Thermodime� diamond heat transfer compound from Electrospell is an ultra high thermal conductivity thermal interface material composed of pure surface-modified diamond microcrystals suspended in a special carrier fluid. The product comes in a 1 ml sy
The Viscom S3088 CCI checks for the completeness of conformal coating on PCBs, and is intelligently linked to other inspection gates from Viscom. Reliable, precise detection of coating voids. Transparent conformal coating protects electronics assem
Electronics Forum | Thu Dec 07 10:10:49 EST 2006 | Learn from U
Hello, I need your advice..Welcome any input!! Cheers..
Electronics Forum | Thu Dec 07 14:23:30 EST 2006 | russ
I wuld say it is attachment method and post install force that is the problem not the size of the heatsink. we place heatsinks that are at least 5 times the size of BGA with no issue, they are attached with very precision torque drivers. Russ
Used SMT Equipment | Turnkey Lines
Functional Pre-Owned Complete SMT Assembly Line - Still Operational (Subject to prior sell, I am listing this on other venues) Up for sale is a full turnkey SMT line and all of it's accessories, of which there are a lot, fe
Industry News | 2024-04-29 03:28:04.0
In the dynamic world of Surface Mount Technology (SMT), precision and efficiency are paramount. Manufacturers worldwide seek inspection solutions that enhance accuracy and streamline production processes. Enter SMT AOI AI Inspection Technology – an innovative solution that combines cutting-edge artificial intelligence algorithms with advanced inspection capabilities.
Industry News | 2023-01-16 07:35:11.0
The best technical conference papers of IPC APEX EXPO 2023 have been selected. Voted on through a ballot process by members of the IPC APEX EXPO Technical Program Committee (TPC), the paper authors will be recognized during show opening remarks on Tuesday, January 24.
Parts & Supplies | Soldering - Wave
Controller and interface assembly from an ERSA wave solder machine EPROM V2.97 KUHNKE 71.633. 425.120.01 The glass is cracked but the LCD is not cracked. FOB: Origin AssuredTechnicalServiceLLC@Gmail.com
Technical Library | 2023-11-27 18:29:45.0
This paper examines the modeling of viscoplastic solder behavior in the vicinity of interfacial cracking for flip chip semiconductor packages. Of particular interest is the relationship between viscoplastic deformation in the solder bumps and any possible interface cracking between the epoxy underfill layer and the silicon die. A 3-D finite element code, developed specifically for the study of interfacial fracture problems, was modified to study how viscoplastic solder material properties would affect fracture parameters such as strain energy release rate and phase angle for nearby interfacial cracks. Simplified two-layer periodic symmetry models were developed to investigate these interactions. Comparison of flip chip results using different solder material models showed that viscoplastic models yielded lower stress and fracture parameters than time independent elastic-plastic simulations. It was also found that adding second level attachment greatly increases the magnitude of the solder strain and fracture parameters. As expected, the viscoplastic and temperature dependent elastic-plastic results exhibited greater similarity to each other than results based solely on linear elastic properties. !DOI: 10.1115/1.1649242"
Technical Library | 2019-05-01 23:18:27.0
Moisture can accelerate various failure mechanisms in printed circuit board assemblies. Moisture can be initially present in the epoxy glass prepreg, absorbed during the wet processes in printed circuit board manufacturing, or diffuse into the printed circuit board during storage. Moisture can reside in the resin, resin/glass interfaces, and micro-cracks or voids due to defects. Higher reflow temperatures associated with lead-free processing increase the vapor pressure, which can lead to higher amounts of moisture uptake compared to eutectic tin-lead reflow processes. In addition to cohesive or adhesive failures within the printed circuit board that lead to cracking and delamination, moisture can also lead to the creation of low impedance paths due to metal migration, interfacial degradation resulting in conductive filament formation, and changes in dimensional stability. Studies have shown that moisture can also reduce the glass-transition temperature and increase the dielectric constant, leading to a reduction in circuit switching speeds and an increase in propagation delay times. This paper provides an overview of printed circuit board fabrication, followed by a brief discussion of moisture diffusion processes, governing models, and dependent variables. We then present guidelines for printed circuit board handling and storage during various stages of production and fabrication so as to mitigate moisture-induced failures.
Features: 1. Desktop single table router speed 500mm / s. 2. High-quality shaft system allows the system to quickly increase and decrease, reduce the same period of time, improve productivity, while maintaining high accuracy. 3. Use high-quality ha
Sales:Peter Chen Email:s1@hk-yush.com Whatsapp/Tel:+86 13580833864 Product description: YSV-3A is a fully automatic round blades moving depneling mac
Career Center | Fayetteville, Arkansas USA | Engineering,Production
I enjoyed working in Electronics Manufacturing while in college (BSEE) and would like to pursue an engineering job in a related field.
Career Center | , District of Columbia | Engineering,Management,Production,Sales/Marketing
• Strong technical leadership and decision-making skills; strong verbal and written communication skills to provide clear, crisp direction for key issue resolution; and good team skills to facilitate cross-functional cross -site team effectiveness.
| https://www.wesource.com/test-and-measurement-equipment/hp-lightwave-multimeter-8153a-w/x2-hp-optical-head-interface-modules-81533b-id-000672-5/23/
: This item includes x2 HP Optical Head Interface 81533B Modules. This item has a crack in the top left corner of its front frame, as pictured
