Electronics Forum | Thu Apr 30 22:40:32 EDT 2009 | davef
Selective Wave Soldering DoE to Develop DfM Guidelines for Lead and Pb-Free Assemblies Written by Makram Boulos, Craig Hamilton, Mario Moreno, Ramon Mendez, German Soto and Jessica Herrera Circuits Assembly Magazine, 31 December 2008 19:00
Industry News | 2010-12-17 21:02:56.0
The SMTA is pleased to announce the Best Papers from SMTA International 2010. As speakers at SMTA International, individuals make contributions to the industry by sharing their research and findings. To reward exceptional achievement, $1,000 awards and plaques are given for the Best of Conference Presentation, Best of Proceedings Paper, and the Best International Paper.
Industry News | 2013-05-23 20:06:11.0
The SMTA proudly announces 33 engineers have received SMTA Certification for SMT Processes since May 2012. The SMTA Certification program is unique as it recognizes and certifies the entire SMT assembly process at an engineering level.
Technical Library | 2021-09-08 14:23:27.0
Although the electronics industry has largely settled on the use of SAC alloys for the assembly of the majority of lead free products, debate continues to exist over which SAC alloy – SAC305 (Sn3.0Ag0.5Cu) or SAC405 (Sn3.8Ag0.8Cu) – to use. The North American industry generally favours SAC405, while the Asian industry favours SAC305. SAC305 has the significant benefit of being less expensive than SAC405 owing to its lower silver content. However, there are lingering questions about whether the reliability of SAC305 is comparable to that of SAC405. Recent studies have concluded that no significant difference exists, but many potential applications were not studied. This paper compares the results of reliability testing of SAC305 and SAC405 in three different cases on a test vehicle representative of a mid-complexity server-type product which included a range of component types from CBGAs to discrete resistors.
