and printed circuit board assembly. The Helios system is ideal to deposit volumes greater than 1cc, and line widths and dots that exceed 1mm, but it can deposit volumes down to 0.3cc and line widths as narrow as 0.3mm. The system supports highly abrasive thermal interface materials (TIM), silicones, epoxies, and grease for applications such as potting, sealing, gasketing, and structural adhesives.

ASYMTEK Products | Nordson Electronics Solutions

Parts & Supplies: component weight area 0.08 (10)

Other SMT-2010

Other SMT-2010

Parts & Supplies | Soldering - Reflow

Brand New SMT2010 TABLE-TOP REFLOW OVEN LEAD-FREE Description: This is a brand new, SMT2010 Reflow oven. More and more surface mount devices (SMD) are used on electronic circuit boards. Large floor model reflow ovens are expensive and heavy, no

SMTmax

Juki JUKI OUT SENS ASM 40002210 JPG

Juki JUKI OUT SENS ASM 40002210 JPG

Parts & Supplies | SMT Equipment

contact person:banny chen mail:zksale@hysmt.cn skype:miayuan8 40000411 Y-AXIS SENSOR BR ASSY 40000413 FEEDER FLOAT_SENS ASSY 40000414 FEEDER_SENS ASSY 40000875 WAIT_SENSOR_BRACKET 40000908 IN SENSOR ASM 40000912 SENSOR ADJUST SPRIG 4000

ZK Electronic Technology Co.,Limited

Technical Library: component weight area 0.08 (3)

Improve SMT Assembly Yields Using Root Cause Analysis in Stencil Design

Technical Library | 2018-07-18 16:28:26.0

Reduction of first pass defects in the SMT assembly process minimizes cost, assembly time and improves reliability. These three areas, cost, delivery and reliability determine manufacturing yields and are key in maintaining a successful and profitable assembly process. It is commonly accepted that the solder paste printing process causes the highest percentage of yield challenges in the SMT assembly process. As form factor continues to get smaller, the challenge to obtain 100% yield becomes more difficult.This paper will identify defects affecting SMT yields in the printing process and discuss their Root Cause. Outer layer copper weight and surface treatment will also be addressed as to their effect on printability. Experiments using leadless and emerging components will be studied and root cause analysis will be presented

FCT ASSEMBLY, INC.

Optimized Stress Testing for Flexible Hybrid Electronics Designs

Technical Library | 2020-10-08 01:01:01.0

Flexible hybrid electronics (FHE) is emerging as a promising solution to combine the benefits of printed electronics and silicon technology. FHE has many high-impact potential areas, such as wearable applications, health monitoring, and soft robotics, due to its physical advantages, which include light weight, low cost and the ability conform to different shapes. However, physical deformations in the field can lead to significant testing and validation challenges. For example, designers must ensure that FHE devices continue to meet their specs even when the components experience stress due to bending. Hence, physical deformation, which is hard to emulate, has to be part of the test procedures for FHE devices. This paper is the first to analyze stress experience at different parts of FHE devices under different bending conditions. We develop a novel methodology to maximize the test coverage with minimum number of text vectors with the help of a mixed integer linear programming formulation. We validate the proposed approach using an FHE prototype and COMSOL Multiphysics simulations

Arizona State University

Videos: component weight area 0.08 (265)

PCB cutting machine , PCB separator , PCB depaneling machine, PCB V-cut separator, auto PCB separator

PCB cutting machine , PCB separator , PCB depaneling machine, PCB V-cut separator, auto PCB separator

Videos

link:https://www.ascen.ltd/Blog/Solutio/493.html ASCEN PCB separator ASC-620 PCB cutting machine can use for cutting LED long board and also can use to the PCBA with the high component separate operation.It is the best way to replace the way to purch

ASCEN Technology

FPC / PCB Punching Machine with Die Tooling

FPC / PCB Punching Machine with Die Tooling

Videos

FPC / PCB Punching Dies PCB Depaneler For High Volume Boards Singulation Advantages: 1. Pneumatic, environmental protection 2. High efficiency, suitable for high volume PCBs 3. Security door protection, ensure safe production Features: 1. D

Winsmart Electronic Co.,Ltd

Career Center - Jobs: component weight area 0.08 (1)

SMT Engineer - electronic manufacturing

Career Center | , Czech Republic | Engineering

CLIENT - International technology products manufacturer with manufacturing (high mix and medium/high volume - broad range of manufacturing processes), in Brno, CZ ROLE - SMT Engineer provide technical support and guidance to an inexperienced SMT

Solutions Driven ltd.

Career Center - Resumes: component weight area 0.08 (2)

JAMES R

Career Center | ELLENWOOD, Georgia USA | Production,Quality Control,Research and Development,Technical Support

SMT MACHINE OPERATION, FORKLIFT CERTIFY,  SUPERVISION OF MANUFACTURING AND PRODUCTION, QUALITY CONTROL TECH., AUDIO ENGINEER SKILLS,,SET-UP OF MUSICIAL THEMES AND PLAYS.

SMT Engineer

Career Center | Calamba City, Laguna Philippines | Engineering

Electronic Manufacturing Services (EMS) – SMT-EOL Process Engineer (August 2005 – Present) • Responsible for feasibility study for existing product and new product and conceptualize product assembly or process flow taking into consideration the manu

Express Newsletter: component weight area 0.08 (813)

Partner Websites: component weight area 0.08 (346)

Thermaltronics M80TZ025 Metcal STTC-SMTC Compatibility

| https://pcbasupplies.com/thermaltronics-m80tz025-tweezers-cartridge-pair-knife-tinned-area-2-03mm-0-08/

» Thermaltronics M80TZ025 Tweezers Cartridge Pair – Knife Tinned area 2.03mm (0.08″) Thermaltronics M80TZ025 Tweezers Cartridge Pair – Knife Tinned area 2.03mm (0.08


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