Industry Directory: connector bake out time (6)

Nascent Aviation

Industry Directory | Distributor

Most Trusted and Superior Source for NSN Parts, Aircraft, Military Needs

Integrated AOG

Industry Directory | Distributor / Equipment Dealer / Broker / Auctions

Whether you are in the market for aircraft components, electrical connectors, IT hardware, or NSN parts, there is no better source of high-quality items than Integrated AOG.

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New SMT Equipment: connector bake out time (36)

PCB repair and rework

New Equipment | Rework & Repair Equipment

Allgood Technology is equipped with a range of tools to rework and repair printed circuit assemblies to IPC-A-610 or your own company standards. Major Plant List:     Metcal MFR-1351 Desoldering Station for through hole desoldering.     Le

Allgood Technology ltd

Harwin Datamate High Performance / High Reliability Connectors

Harwin Datamate High Performance / High Reliability Connectors

New Equipment | Components

The Datamate high performance / high reliability connector range is approved to meet the exacting requirements of British Standard 9525-F0033, this conformity is made possible by Harwin’s High reliability 4 finger Beryllium Copper Contact technology.

HARWIN

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Electronics Forum: connector bake out time (294)

Alternatives to device bake out

Electronics Forum | Fri Feb 19 06:45:29 EST 1999 | Charles Stringer

Does anybody have any reliable alternatives to device bake out for plastic bodied components. We do not use a whole package at time and therefore have to oven bake the balance before we can use them. I have come accross dry nitrogen storage chambers

PWAs & PWB bake out requirements

Electronics Forum | Thu Aug 09 19:13:37 EDT 2007 | htran

DaveF, Our customer requirement is to comply with IPC-STD-001 but the J std doesn't specify the bake out temperature for populated boards and the moisture absortion rate. Right now we are baking the populated PWAs after aqueous wash at 80C at 18-48

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Used SMT Equipment: connector bake out time (23)

Panasonic CM20F-M  1KFZ0088

Panasonic CM20F-M 1KFZ0088

Used SMT Equipment | Pick and Place/Feeders

Machine size: length 1500 * width 2000 * height 1500 (unit: mm)  Machine structure: 3 groups of placement heads, different nozzles can be replaced automatically  Machine specifications: standard version, front loading rack and tube load

Qinyi Electronics Co.,Ltd

Tyco SEP 3T

Tyco SEP 3T

Used SMT Equipment | General Purpose Equipment

Year 2008 - Like New Condition Tyco SEP 3T Shuttle Electric Press Standalone electric press for the application of PCBs onto compliant pin housings or connectors • Servo electric press with shuttle system for product location under press ram • Ho

1st Place Machinery Inc.

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Industry News: connector bake out time (62)

Typical RoHS Issues in PCB Assembly

Industry News | 2018-10-18 10:23:07.0

Typical RoHS Issues in PCB Assembly

Flason Electronic Co.,limited

Call for Participation — Deadline Extended to 2/21/20!

Industry News | 2020-02-18 14:31:52.0

Join us for High Reliability Forum as a presenter or instructor and share your expertise in electronics with high reliability requirements.

Association Connecting Electronics Industries (IPC)

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Parts & Supplies: connector bake out time (359)

Juki High-Speed Matrix Tray Server (Rear type) TR7D

Juki High-Speed Matrix Tray Server (Rear type) TR7D

Parts & Supplies | Pick and Place/Feeders

High-Speed Matrix Tray Server (Rear type) TR7D Rear mount tray server presents entire trays to the machine for direct picking (no intermediate shuttle hand off). ■ Ideal for odd shaped components or ones with bottom side features that make shuttle

ZK Electronic Technology Co., Limited

Universal Instruments 42804703 CARRIER CLIP

Universal Instruments 42804703 CARRIER CLIP

Parts & Supplies | AOI / Automated Optical Inspection

42804703 CARRIER CLIP 42762901  TIMING BELT 1/5"PX3/ 42763001 TIMING BELT 3/"P X1/ 42763801 CYLINDER,SPECIAL 3/4 42765301 PAD,PUSHER 42766001 TUBING(5/32) 42766201 CONNECTOR, MALE 10-3 42766301 FLOW CONTROL/FITTING 42767001 CYLINDER,RODLESS

ZK Electronic Technology Co., Limited

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Technical Library: connector bake out time (2)

Moisture Measurements in PCBs and Impact of Design on Desorption Behaviour

Technical Library | 2018-09-21 10:12:53.0

Moisture accumulates during storage and industry practice recommends specific levels of baking to avoid delamination. This paper will discuss the use of capacitance measurements to follow the absorption and desorption behaviour of moisture. The PCB design used in this work, focused on the issue of baking out moisture trapped between copper planes. The PCB was designed with different densities of plated through holes and drilled holes in external copper planes, with capacitance sensors located on the inner layers. For trapped volumes between copper planes, the distance between holes proved to be critical in affecting the desorption rate. For fully saturated PCBs, the desorption time at elevated temperatures was observed to be in the order of hundreds of hours. Finite difference diffusion modelling was carried out for moisture desorption behaviour for plated through holes and drilled holes in copper planes. A meshed copper plane was also modelled evaluating its effectiveness for assisting moisture removal and decreasing bake times. Results also showed, that in certain circumstances, regions of the PCB under copper planes initially increase in moisture during baking.

