AIAG is the North American association focused on continuously improving business processes and practices in the automotive supply chain by achieving consensus through multi-company teamwork. Quality initiatives include ISO9001:2000, QS-9000, ISO/TS
Industry Directory | Manufacturer
Fluid Research builds reliable multi component meter mix dispense systems. We provide dispense systems to our customers that create value via increased productivity. continuously improving our technol
Volumetric Dispense Pump - PCD Technology revolutionizes how you dispense and how you perceive dispensing. PCD - Progressive Cavity Displacement PCD is a continuously volumetric dispense pump based on the Progressive Cavity principle. PCD technolog
KSUN R05 JUKI Feeder Calibration It is essential for this equipment that enhanced productivity , installation and quality improvement As the high efficiency vision camera is asked in order to investigate precisely and repair the error of device pos
Electronics Forum | Wed May 17 17:21:18 EDT 2000 | Michael Parker
Paul- Start with apples to apples comparison. What world class product are you building that would benefit from a benchmark comparison? Other than that, if you are just starting then crunch the numbers, find the highest values, do continuous improvem
Electronics Forum | Mon Jul 01 21:03:15 EDT 2002 | ianchan
Dason: Hi mate, Could you help clarify this abit? ~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~ we found component weight will reduce more than 50% of the moisture weight after place in the cabinet with 55C and less than 5 % for 48 hours ~~~~~~~~~~~~~~~~~~~~~
Used SMT Equipment | Chipshooters / Chip Mounters
Product name: YV100XG YAMAHAmulti-functional chip mounter Product number: YV100XG Products in detail YAMAHA multi-function chip mounter YAMAHAYV100XG High speed and high precisionmulti-function modular placement machine 0.18 seconds/CHIP ultra-high-s
Used SMT Equipment | SMT Equipment
Product name: YV100XG YAMAHA multi-functional chip mounter Product number: YV100XG Products in detail YAMAHA multi-function chip mounter YAMAHA YV100XG High speed and high precision multi-function modular placement machine 0.18 seconds/CHIP ul
Industry News | 2021-11-08 14:38:39.0
Heller Industries, a leading supplier of reflow soldering ovens for electronic manufacturing and pressure curing ovens for back-end semicondutor manufacturing, today announced they will be exhibiting their new MK7 reflow oven at the San Diego Conference Center January 25-27, 2022.
Industry News | 2019-12-09 14:44:26.0
The SMT Reflow Soldering Equipment (Global) award was awarded to Heller Industries by Frost & Sullivan.
Parts & Supplies | Pick and Place/Feeders
SANYO stick feeder GSF-R01 SANYO 5000 Stick Feeder The operation rate of the machine is improved by the ability of stick feeder to operate continuously over an extended period. Unlike traditional stick feeders that rapidly vibrate u
Parts & Supplies | Pick and Place/Feeders
GSF-R09 UNIVERSAL Stick Feeder GSF-R09 UNIVERSAL Stick Feeder The operation rate of the machine is improved by the ability of stick feeder to operate continuously over an extended period. Unlike traditional stick feeders that rapidly vi
Technical Library | 2023-01-17 17:58:36.0
Heterogeneous integration has become an important performance enabler as high-performance computing (HPC) demands continue to rise. The focus to enable heterogeneous integration scaling is to push interconnect density limit with increased bandwidth and improved power efficiency. Many different advanced packaging architectures have been deployed to increase I/O wire / area density for higher data bandwidth requirements, and to enable more effective die disaggregation. Embedded Multi-die Interconnect Bridge (EMIB) technology is an advanced, cost-effective approach to in-package high density interconnect of heterogeneous chips, providing high density I/O, and controlled electrical interconnect paths between multiple dice in a package. In emerging architectures, it is required to scale down the EMIB die bump pitch in order to further increase the die-to-die (D2D) communication bandwidth. Aa a result, bump pitch scaling poses significant challenges in the plated solder bump reflow process, e.g., bump height / coplanarity control, solder wicking control, and bump void control. It's crucial to ensure a high-quality solder bump reflow process to meet the final product reliability requirements. In this paper, a combined formic acid based fluxless and vacuum assisted reflow process is developed for fine pitch plated solder bumping application. A high-volume production (HVM) ready tool has been developed for this process.
Technical Library | 2013-10-21 08:53:36.0
Having been in the wire processing business for 30 years, I have seen a lot of changes and improvements made possible, primarily by advances in electronics and software. Looking ahead, I see continued improvements in efficiency through networking technology.
Increase productivity, improve quality, reduce costs with vertical format curing solutions from Heller Industries. Learn more: http://www.hellerindustries.com/755-Vertical-Oven.php
This elevator format oven utilizes vertical space to accomodate curing applications of up to 4 hours while only occupying 96" (2.5m) of floorspace. Perfect for underfill and encapsulant.
Training Courses | | | IPC-A-610 Specialist (CIS)
The Certified IPC-A-610 Specialist (CIS) training focuses on the acceptance requirements for the manufacture of electrical and electronic assemblies
Training Courses | | | Other Courses
Other courses related to electronics manufacturing and assembly
Events Calendar | Wed Mar 13 00:00:00 EDT 2024 - Wed Mar 13 00:00:00 EDT 2024 | ,
Wine Down Wednesday: A Texpat Down Under- The Good, the Quirky, & the Utterly Ridiculous
Events Calendar | Wed May 12 00:00:00 EDT 2021 - Wed May 12 00:00:00 EDT 2021 | ,
Europe Chapter Webinar: Testing Coatings of Electronic Assemblies - Reliability is No Coincidence
Career Center | Baltimore, Maryland USA | Quality Control
Looking for strong QE with emphasis on development of ISO, continuted ISO registration, and continuous improvements. Must be dynamic, motivated, people oriented driver of quality systems. Reporting to the quality manager, you will help maintain ISO
Career Center | Tupelo, Mississippi USA | Quality Control
Quality engineer for SMT electronics assembly operation. Will work to perform and identify opportunity for process improvements, drive continuous improvement, collect and interpret quality data, and work with assigned customers on quality issues. Ex
Career Center | , Honduras | Engineering,Maintenance,Management,Production,Quality Control,Technical Support
Several years working as a Mechatronic engineer in the field of automotive industry. I have worked on projects that included new product design and development, manufacturing processes, assembly lines, Continuous Improvement, quality improvement, fac
Career Center | King, North Carolina | Management,Production,Quality Control
Production Supervisor Responsible for all aspects of department operations Directly supervised up to 80 team members Kaizen team leader 5S, Lean Manufacturing, working with Six Sigma tools Built team that continually produced 98% yields and Won
SMT Express, Volume 3, Issue No. 10 - from SMTnet.com Volume 3, Issue No. 10 Thursday, October 18, 2001 Featured Article Return to Front Page SMTnet.com Continues To Expand Benefits For Users by Andre Kruppa , SMTnet.com As part of our
Featured Article Return to Front Page SMTnet.com Continu