Industry Directory | Manufacturer
MPIQC is an Electronic Manufacturing Services (EMS) company. Our services are provided at the highest standards to be recognized as a global leader in OEM optimization in IPC Class 2 & Class 3 manufacturing.
New Equipment | Cleaning Equipment
World’s First Cleaner & ROSE Tester Removes Fluxes Performs IPC ROSE Test Closed Loop Operation - No Drains Aqueous or Organic Solvents Stainless Steel Construction Automatic Wash/Rinse/Test/Dry 230VAC, 10AMP, 50/60Hz
PLASMATREAT: Openair Plasma Process, Eliminating all Organic and Silicon-Based Contaminants Effectively Removes Electrostatically Attached Dust Applicable to Flat Surfaces as well as Complex 3D Shapes Atmospheric Plasma Process Reduces O
Electronics Forum | Thu Oct 02 18:53:36 EDT 2003 | Michael Nguyen
We are using a Trek board washing system with 2 deionizer tanks hooked up to the 2 final rinse tanks and the first tank is directly connected with the city water. We are having problems with a vendor board on some tranformer/chokes. The part manufact
Electronics Forum | Mon Aug 27 15:06:29 EDT 2001 | davef
This otta push Wolfgang over the top ... Recommended reading G.G. Harman, Wire Bonding in Microelectronics : Materials, Processes, Reliability, and Yield, 2nd edition, McGraw-Hill Electronic Packaging and Interconnection Series, 1997. G.G. Harman, R
Industry News | 2015-06-11 16:02:18.0
MIRTEC, "The Global Leader in Inspection Technology," will exhibit its most recent solutions for System in Package (SiP) inspection and measurement at SEMICON WEST 2015; July 14-16, 2015, at the Moscone Center in San Francisco, CA. Visitors are invited to booth # 2343 for a detailed demonstration of this exciting new technology.
Industry News | 2013-10-28 16:31:54.0
IPC Conference on Solder and Reliability: Materials, Processes and Tests, November 13–14 in Costa Mesa, Calif.
Technical Library | 2013-02-07 17:01:46.0
Silicone contamination is known to have a negative impact on assembly processes such as soldering, adhesive bonding, coating, and wire bonding. In particular, silicone is known to cause de-wetting of materials from surfaces and can result in adhesive failures. There are many sources for silicone contamination with common sources being mold releases or lubricants on manufacturing tools, offgassing during cure of silicone paste adhesives, and residue from pressure sensitive tape. This effort addresses silicone contamination by quantifying adhesive effects under known silicone contaminations. The first step in this effort identified an FT-IR spectroscopic detection limit for surface silicone utilizing the area under the 1263 cm-1 (Si-CH3) absorbance peak as a function of concentration (µg/cm2). The next step was to pre-contaminate surfaces with known concentrations of silicone oil and assess the effects on surface wetting and adhesion. This information will be used to establish guidelines for silicone contamination in different manufacturing areas within Harris Corporation... First published in the 2012 IPC APEX EXPO technical conference proceedings.
Technical Library | 2019-04-10 22:08:31.0
The stimulating impact of the automotive industry has sharpened focus on immersion tin (i-Sn) more than ever before. Immersion tin with its associated attributes, is well placed to fulfill the requirements of such a demanding application. In an environment dominated by reliability, the automotive market not only has very stringent specifications but also demands thorough qualification protocols. Qualification is ultimately a costly exercise. The good news is that i-Sn is already qualified by many tier one OSATs. The focus of this paper is to generate awareness of the key factors attributed to soldering i-Sn. Immersion tin is not suitable for wire bonding but ultimately suited for multiple soldering applications. The dominant topics of this paper will be IMC formations in relation to reflow cycles and the associated solderability performance. Under contamination free conditions, i-Sn can provide a solderable finish even after multiple reflow cycles. The reflow conditions employed in this paper are typical for lead free soldering environments and the i-Sn thicknesses are approximately 1 μm.
This video demonstrated the use of BEST Inc HotDots(TM) which allow wires to be affixed to the PCB or other surfaces-even when those surfaces go through reflow. There are other similar products out there but none of which can be readily customized no
The Microelectronics Lab was established to meet the rising need for advanced systems development and packaging to address the emerging challenges and issues facing today’s electronics assemblies. Advanced design and modeling software enables STI to
Career Center | Boulder, Colorado USA | Engineering,Production,Quality Control
Senior-level micro-electronic technician capable of independent manufacture of custom hybrids, focal plane assemblies, and prototype detector assemblies in cleanroom environment (in Advanced Packaging and Detector Laboratory). MINIMUM QUALIFICATIONS
, adhesive bonding, coating, and wire bonding. In pa
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/products/bonding-equipment?con=t&page=11
frame and structural bonding, to body or underbody sealing, Nordson has a dispensing solution. Using Argon Plasma to Remove Fluorine, Organic and Metal Oxide Contamination for Improved Wire Bonding Performance Nordson MARCH Imaging-Bonded-Wafer-Defects-for-3D-SI-Aug2009 Nordson Corporation VersaDrum™ Bulk Melters (Heated
55971 | https://www.ascen.ltd/ASCEN-smt-conveyor-list.pdf
ASCEN Technology
