DOCTAR is used validate design changes throughout the hardware board design and manufacturing lifecycle. DOCTAR analyzes changes to both to physical and logical elements in the design database. Test point analysis includes test points that have b
Electronics Forum | Sun Mar 05 13:02:00 EST 2000 | dave
We used this type of paste in a fine pitch application for over two years with no problems. You must be very careful of any (dust)or spillage while mixing for obvious reasons. In my opion the very thing that makes it interesting "freshness" is also i
Electronics Forum | Sun Mar 05 13:02:00 EST 2000 | dave
We used this type of paste in a fine pitch application for over two years with no problems. You must be very careful of any (dust)or spillage while mixing for obvious reasons. In my opion the very thing that makes it interesting "freshness" is also i
Industry News | 2023-03-30 22:45:02.0
Taoyuan, Taiwan (February 27, 2023) – Heller Industries, a leading provider of reflow and curing ovens for SMT and semiconductor advanced packaging, today announced the opening of a new office in Taoyuan, Taiwan, to meet the growing demand for reflow and curing equipment in the Taiwan region.
Industry News | 2003-02-13 08:11:45.0
eSight Can Reduce Time-to-manufacture and Time-to-market by as Much as 80%
Technical Library | 2016-04-08 01:19:52.0
PCB assembly designs become more complex year-on-year, yet early-stage form/fit compliance verification of all designed-in components to the intended manufacturing processes remains a challenge. So long as librarians at the design and manufacturing levels continue to maintain their own local standards for component representation, there is no common representation in the design-to-manufacturing phase of the product lifecycle that can provide the basis for transfer of manufacturing process rules to the design level. A comprehensive methodology must be implemented for all component types, not just the minority which happen to conform to formal packaging standards, to successfully left-shift assembly and test DFM analysis to the design level and thus compress NPI cycle times.(...)This paper will demonstrate the technological components of the working solution: the logic for deriving repeatable and standardized package and pin classifications from a common source of component physical-model content, the method for associating DFA and DFT rules to those classifications, and the transfer of those rules to separate DFM and NPI analysis tools elsewhere in the design-through-manufacturing chain resulting in a consistent DFM process across multiple design and manufacturing organizations.
Technical Library | 2011-11-16 22:11:58.0
Flexible Circuits are proven, reliable interconnect solutions for many of today's electronic packages. This article gives some general guidelines in terms of "dos" and "don'ts" that will help the engineer or designer make better decisions when using flex
By Pat McGoff, Market Development Manager During New Product Introduction (NPI), one of the priorities of both designers and manufacturers is quality. However, quality means something different to the designers and the manufacturers. Designers eq
Events Calendar | Wed Apr 14 00:00:00 EDT 2021 - Wed Apr 14 00:00:00 EDT 2021 | ,
Puget Sound Webinar: PCB Design, Fabrication, and Assembly DFM Webinar
Events Calendar | Thu Sep 17 00:00:00 EDT 2020 - Thu Sep 17 00:00:00 EDT 2020 | ,
DFM Panel Discussion for PCB Design, Fabrication, and Assembly
Career Center | Dallas, Texas USA | Engineering
Skills/Requirements: 8 years of mechanical design in the areas of moving components, gears, bearings, and electro/mechanical parts. Electronic packaging, can come from the toy industry, copiers, or printers. Duties/Functions: Will work closely with
SMT Express, Volume 3, Issue No. 10 - from SMTnet.com Volume 3, Issue No. 10 Thursday, October 18, 2001 Featured Article Return to Front Page Book Review Reviewed by Dave Fish (davef ), Pandion Electronics, Inc. Title: SMT High Density
