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Intermetallic Growth on PCB-News-Reflow oven,SMT Reflow Soldering Oven-cmsadmin

| http://etasmt.com/cc?ID=te_news_bulletin,23575&url=_print

Intermetallic Growth on PCB-News-Reflow oven,SMT Reflow Soldering Oven-cmsadmin Reflow oven,SMT Reflow Soldering Oven 当前位置: Home >> News >> News Intermetallic Growth on PCB Intermetallic Growth on PCB Where the tin-lead solder adheres to the copper of the lead

. Davis What is the Intermetallic? •  It is an electrochemical bonding between the solder and the copper surface •  It takes place during reflow when the Tin in the solder reacts with the Cu substrate or layer

| https://www.eptac.com/wp-content/uploads/2012/10/eptac_11_14_12.pdf

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