Electronics Forum | Tue Sep 07 09:53:37 EDT 2004 | rob
Hi Dhanashekar, I'm with Chris on this one, unless you are carrying out 0201 or ultra fine pitch placement it's a helpful but not critical tool. We found most print errors were avoided using the 2D vision on the printer, combined with plenty of aut
Electronics Forum | Tue Dec 27 10:11:50 EST 2005 | pjc
Here's a few mfrs. to look at. http://www.vjelectronix.com/vjebeta/index.asp http://www.glenbrooktech.com/advantage.htm http://www.lixi.com/product_workstation.htm http://www.focalspot.com/ http://www.microfocus-x-ray.com/frameset.php?PageN
Industry News | 2018-10-18 08:27:03.0
An Analysis of SMT Solder Paste Printing Defects
Technical Library | 2017-08-10 01:23:22.0
This paper demonstrates the high frequency performance and thermo-mechanical reliability of through vias with 25 μm diameter at 50 μm pitch in 100 μm thin glass substrates. Scaling of through via interconnect diameter and pitch has several electrical performance advantages for high bandwidth 2.5D interposers as well as mm-wave components for 5G modules.
SMTnet Express, December 31, 2015, Subscribers: 23,946, Members: Companies: 14,865, Users: 39,660 Study on Solder Joint Reliability of Fine Pitch CSP Yong Hill Liang, Hank Mao, YongGang Yan, Jindong (King) Lee; AEG, Flex (Flextronics International
SMTnet Express, December 20, 2018, Subscribers: 31,551, Companies: 10,666, Users: 25,526 Process Optimization for Fine Feature Solder Paste Dispensing Credits: Indium Corporation With the rapid trend towards miniaturization in surface mount
Lewis & Clark | https://www.lewis-clark.com/shop/page/12/
: USA / FOB Origin Availability: Immediate for purchase / 2-4 weeks for shipping Out Of Stock MVP 1820 Ultra II AOI (2007) Make: MVP Model: 1820 Ultra II Vintage
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/last-will-of-bga-void.pdf
, S28-02, 2011. 11. IPC, Design and Assembly Process Implementation for BGAs, IPC-7095 Standard, August, 2000. 12. J. Lau and Y.Pao, Solder Joint Reliability of BGA, CSP, Flip Chip, and Fine Pitch SMT Assemblies, ISBN 0-07-036648-9, McGraw Hill, 1997. pp
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