Industry Directory | Manufacturer
Data I/O is the world's leading provider of manual and automated programming solutions for semiconductor (IC) devices. Data I/O's solutions, software and programming engine ensures devices are programmed correctly every time.
Industry Directory | Manufacturer
Industrial I/O Manufacturer Process & Automation Control Hardware & Software
New Equipment | Component Programming
Maximize performance and quality with the industry’s most robust and reliable offline automated programming system. The PS388 delivers unrivaled quality and flexibility in a small footprint Quality Programming Precision handling with Data I/O's
New Equipment | Industrial Automation
MFR. PART NUMBER DESCRIPTION ALLEN BRADLEY 1747-ACN15 CONTROLNET 1.5 AND BEYOND 171 I/O ADAPTER ALLEN BRADLEY 1747-ACNR15 CONTROLNET 1.5 AND BEYOND 171 I/O ADAPTER ALLEN BRADLEY 1747-AIC ISOLATED LINK COUPLER FOR PLC ALLEN BRADLEY 1747-ASB SLC 50
Electronics Forum | Mon Dec 07 11:33:25 EST 2020 | ecogroup
Getting these errors: No command response from handler (0x1000) .... DpBlockWriteL: TimeOutWait for ACK .... Loading SYSTEM data to DPRAM is failed ..... Failed to create empty document ..... No command response from handler (0xffff) ..... Faile
Electronics Forum | Tue Feb 21 10:45:45 EST 2012 | acsscott
Thanks for the password. There is a 7 pin connector for the Emergency stop in and out. It has a mate with a jumper wire attached to the Topaz end. If you put the jumpered mating connector on this, the emergency stop errors go away. The other conn
Used SMT Equipment | AOI / Automated Optical Inspection
Adjustable Conveyor and Camera Indexing Head Max PCB: 22” x 20” Top-down thin camera with 1.3 FOV Industrialized Pentium with hard drive, RWCD, USB-2I/O Flat Panel Display Cad/placement interface software Windows XP based user
Used SMT Equipment | In-Circuit Testers
Fluke 2640A NetDAQ Fluke 2640A NetDAQ Networked Data Acquisition Unit Analog inputs: 20 Computed Channels: 10 Digital I/O & Alarm Outputs: 8 total Totalizer: 1 Scan speed: Slow 6 channels/second nominal Medium: 41 (50 Hz), 48 (60 Hz) chan
Industry News | 2003-04-22 09:33:13.0
Honda Connectors has released its first Infiniband I/O connectors, designed for easy assembly in high-speed differential signal applications.
Industry News | 2003-06-16 09:12:35.0
Boards tout up to 8MGates devices, on-board RAM, banks of I/O, many programmable user interfaces
Parts & Supplies | Screen Printers
1014857 MPM stop sensor 101579100 S-chuck 4pcs P1811 cylinder rodless for MPM 2500 P1810 regulator for MPM 2500 P4394 valve relief for MPM 2500 1019734 &
Parts & Supplies | Pick and Place/Feeders
ZK Electronic Technology supply repair serive for JUKI laser, Yamaha laser, Samsung laser, DEK camera, board/driver/motor for pick & place machine: (1) CyberOptics laser repair, professional maintenance JUKI laser (JUKI KE740 KE740 KE750 KE750
Technical Library | 2023-01-17 17:58:36.0
Heterogeneous integration has become an important performance enabler as high-performance computing (HPC) demands continue to rise. The focus to enable heterogeneous integration scaling is to push interconnect density limit with increased bandwidth and improved power efficiency. Many different advanced packaging architectures have been deployed to increase I/O wire / area density for higher data bandwidth requirements, and to enable more effective die disaggregation. Embedded Multi-die Interconnect Bridge (EMIB) technology is an advanced, cost-effective approach to in-package high density interconnect of heterogeneous chips, providing high density I/O, and controlled electrical interconnect paths between multiple dice in a package. In emerging architectures, it is required to scale down the EMIB die bump pitch in order to further increase the die-to-die (D2D) communication bandwidth. Aa a result, bump pitch scaling poses significant challenges in the plated solder bump reflow process, e.g., bump height / coplanarity control, solder wicking control, and bump void control. It's crucial to ensure a high-quality solder bump reflow process to meet the final product reliability requirements. In this paper, a combined formic acid based fluxless and vacuum assisted reflow process is developed for fine pitch plated solder bumping application. A high-volume production (HVM) ready tool has been developed for this process.
Technical Library | 2018-01-17 22:47:02.0
Fine pitch copper (Cu) Pillar bump has been growing adoption in high performance and low-cost flip chip packages. Higher input/output (I/O) density and very fine pitch requirements are driving very small feature sizes such as small bump on a narrow pad or bond-on-lead (BOL) interconnection, while higher performance requirements are driving increased current densities, thus assembling such packages using a standard mass reflow (MR) process and maintaining its performance is a real and serious challenge. (...) In this study a comprehensive finding on the assembly challenges, package design, and reliability data will be published. Originally published in the SMTA International 2016
Career Center | Gardena, California USA | Engineering
Qual-Pro Corporation provides electronic manufacturing solutions to multiple industries including aerospace, defense, ISR, medical, and precision industrial controls. Our company offers a challenging and rewarding environment with a tremendous opport
Career Center | Noida, India | Engineering
I have done my B.tech from EC branch so I have lots of knowledge about EC branch. I have knowledge in IE3D software because my college project and Training project based on this software.Additionally, I have knowledge in Networking and linux.I have e
Career Center | Noida, India | Engineering
I have done my B.tech from EC branch so I have lots of knowledge about EC branch. I have knowledge in IE3D software because my college project and Training project based on this software.Additionally, I have knowledge in Networking and linux.I have e
SMTnet Express March 14, 2013, Subscribers: 26245, Members: Companies: 13310, Users: 34436 Assembly and Reliability of 1704 I/O FCBGA and FPBGAs by: Reza Ghaffarian, Ph.D.; Jet Propulsion Laboratory, California Institute of Technology Commercial
