Electronics Forum | Wed Mar 19 08:38:13 EDT 2014 | davef
I can't picture much of what you're saying, not for nothing, I'm just not connecting. During assembly, solder mask can affected by heat and chemicals. Typically this would be during: * Soldering * Cleaning I will tell you this: Not to defend assem
Electronics Forum | Tue Mar 25 13:55:05 EDT 2014 | horchak
Ok lets put it this way. If the PCB house used a high quality mask and properly applied it to a properly cleaned surface and properly cured it, then as Dave stated above there are only two things that can destroy it. Excessive heat and overly aggress
Industry News | 2010-10-04 17:26:28.0
Industry-leading associations IPC and SMTA jointly announce the chairs of Workshop 2 of the High Performance Cleaning and Coating Conference, scheduled to take place November 16-18, 2010 at the Renaissance Hotel & Convention Center in Schaumburg, Illinois.
Industry News | 2021-07-19 16:50:44.0
The SMTA is pleased to announce the finalized technical program for the High-Reliability Cleaning and Conformal Coating Conference. The in-person event takes place October 5-7, 2021 at the DoubleTree by Hilton - Dallas Market Center in Dallas, Texas, USA.
Technical Library | 2016-09-08 16:27:49.0
In this investigation a test matrix was completed utilizing 900 electrodes (small circuit board with parallel copper traces on FR-4 with LPI soldermask at 6, 10 and 50 mil spacing): 12 ionic contaminants were applied in five concentrations to three different spaced electrodes with five replicas each (three different bare copper trace spacing / five replications of each with five levels of ionic concentration). The investigation was to assess the electrical response under controlled heat and humidity conditions of the known applied contamination to electrodes, using the IPC SIR (surface insulation resistance) J-STD 001 limits and determine at what level of contamination and spacing the ionic / organic residue has a failing effect on SIR.
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