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New Equipment | Industrial Automation
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Symbion S36 Plus delivers top-of-the-line Post-Reflow AOI performance to help you achieve outstanding operational efficiency and high first-pass yield in even the most demanding SMT environments. Superior Detection with DPIX™ 3D Technology Symbio
Electronics Forum | Thu Jul 05 20:53:58 EDT 2007 | davef
ANSI/J-STD-002, Solderability Tests for Component Leads, Terminations, Lugs, Terminals, and Wires
Electronics Forum | Mon May 07 09:47:11 EDT 2001 | orbotech
All defect types that can not be seen from top view, meaning - any defect which is characterized by more than its top 2D appearance will be hard, if at all possible, to detect by 2D imaging system. This includes: Lifted leads / co planarity J-lead
Industry News | 2017-02-28 19:56:11.0
In recognition of her significant contributions of time, talent and ongoing leadership in IPC and the electronics industry, long-time IPC volunteer, Debbie Wade, Advanced Rework Technology, was presented with an IPC President’s Award at IPC APEX EXPO 2017.
Industry News | 2012-01-24 17:41:34.0
With the proliferation of regulations focused on materials in products, IPC is expanding its series of data exchange standards to meet the industry’s growing compliance needs. Newly formed, the IPC 2-18g Declaration of Batteries and Battery Materials and the IPC 2-18j Declaration of Chemical Analysis Lab Reports Task Groups will begin development of standards that aid in the exchange of information on batteries and lab reports, respectively. Companies throughout the electronics manufacturing supply chain are invited to attend these committees’ meetings at IPC APEX EXPO 2012, February 28-March 1, in San Diego.
Technical Library | 2012-12-14 14:25:37.0
The popularity of low voltage technologies has grown significantly over the last decade as semiconductor device manufacturers have moved to satisfy market demands for more powerful products, smaller packaging, and longer battery life. By shrinking the size of the features they etch into semiconductor dice, IC manufacturers achieve lower costs, while improving speed and building in more functionality. However, this move toward smaller features has lead to lower breakdown voltages and increased opportunities for component overstress and false failures during in-circuit test.
Technical Library | 2021-04-08 00:30:49.0
As the electronic industry moves to lead-free assembly and finer-pitch circuits, widely used printed wiring board (PWB) finish, SnPb HASL, has been replaced with lead-free and coplanar PWB finishes such as OSP, ImAg, ENIG, and ImSn. While SnPb HASL offers excellent corrosion protection of the underlying copper due to its thick coating and inherent corrosion resistance, the lead-free board finishes provide reduced corrosion protection to the underlying copper due to their very thin coating. For ImAg, the coating material itself can also corrode in more aggressive environments. This is an issue for products deployed in environments with high levels of sulfur containing pollutants encountered in the current global market. In those corrosive environments, creep corrosion has been observed and led to product failures in very short service life (1-5 years). Creep corrosion failures within one year of product deployment have also been reported. This has prompted an industry-wide effort to understand creep corrosion
https://bpmmicro.com/3928-7-site-aps/ The 3928, with up to seven sites, is made for programming large data devices, such as MCUs, eMMC HS400, NAND, NOR and Serial Flash devices. High-speed signals support devices up to 200 Mhz and the latest eMMC
Contact Us Sales manager: Mac Xie Mobile: +8618020714662(WhatsApp) Email: at@mooreplc.com Skype: +8618020714662 Contact Us ✭Product Overview✭ ITEM NO.:AMM32J S1 ORDER(MOQ):1 PAYMENT:T/T PRODUCT ORIGIN:Japan COLOR:Brand new SHIPPING PORT:Xi
PCB Dynamic Coplanarity At Elevated Temperatures PCB Dynamic Coplanarity At Elevated Temperatures iNEMI's SMTAI 2011 presentation by: John Davignon, Ken Chiavone, Jiahui Pan, James Henzi, David Mendez, Ron Kulterman; Intel Corporation
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