Industry Directory | Manufacturer
Semiconductor mfg. services. Precision dicing of hard brittle materials.
Manufacture and distribute dicing blades & dicing accessories.
The Laser Microjet is a technology that couples a laser beam into a thin water jet. The water jet is then used as a fiber optic wave guide to direct the beam to the wafer to be cut. The wafer is moved in the X and Y axis under computer control with p
APD DEVELOPS creative solutions to challenging micro machining problems, using precision diamond dicing blades and lasers to cut and machine a variety of hard brittle materials.
Electronics Forum | Thu Jun 22 11:36:59 EDT 2000 | Andreas Albrecht
Dear Folks, could anyone give me an advice who supplies dicing blades (2 or 4") for cutting blended, through hole plated PCBs (1-3 mm thickness). Who has made good experiences (tool life, duration) with which blades? Are there any good application i
Electronics Forum | Mon Oct 19 15:37:12 EDT 1998 | Manish
Hello everybody This is kind of urgent for me. I would appreciate if anyone of you could tell me where could i find information about the different dicing techniques and operations used in the industry. I need information about the following: 1
Used SMT Equipment | Semiconductor & Solar
we are looking for DISCO DFD6340 Dicing Saw , if you can supply, pls free contact us
Used SMT Equipment | Other Equipment
HI, WE HAVE DISCO DFL-7340 LASER DICING SAW FOR SALE VINTAGE 2009~2012 PLEASE CONTACT FOR MORE INFOMATION
Industry News | 2023-07-22 07:29:05.0
Seamless Success: The Triumph of Semiconductor Production Line Delivery. Experience the pinnacle of efficiency and innovation as our expert team ensures the flawless delivery of a cutting-edge semiconductor production line. Elevate your manufacturing capabilities, boost productivity, and achieve unparalleled results in the semiconductor industry with our successful solutions.
Industry News | 2023-07-06 15:12:25.0
Equipment from a Custom Thick Film Hybrid Micro Electronics Manufacturer Clean Room, Assembly, Test & Inspection Equipment - Owner Retiring, Everything Must Go!
Parts & Supplies | Pick and Place/Feeders
Dice 20x20x20 PUR ETHER PG20
Parts & Supplies | Repair/Rework
We are providing below ceramic chuck table products/services · New, and refurbished, porous ceramic chucks for Disco ,ADT, K&S ,Applied materials saws. · 4",6",8,",12" regular size available in round , square ,oval shape or irregular shapes and si
Technical Library | 2023-01-17 17:58:36.0
Heterogeneous integration has become an important performance enabler as high-performance computing (HPC) demands continue to rise. The focus to enable heterogeneous integration scaling is to push interconnect density limit with increased bandwidth and improved power efficiency. Many different advanced packaging architectures have been deployed to increase I/O wire / area density for higher data bandwidth requirements, and to enable more effective die disaggregation. Embedded Multi-die Interconnect Bridge (EMIB) technology is an advanced, cost-effective approach to in-package high density interconnect of heterogeneous chips, providing high density I/O, and controlled electrical interconnect paths between multiple dice in a package. In emerging architectures, it is required to scale down the EMIB die bump pitch in order to further increase the die-to-die (D2D) communication bandwidth. Aa a result, bump pitch scaling poses significant challenges in the plated solder bump reflow process, e.g., bump height / coplanarity control, solder wicking control, and bump void control. It's crucial to ensure a high-quality solder bump reflow process to meet the final product reliability requirements. In this paper, a combined formic acid based fluxless and vacuum assisted reflow process is developed for fine pitch plated solder bumping application. A high-volume production (HVM) ready tool has been developed for this process.
Technical Library | 2012-12-14 14:25:37.0
The popularity of low voltage technologies has grown significantly over the last decade as semiconductor device manufacturers have moved to satisfy market demands for more powerful products, smaller packaging, and longer battery life. By shrinking the size of the features they etch into semiconductor dice, IC manufacturers achieve lower costs, while improving speed and building in more functionality. However, this move toward smaller features has lead to lower breakdown voltages and increased opportunities for component overstress and false failures during in-circuit test.
The IDM is a single workstation sawing machine designed for speed and accuracy. It is equipped with a precision rotary tbale fitted with a precision gripper fixture, an auto conveyor width adjustment feature, plus an array of software tools to enhanc
TI New and Original THS4281DBVR in Stock SOT-23-5, 2122+ THS4281DBVR Ultra Low Power, High Speed, Rail-to-Rail I/O, Voltage Feedback Operational Amplifier Today's Hot Deals： TCD2220 QFP Dice 12+ L9301-TR HSSOP36 ST 21+ CD4093BE DIP-14 TI
Career Center | Brooklyn, New York USA | Production
Mini-Circuits designs, manufactures and distributes integrated circuits, modules, and sub-systems for high performance radio frequency (RF) and microwave applications. With design, sales and manufacturing locations in over 30 countries, Mini-Ci
Career Center | San Jose, California USA | Engineering,Research and Development
Advanced Packaging Engineer � Develop advanced packaging technologies and processes, including: wafer thinning and dicing; die attach; wire bonding; overmolding; singulation � Perform Design of Experiments to establish optimized process windows for
Career Center | Stoneham, Massachusetts | Engineering,Production,Research and Development,Technical Support
Warren P. Pumyea 8 Beacon Street Stoneham, Massachusetts 02180 Cell #: 978-821-7335 * E-mail: warren@pumyea.com http://www.pumyea.com/Process_Manufacturing_Engineer.doc Objective: Seeking a position as an engineer or related discipline whic