National Physical Laboratory

Handling of Highly-Moisture Sensitive Components - An Analysis of Low-Humidity Containment and Baking Schedules

Technical Library | 2022-09-12 14:07:47.0

Unique component handling issues can arise when an assembly factory uses highly-moisture sensitive surface mount devices (SMDs). This work describes how the distribution of moisture within the molded plastic body of a SMD is an important variable for survivability. JEDEC/IPC [1] moisture level rated packages classified as Levels 4-5a are shown to require additional handling constraints beyond the typical out-of-bag exposure time tracking. Nitrogen or desiccated cabinet containment is shown as a safe and effective means for long-term storage provided the effects of prior out-of-bag exposure conditions are taken into account. Moisture diffusion analyses coupled with experimental verification studies show that time in storage is as important a variable as floor-life exposure for highly-moisture sensitive devices. Improvements in floor-life survivability can be obtained by a handling procedure that includes cyclic storage in low humidity containment. SMDs that have exceeded their floor-life limits are analyzed for proper baking schedules. Optimized baking schedules can be adopted depending on a knowledge of the exposure conditions and the moisture sensitivity level of the device.

Alcatel-Lucent

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Videos: connector bake out time (15)

Datamate Mix-Tek - High-Rel Mixed Layout Connectors combine signal (3A), power (20A) & coax (6Ghz) contacts to reduce PCB footprint.

Datamate Mix-Tek - High-Rel Mixed Layout Connectors combine signal (3A), power (20A) & coax (6Ghz) contacts to reduce PCB footprint.

Videos

This video is no longer up-to-date - please visit the URL below for the latest Mix-Tek video: https://youtu.be/YCAO5HpVhkg Datamate Mix-Tek - High-Rel Mixed Layout Connectors combine signal (3A), power (20A) & coax (6Ghz) contacts to reduce PCB foot

HARWIN

Multiple Groups Of Blades PCB Depaneling YSVJ-650 Machine PCB Depaneling Cutter

Multiple Groups Of Blades PCB Depaneling YSVJ-650 Machine PCB Depaneling Cutter

Videos

High quality PCB depaneling machine / V-cut PCB depanelizer,multi-blade depaneling machine,Pcb Separator Feature 1. The shaft of the knives( top and bottom) is design to be an an integral whole, it is convenient to install, pick and place. 2.T

YUSH Electronic Technology Co.,Ltd

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Events Calendar: connector bake out time (2)

IPC/WHMA Wiring Harness Innovation Webinar Series

Events Calendar | Tue Oct 15 00:00:00 EDT 2019 - Tue Oct 15 00:00:00 EDT 2019 | ,

IPC/WHMA Wiring Harness Innovation Webinar Series

Association Connecting Electronics Industries (IPC)

Wisconsin Chapter Webinar: PCB Assembly – Labeling and Marking Technology and Materials

Events Calendar | Tue Mar 30 00:00:00 EDT 2021 - Tue Mar 30 00:00:00 EDT 2021 | ,

Wisconsin Chapter Webinar: PCB Assembly – Labeling and Marking Technology and Materials

Surface Mount Technology Association (SMTA)

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Career Center - Resumes: connector bake out time (2)

Manufacturing engineer & SMT process engineer

Career Center | Riyadh 11623, Philippines | Engineering,Maintenance,Production

PROFESSIONAL EXPERIENCE: Connected in the field of manufacturing/electronics industry experienced in the line, Through Hole and Surface Mount Technology, worked on various Fuji Machines Universal model, such as: CP 643E chip shooter QP 242E chip mou

Debug engineer or bga rework engineer

Career Center | banaglore, karnataka India | Maintenance,Production,Quality Control,Technical Support

tel u later

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Express Newsletter: connector bake out time (679)


connector bake out time searches for Companies, Equipment, Machines, Suppliers & Information

Solder Paste Dispensing

Component Placement 101 Training Course
Conductive Adhesive & Non-Conductive Adhesive Dispensing

Software programs for SMT placement and AOI Inspection machines from CAD or Gerber.
Sell Your Used SMT & Test Equipment

Training online, at your facility, or at one of our worldwide training centers"
Online Equipment Auction Jabil Monterrey MX Aug 19, 2024

High Resolution Fast Speed Industrial Cameras.
PCB Handling with CE

Nozzles, Feeders, Spare Parts - Siemens, Fuji, Juki, Yamaha, etc...