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Industry Directory | Manufacturer
Highly specialized, difficult to build electronic assemblies. Medium to low volume.
New Equipment | Curing Equipment
A Pressure Cure Oven (PCO), or Autoclave, is used to minimize voiding and increase adhesion strength for bonding processes typically used in die attach and underfill applications. PCO pressurizes air into a rigid vessel and heats & cools with
Simplify Dispensing with GPD Global’s Island Series Dispense Platforms Island Series robots give you versatility to do simple, repetitive automation jobs. Work areas range from 300 mm x 400 mm to 400 mm x 400 mm. All Island Series robots are compati
Electronics Forum | Mon Dec 02 08:43:20 EST 2019 | scotceltic
What are people using out there for minimum spacing between vias ? We recently came across a PCB manufacturer that wants us to increase our spacing due to their process. Below is our current spec. that we follow. Spacing between via pad to via pad o
Used SMT Equipment | Chipshooters / Chip Mounters
Yamaha SMT YSM10 Placement Machine Applicable PCB L 510 x W 460mm - L 50 x W 50mm * Consult us for board sizes exceeding dimensions L510 Mounting capability HM Head (10 Nozzle) Spec. HM5 Head (5 Nozzle) Spec. 46,000CPH (The Comp
Used SMT Equipment | Pick and Place/Feeders
Product number: RX - 7 Detailed product introduction Characteristic With high productivity, versatility, highquality new modular placement machine RX 7 listed Component placement speed (best conditions): 75000 CPH chip components Element size: 0
Industry News | 2019-01-09 21:58:38.0
GPD Global will exhibit at IPC APEX EXPO 2019. Stop by Booth 2915 to see live demonstrations of machines and equipment. Experts will be there to discuss your production needs. Whether your project requires a pump for retrofitting or a fully automated dispense system, conformal coating, or component preparation, we have a solution for you.
Industry News | 2016-02-27 22:07:08.0
GPD Global will exhibit in Booth#1818 at the upcoming IPC APEX EXPO 2016 Conference and Exhibition. See a live demonstration of 01005 dispensing on the MAX series high precision dispenser, the intuitively programmed Island series benchtop dispenser, and a full range of dispense pumps used on GPD dispense systems.
Parts & Supplies | Pick and Place/Feeders
Product number: RX - 7 Detailed product introduction Characteristic With high productivity, versatility, highquality new modular placement machine RX 7 listed Component placement speed (best conditions): 75000 CPH chip components Element size: 0
Parts & Supplies | Pick and Place/Feeders
Panasonic FAG8W04RM1 FEEDER Specs: PANASONIC FAG8W04RM1 FEEDER Feature : Panasonic SMD SMT Component Feeder. Part Name: Ratchet Type Component Feeder. Part Number: No FAG8W04RM1 Specifications: 8x4mm 8Wx4P Feeder Paper Feeder Emboss Double
Technical Library | 2012-12-17 22:05:22.0
Package on Package (PoP) has become a relatively common component being used in mobile electronics as it allows for saving space in the board layout due to the 3D package layout. To insure device reliability through drop tests and thermal cycling as well as for protecting proprietary programming of the device either one or both interconnect layers are typically underfilled. When underfill is applied to a PoP, or any component for that matter, there is a requirement that the board layout is such that there is room for an underfill reservoir so that the underfill material does not come in contact with surrounding components. The preferred method to dispensing the underfill material is through a jetting process that minimizes the wet out area of the fluid reservoir compared to traditional needle dispensing. To further minimize the wet out area multiple passes are used so that the material required to underfill the component is not dispensed at once requiring a greater wet out area. Dispensing the underfill material in multiple passes is an effective way to reduce the wet out area and decrease the distance that surrounding components can be placed, however, this comes with a process compromise of additional processing time in the underfill dispenser. The purpose of this paper is to provide insight to the inverse relationship that exists between the wet out area of the underfill reservoir and the production time for the underfill process.
Technical Library | 2015-08-27 15:32:16.0
Ever since there has been a widespread usage of surface mount parts, the trend of continued shrinkage of devices with ever finer pitches has continued to challenge PCB assemblers for the rework of same. Todays' pitches are commonly 0.5 to 0.4mm with packages of tiny outline sizes, 5 -10mm square, making the rework of such devices a challenge. In addition to the handling and inspection challenges comes the board density. Spacing to neighboring components continues to be compressed so the rework techniques should not damage neighboring components.
Voltage: 220V AC 60HZ/50HZ Measure : L440*W430*H190 (Unit: MM) Wt: 45KG Efficiency : 4000~40000pcs/H Feature: *This machine is used for lead-cutting and forming of tapes, bulk resistors, diodes, and other axial components. *It finishes leading-
Yamaha YSM10 Pick and Place High-speed Modular SMT Placement ❙ Features of Yamaha SMT Placement Yamaha fastest SMT placement machines , Yamaha SMT pick and place machine, Yamaha chip mounter, for SMT assembly system. pleas
Training Courses | | | IPC J-STD-001 Space Specialist (CIS)
The J-STD-001 Space Addendum is an additional optional module for the Certified IPC J-STD-001 CIS (Specialist) program for organizations that are required to meet these additional requirements.
Training Courses | ONLINE | | ESD Control Training Courses
Browse training and certification programs for electrostatic discharge (ESD) control in electronics assembly.
Events Calendar | Tue Mar 06 00:00:00 EST 2018 - Tue Mar 06 00:00:00 EST 2018 | ,
Electronics in Harsh Environments Conference - Free Pre-Conference Webinar
Events Calendar | Mon Mar 18 00:00:00 EDT 2019 - Mon Mar 18 00:00:00 EDT 2019 | ,
Webinar: Stencil Design for Solder Paste, In Process Inspection & Process Defects
Career Center | Warminster, Pennsylvania USA | Quality Control
Inspects electronic systems, assemblies, subassemblies, components, and parts for conformance to specifications and identify/implement corrective actions among production and other staff. The Inspector should have some experience with board Inspe
Career Center | , Czech Republic | Engineering,Quality Control
CLIENT is a leading global provider of integrated avionics, engines, systems and service solutions for aircraft manufacturers, airlines, business and general aviation, military, space and airport operations. Our aerospace products can be found on vi
Career Center | , Minnesota USA | Engineering,Management,Production,Quality Control,Technical Support
Engineer with a diverse background in management, quality, computer and customer service. Experience includes optics, electrical, mechanical, physics, chemistry, process and systems engineering, implementing computers and computer applications for m
Career Center | , Minnesota | Engineering,Management,Production,Quality Control,Technical Support
Engineer with a diverse background in management, quality, computer and customer service. Experience includes optics, electrical, mechanical, physics, chemistry, process and systems engineering, implementing computers and computer applications for m
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/products/front-end-components?con=t&page=36
Front-End Parts & Components | Nordson Nordson Corporation Global Directory | Languages NASDAQ $213.61 -0.49 Our Products Our Industries Our Applications Brands
Imagineering, Inc. | https://www.pcbnet.com/capabilities/fabrication/tolerances/
. Call your salesperson if you required a finished hole size less than 0.004″. If your hole tolerances are zero, then Imagineering will assume that you are OK with our default hole tolerance. +/- 0.004″ Standard Spec
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