Electronics Forum | Mon Oct 06 11:13:32 EDT 2003 | marmotzj
Dear All, I'm encountering a problem on mounting Intel E7501 and P64H2 FC-BGA chips. After the SMT process, these two BGAs were defected. Both had power-to-ground short circuits on the die package itself, and also the die resin had cracking tracks
Electronics Forum | Tue Jun 17 01:27:25 EDT 2003 | Dreamsniper
Hi Guys, I need your opinion here. Has anyone tried doing this Process: Bottomside Process first which means gluing the chip components then reflowing the Glue instead of Curing them, then Topside process which is solder paste printing then compone
Industry News | 2009-12-14 21:32:34.0
Vicor, a leader in the development, manufacture and sale of power conversion components and systems since 1981, has purchased Universal Instruments’ Genesis Platform based on its unique ability to adapt to a wide range of process requirements. The new equipment will be used for Vicor’s leading-edge VI Chip line of power conversion products, from low-volume/high-mix, to high-volume, as well as a specialized post-SMT assembly process requiring unique tooling and software solutions. Universal’s ability to provide a complete turn-key solution, rather than the hardware alone, differentiated Genesis from the alternative providers.
Industry News | 2021-11-30 01:54:12.0
After more than 100 years of development, X-ray imaging technology has formed a relatively complete X-ray non-destructive testing (NDT) technology system. In order to meet these needs, new detection technologies are constantly innovating, using Xray inline inspection technology. It can not only detect invisible crack or porosity such as aluminum casting , but also qualitatively and quantitatively analyze the detection results to find flaws early.
SMTnet Express, November 7, 2019, Subscribers: 32,325, Companies: 10,919, Users: 25,284 Origin and Quantification of Increased Core Loss in MnZn Ferrite Plates of a Multi-Gap Inductor Credits: Power Electronic Systems Laboratory (PES) Inductors
SMTnet Express, October 28, 2021, Subscribers: 26,544, Companies: 11,461, Users: 26,907 Cracks: The Hidden Defect Cracks in ceramic chip capacitors can be introduced at any process step during surface mount assembly. Thermal shock
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